Exposure apparatus, exposure method, and device manufacturing method

ABSTRACT

An exposure apparatus that exposes a substrate includes: an optical system that includes an emission surface from which an exposure light is emitted; a first surface that is disposed in at least a part of a surrounding of an optical path of the exposure light emitted from the emission surface; a second surface that is disposed in at least a part of a surrounding of the first surface and at a position lower than the first surface; a space portion into which a liquid can flow via a first aperture between the first surface and the second surface and which is opened to the atmosphere via a second aperture different from the first aperture; and a first recovery portion that recovers at least a part of the liquid flowing into the space portion. Here, the emission surface, the first surface, and the second surface are opposed to the surface of the substrate in at least a part of the exposure of the substrate, and the substrate is exposed with the exposure light from the emission surface via the liquid between the emission surface and the surface of the substrate.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a non-provisional application claiming priority toand the benefit of U.S. provisional Application Nos. 61/193,833,61/193,834, 61/193,835, and 61/193,836, filed Dec. 29, 2008, thecontents of which are incorporated herein by reference.

BACKGROUND

1. Field of the Invention

The present invention relates to an exposure apparatus, an exposuremethod, and a device manufacturing method.

2. Description of Related Art

In the processes of manufacturing a micro device such as a semiconductordevice and an electronic device, an immersion exposure apparatusexposing a substrate with an exposure light from a projection opticalsystem via a liquid between the projection optical system and thesubstrate is known, examples of which are disclosed in U.S. PatentApplication Publication Nos. 2006/0221315, 2007/0081140, and2008/0174748.

SUMMARY

In an immersion exposure apparatus, a member coming in contact with aliquid may be contaminated. For example, when a foreign material isattached to the member, defects are caused in a pattern formed on thesubstrate, thereby causing an exposure failure. As a result, a defectivedevice may be manufactured.

In the immersion exposure apparatus, for example, when the substrate ismoved at a high speed, it may be difficult to hold the liquid betweenthe projection optical system and the substrate. When the substrate ismoved at a high speed, the liquid may leak or the liquid (such as a filmor droplets) may remain on the substrate. As a result, defects may becaused in a pattern formed on the substrate, thereby causing an exposurefailure or a defective device.

A purpose of some aspects of the invention is to provide an exposureapparatus and an exposure method which can suppress an exposure failurefrom occurring. Another purpose of some aspects of the invention is toprovide a device manufacturing method which can suppress a defectivedevice from being manufactured.

According to a first aspect of the invention, there is provided anexposure apparatus that exposes a substrate, including: an opticalsystem that includes an emission surface emitting an exposure light; afirst surface that is disposed in at least a part of a surrounding of anoptical path of the exposure light emitted from the emission surface; asecond surface that is disposed in at least a part of a surrounding ofthe first surface and at a position lower than the first surface; aspace portion into which a liquid can flow via a first aperture betweenthe first surface and the second surface and which is opened to theatmosphere via a second aperture different from the first aperture; anda first recovery portion that recovers at least a part of the liquidflowing into the space portion. Here, the emission surface, the firstsurface, and the second surface are opposed to the surface of thesubstrate in at least a part of the exposure of the substrate, and thesubstrate is exposed with the exposure light from the emission surfacevia the liquid between the emission surface and the surface of thesubstrate.

According to a second aspect of the invention, there is provided anexposure apparatus that exposes a substrate, including: an opticalsystem that includes an emission surface from which an exposure light isemitted; a first surface that is disposed in at least a part of asurrounding of an optical path of the exposure light emitted from theemission surface; a second surface that is disposed in at least a partof a surrounding of the first surface; a space portion into which aliquid can flow via a first aperture between the first surface and thesecond surface and which is opened to the atmosphere via a secondaperture different from the first aperture; a top end portion thatdefines a top end of the space portion; and a first recovery portion ofwhich at least a part is disposed outside the top end portion in aradial direction about an optical axis of the optical system and whichrecovers at least a part of the liquid flowing into the space portion.Here, the emission surface, the first surface, and the second surfaceare opposed to the surface of the substrate in at least a part of theexposure of the substrate, and the substrate is exposed with theexposure light from the emission surface via the liquid between theemission surface and the surface of the substrate.

According to a third aspect of the invention, there is provided anexposure apparatus that exposes a substrate, including: an opticalsystem that includes an emission surface from which an exposure light isemitted; a space portion into which a liquid can flow via a firstaperture disposed in at least a part of a surrounding of an optical pathof the exposure light and which is opened to the atmosphere via a secondaperture different from the first aperture; and a first recovery portionthat recovers the liquid from the space portion. Here, the firstrecovery portion includes a reservoir portion collecting the liquid fromthe space portion so as not to return to the space portion, at least apart of the liquid on the substrate is collected in the reservoirportion via the space portion from the first aperture in at least a partof the exposure of the substrate, and the substrate is exposed with theexposure light from the emission surface via the liquid between theemission surface and the surface of the substrate.

According to a fourth aspect of the invention, there is provided adevice manufacturing method including: exposing a substrate using theexposure apparatus according to any one of the first to third aspects;and developing the exposed substrate.

According to a fifth aspect of the invention, there is provided anexposure method including: opposing a first surface disposed in at leasta part of a surrounding of an optical path of an exposure light emittedfrom an emission surface of an optical system to a substrate with afirst gap interposed therebetween and holding a liquid between the firstsurface and the substrate; opposing a second surface disposed in atleast a part of a surrounding of the first surface to the substrate witha second gap smaller than the first gap; recovering at least a part ofthe liquid flowing into a space portion, which is opened to theatmosphere via a second aperture different from a first aperture, fromthe first aperture between the first surface and the second surface; andexposing the substrate with the exposure light from the emission surfacevia the liquid between the emission surface and the substrate.

According to a sixth aspect of the invention, there is provided anexposure method including: opposing a first surface disposed in at leasta part of a surrounding of an optical path of an exposure light emittedfrom an emission surface of an optical system to a substrate with afirst gap interposed therebetween and holding a liquid between the firstsurface and the substrate; opposing a second surface disposed in atleast a part of a surrounding of the first surface to the substrate;recovering at least a part of the liquid flowing into a space portion,which is opened to the atmosphere via a second aperture different from afirst aperture, from the first aperture between the first surface andthe second surface outside a top end of the space portion in the radialdirection about the optical axis of the optical system; and exposing thesubstrate with the exposure light from the emission surface via theliquid between the emission surface and the substrate.

According to a seventh aspect of the invention, there is provided anexposure method including: filling an optical path of an exposure lightbetween an emission surface of an optical system and a substrate with aliquid; exposing the substrate with the exposure light from the emissionsurface via the liquid between the emission surface and the substrate;and recovering at least a part of the liquid on the substrate from afirst aperture disposed in at least a part of a surrounding of theoptical path via a space portion opened to the atmosphere via a secondaperture different from the first aperture. Here, the recovering of atleast a part of the liquid includes collecting the liquid from the spaceportion in a reservoir portion so that the recovered liquid does notreturn to the space portion.

According to an eighth aspect of the invention, there is provided adevice manufacturing method including: exposing a substrate using theexposure method according to any one of the fifth to seventh aspects;and developing the exposed substrate.

According to a ninth aspect of the invention, there is provided anexposure apparatus that exposes a substrate, including: an opticalsystem that includes an emission surface from which an exposure light isemitted; a first surface disposed in at least a part of a surrounding ofan optical path of the exposure light emitted from the emission surface;a first recess portion that is disposed in at least a part of asurrounding of the first surface; and a first gas supply port that isdisposed in the inner surface defining the first recess portion so as tosupply a gas. Here, the surface of the substrate is opposed to theemission surface, the first surface, and the first recess portion in atleast a part of the exposure of the substrate, and the substrate isexposed with the exposure light from the emission surface via the liquidbetween the emission surface and the surface of the substrate.

According to a tenth aspect of the invention, there is provided a devicemanufacturing method including: exposing a substrate using the exposureapparatus according to the first aspect; and developing the exposedsubstrate.

According to an eleventh aspect of the invention, there is provided anexposure method including: causing a substrate to move so that anemission surface of an optical system and a first surface disposed in atleast a part of a surrounding of an optical path of an exposure lightemitted from the emission surface of the optical system are opposed tothe substrate; supplying a gas from a first gas supply port disposed inan inner surface defining a first recess portion disposed in at least apart of a surrounding of the first surface to increase a pressure of thefirst recess portion; and exposing the substrate with the exposure lightfrom the emission surface via a liquid between the emission surface andthe substrate.

According to a twelfth aspect of the invention, there is provided adevice manufacturing method including: exposing a substrate using theexposure method according to the eleventh aspect; and developing theexposed substrate.

According to a thirteenth aspect of the invention, there is provided anexposure apparatus that exposes a substrate, including: an opticalsystem that includes an emission surface emitting an exposure light; afirst surface that is disposed in at least a part of a surrounding of anoptical path of the exposure light emitted from the emission surface; asupply port which is disposed in at least a part of a surrounding of thefirst surface so as to face a space which the first surface faces andwhich supplies a liquid to the space so as to fill the optical path withthe liquid; and a recovery portion that recovers at least a part of theliquid being supplied from the supply port and flowing via a firstaperture into a space portion which a side surface of the optical systemextending to the upside from the edge of the emission surface and/or ina radial direction about an optical axis of the optical system faces.Here, the surface of the substrate disposed below the emission surfaceis opposed to the emission surface and the first surface in at least apart of the exposure of the substrate, and the substrate is exposed withthe exposure light from the emission surface via the liquid between theemission surface and the surface of the substrate.

According to a fourteenth aspect of the invention, there is provided adevice manufacturing method including: exposing a substrate using theexposure apparatus according to the first aspect; and developing theexposed substrate.

According to a fifteenth aspect of the invention, there is provided anexposure method including: causing a substrate to move so that anemission surface of an optical system and a first surface disposed in atleast a part of a surrounding of an optical path of an exposure lightemitted from the emission surface of the optical system are opposed tothe substrate; supplying a liquid to a space between the first surfaceand the substrate from a supply port disposed in at least a part of asurrounding of the first surface to face the space and filling theoptical path between the emission surface and the substrate with theliquid; recovering at least a part of the liquid being supplied from thesupply port and flowing into a space portion which a side surface of theoptical system extending to the upside from the edge of the emissionsurface and/or in a radial direction about an optical axis of theoptical system faces; and exposing the substrate with the exposure lightfrom the emission surface via the liquid between the emission surfaceand the surface of the substrate.

According to a sixteenth aspect of the invention, there is provided adevice manufacturing method including: exposing a substrate using theexposure method according to the fifteenth aspect; and developing theexposed substrate.

According to a seventeenth aspect of the invention, there is provided anexposure apparatus that exposes a substrate, including: an opticalsystem that includes an emission surface from which an exposure light isemitted; a first surface that is disposed in at least a part of asurrounding of an optical path of the exposure light emitted from theemission surface; a second surface that is disposed in at least a partof a surrounding of the first surface; a first space portion which aside surface of the optical system extending to the upside from the edgeof the emission surface and/or in a radial direction about the opticalaxis of the optical system faces; a second space portion into which aliquid can flow from a first aperture disposed between the first surfaceand the second surface and which is opened to the atmosphere via asecond aperture different from the first aperture; and a recoveryportion of which at least a part is disposed at a position opposed tothe side surface of the optical system and which recovers at least apart of the liquid flowing into the second space portion from the firstaperture via the second aperture. Here, the surface of the substrate isopposed to the emission surface, the first surface, and the secondsurface in at least a part of the exposure of the substrate, and thesubstrate is exposed with the exposure light from the emission surfacevia the liquid between the emission surface and the surface of thesubstrate.

According to an eighteenth aspect of the invention, there is provided anexposure apparatus that exposes a substrate, including: an opticalsystem that includes an emission surface emitting an exposure light; afirst surface that is disposed in at least a part of a surrounding of anoptical path of the exposure light emitted from the emission surface; asecond surface that is disposed in at least a part of a surrounding ofthe first surface; a first space portion which a side surface of theoptical system extending to the upside from the edge of the emissionsurface and/or in a radial direction about an optical axis of theoptical system faces and which is opened to the atmosphere; a secondspace portion into which a liquid can flow from a first aperturedisposed between the first surface and the second surface; and arecovery portion that recovers at least a part of the liquid flowinginto the second space portion from the first aperture via the secondaperture facing the first space portion. Here, the surface of thesubstrate is opposed to the emission surface, the first surface, and thesecond surface in at least a part of the exposure of the substrate, andthe substrate is exposed with the exposure light from the emissionsurface via the liquid between the emission surface and the surface ofthe substrate.

According to a nineteenth aspect of the invention, there is provided adevice manufacturing method including: exposing a substrate using theexposure apparatus according to any one of the seventeenth aspect andthe eighteenth aspect; and developing the exposed substrate.

According to a twentieth aspect of the invention, there is provided anexposure method including: causing a substrate to move so that anemission surface of an optical system and a first surface disposed in atleast a part of a surrounding of an optical path of an exposure lightemitted from the emission surface of the optical system are opposed tothe substrate; exposing the substrate with the exposure light from theemission surface via a liquid between the emission surface and thesurface of the substrate; and recovering at least a part of the liquidflowing into a space portion, which is opened to the atmosphere via asecond aperture different from a first aperture, from the first aperturebetween the first surface and a second surface disposed in at least apart of a surrounding of the first surface via the second aperture bythe use of a recovery portion which a side surface of the optical systemextending to the upside from the edge of the emission surface and/or ina radial direction about an optical axis of the optical system faces.

According to a twenty-first aspect of the invention, there is providedan exposure method including: causing a substrate to move so that anemission surface of an optical system and a first surface disposed in atleast a part of a surrounding of an optical path of an exposure lightemitted from the emission surface of the optical system are opposed tothe substrate; exposing the substrate with the exposure light from theemission surface via a liquid between the emission surface and thesurface of the substrate; and recovering at least a part of the liquidflowing into a second space portion, which is opened to the atmospherevia a second aperture different from a first aperture, from the firstaperture between the first surface and a second surface disposed in atleast a part of a surrounding of the first surface via the secondaperture facing a first space portion which a side surface of theoptical system extending to the upside from the edge of the emissionsurface and/or in a radial direction about an optical axis of theoptical system faces.

According to a twenty-second aspect of the invention, there is provideda device manufacturing method including: exposing a substrate using theexposure method according to any one of the twentieth aspect and thetwenty-first aspect; and developing the exposed substrate.

According to the above-mentioned aspects of the invention, it ispossible to suppress an exposure failure from occurring. According tothe aspects of the invention, it is possible to suppress a defectivedevice from being manufactured.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram schematically illustrating a configuration of anexposure apparatus according to a first embodiment of the invention.

FIG. 2 is a partially enlarged view of the exposure apparatus accordingto the first embodiment of the invention.

FIG. 3 is a top view of an immersion member according to the firstembodiment as viewed from the upside.

FIG. 4 is a diagram illustrating the vicinity of the immersion memberaccording to the first embodiment of the invention.

FIG. 5A is a diagram illustrating the vicinity of a first recoveryportion according to the first embodiment of the invention.

FIG. 5B is a diagram illustrating the vicinity of a first recoveryportion according to the first embodiment of the invention.

FIG. 6 is a diagram illustrating the vicinity of an immersion memberaccording to a second embodiment of the invention.

FIG. 7 is a diagram illustrating the vicinity of an immersion memberaccording to a third embodiment of the invention.

FIG. 8 is a diagram illustrating the vicinity of an immersion memberaccording to a fourth embodiment of the invention.

FIG. 9 is a diagram illustrating the vicinity of an immersion memberaccording to a fifth embodiment of the invention.

FIG. 10 is a diagram illustrating the vicinity of an immersion memberaccording to a sixth embodiment of the invention.

FIG. 11 is a diagram illustrating the vicinity of an immersion memberaccording to a seventh embodiment of the invention.

FIG. 12 is a diagram illustrating the vicinity of an immersion memberaccording to an eighth embodiment of the invention.

FIG. 13 is a diagram illustrating the vicinity of an immersion memberaccording to a ninth embodiment of the invention.

FIG. 14 is a diagram schematically illustrating a configuration of anexposure apparatus according to a tenth embodiment of the invention.

FIG. 15 is a partially enlarged view of the exposure apparatus accordingto the tenth embodiment of the invention.

FIG. 16 is a top view of an immersion member according to the tenthembodiment as viewed from the upside.

FIG. 17 is a diagram illustrating the vicinity of the immersion memberaccording to the tenth embodiment of the invention.

FIG. 18A is a diagram illustrating the vicinity of a recovery portionaccording to the tenth embodiment of the invention.

FIG. 18B is a diagram illustrating the vicinity of a recovery portionaccording to the tenth embodiment of the invention.

FIG. 19 is a diagram illustrating the vicinity of an immersion memberaccording to an eleventh embodiment of the invention.

FIG. 20 is a diagram illustrating the vicinity of an immersion memberaccording to a twelfth embodiment of the invention.

FIG. 21 is a diagram schematically illustrating a configuration of anexposure apparatus according to a thirteenth embodiment of theinvention.

FIG. 22 is a partially enlarged view of the exposure apparatus accordingto the thirteenth embodiment of the invention.

FIG. 23 is a top view of an immersion member according to the thirteenthembodiment as viewed from the upside.

FIG. 24 is a diagram illustrating the vicinity of the immersion memberaccording to the thirteenth embodiment of the invention.

FIG. 25 is a diagram schematically illustrating a configuration of anexposure apparatus according to a fourteenth embodiment of theinvention.

FIG. 26 is a diagram illustrating the vicinity of an immersion memberaccording to a fourteenth embodiment of the invention.

FIG. 27 is a diagram illustrating the vicinity of an immersion memberaccording to a fifteenth embodiment of the invention.

FIG. 28 is a flowchart illustrating an example of a process ofmanufacturing a micro device.

DESCRIPTION OF EMBODIMENTS

Hereinafter, embodiments of the invention will be described withreference to the accompanying drawings, but the invention is not limitedto the embodiments. In the following description, an XYZ orthogonalcoordinate system is established and positional relations of theelements are described on the basis of the XYZ orthogonal coordinatesystem. It is assumed that a predetermined direction in a horizontalplane is an X axis direction, a direction perpendicular to the X axisdirection in the horizontal plane is a Y axis direction, and a direction(that is, a vertical direction) perpendicular to the X axis directionand the Y axis direction is a Z axis direction. It is also assumed thatrotational (tilting) directions about the X, Y, and Z axes are θX, θY,and θZ directions, respectively.

First Embodiment

A first embodiment of the invention will be described. FIG. 1 is adiagram schematically illustrating a configuration of an exposureapparatus EX according to the first embodiment of the invention. Theexposure apparatus EX according to this embodiment is an immersionexposure apparatus exposing a substrate P with an exposure light(exposure light beam) EL via a liquid LQ. In this embodiment, water(pure water) is used as the liquid LQ.

In FIG. 1, the exposure apparatus EX includes a mask stage 1 which canmove with a mask M held thereon, a substrate stage 2 which can move witha substrate P held thereon, an interferometer system 3 opticallymeasuring positions of the mask stage 1 and the substrate stage 2, anillumination system IL illuminating the mask M with an exposure lightEL, a projection optical system PL projecting an image of a pattern ofthe mask M illuminated with the exposure light EL onto the substrate P,an immersion member 4 forming an immersion space LS so as to fill atleast a part of an optical path of the exposure light EL with the liquidLQ, a chamber 5 receiving at least the projection optical system PL, abody 6 supporting at least the projection optical system PL, and acontrol apparatus 7 controlling the entire operations of the exposureapparatus EX.

The mask M includes a reticle in which a device pattern to be projectedonto the substrate P is formed. The mask M employs a transmissive maskhaving a transparent plate such as a glass plate and a pattern formed onthe transparent plate using a light-shielding material such as chromium.A reflective mask may be employed as the mask M.

The substrate P is a substrate used to manufacture a device. Thesubstrate P includes a base member such as a semiconductor wafer and amulti-layered film formed on the base member. The multi-layered film isa film in which plural films including at least a photosensitive filmare laminated. The photosensitive film is a film formed of aphotosensitive material. The multi-layered film may include, forexample, an antireflection film and a protective film (top-coated film)protecting the photosensitive film.

The chamber 5 includes a chamber member 5A forming an internal space 8substantially closed and an environment controller 5B controllingenvironments (such as temperature, humidity, cleanness, and pressure) ofthe internal space 8. The body 6 is disposed in the internal space 8.The body 6 includes a first column 9 disposed on a support floor FL anda second column 10 disposed on the first column 9. The first column 9includes a first support member 11 and a first plate 13 supported on thefirst support member 11 with an antivibration device 12 interposedtherebetween. The second column 10 includes a second support member 14disposed on the first plate 13 and a second plate 16 supported on thesecond support member 14 with an antivibration device 15 interposedtherebetween. In this embodiment, a third plate 18 is disposed on thesupport floor FL with an antivibration device 17 interposedtherebetween.

The illumination system IL illuminates a predetermined illuminatingregion IR with the exposure light EL. The illuminating region IRincludes a position which can be illuminated with the exposure light ELemitted from the illumination system IL. The illumination system ILilluminates at least a part of the mask M disposed in the illuminatingregion IR with the exposure light EL with a uniform luminancedistribution. A deep ultraviolet light beam (DUV light beam) such asbright rays (g ray, h-ray, i-ray) emitted from a mercury lamp and a KrFexcimer laser beam (with a wavelength of 248 nm) and a vacuumultraviolet light beam (VUV light beam) such as an ArF excimer laserbeam (with a wavelength of 193 nm) and an F₂ laser beam (with awavelength of 157 nm) are used as the exposure light EL emitted from theillumination system IL. In this embodiment, the ArF excimer laser beamwhich is an ultraviolet light beam (vacuum ultraviolet light beam) isused as the exposure light EL.

The mask stage 1 includes a mask holder 19 releasably holding the mask Mand which can move on a guide surface 16G of the second plate 16 withthe mask M held thereon. The mask stage 1 can move relative to theillumination region IR by activating a driving system 20 with the mask Mheld thereon. The driving system 20 includes a planar motor having amovable member 20A disposed on the mask stage 1 and a fixed member 20Bdisposed on the second plate 16. The planar motor allowing the maskstage 1 to move is disclosed, for example, in U.S. Pat. No. 6,452,292.The mask stage 1 can move in six directions of the X axis direction, theY axis direction, the Z axis direction, the θX direction, the θYdirection, and the θZ direction by the driving system 20.

The projection optical system PL illuminates a predetermined projectionregion PR with the exposure light EL. The projection optical system PLprojects a pattern image of the mask M onto at least a part of thesubstrate P disposed in the projection region PR at a predeterminedprojection magnification. The projection optical system PL of thisembodiment is a reduced-scale system of which the projectionmagnification is, for example, ¼, ⅕, or ⅛. The projection optical systemPL may be one of an equal-scale system and an enlarging-scale system. Inthis embodiment, an optical axis AX of the projection optical system PLis parallel to the Z axis. The projection optical system PL may be oneof a refraction system not including a reflecting optical element, areflection system not including a refracting optical element, and areflection and refraction system including a reflecting optical elementand a refracting optical element. The projection optical system PL mayform one of an inverted image and an erected image.

Plural optical elements of the projection optical system PL are held ina holding member (barrel) 21. The holding member 21 includes a flange21F. The projection optical system PL is supported by the first plate 13by the flange 21F. The antivibration device may be disposed between thefirst plate 13 and the holding member 21.

The projection optical system PL includes an emission surface 23emitting the exposure light EL toward an image plane of the projectionoptical system PL. The emission surface 23 is disposed in a finaloptical element 22 closest to the image plane of the projection opticalsystem PL out of plural optical elements of the projection opticalsystem PL. The projection region PR includes a position which can beilluminated with the exposure light EL emitted from the emission surface23. In this embodiment, the emission surface 23 is directed in the −Zdirection and is parallel to the XY plane. The emission surface 23directed in the −Z direction may be a convex surface or a recesssurface.

In this embodiment, the optical axis (the optical axis in the vicinityof the image plane of the projection optical system PL) AX of the finaloptical element 22 is substantially parallel to the Z axis. The opticalaxis defined by an optical element adjacent to the final optical element22 may be considered as the optical axis of the final optical element22. In this embodiment, the image plane of the projection optical systemPL is substantially parallel to the XY plane including the X axis andthe Y axis. In this embodiment, the image plane is substantiallyhorizontal. However, the image plane may not be parallel to the XY planeand may be a curved surface.

The substrate stage 2 includes a substrate holder 24 releasably holdingthe substrate P and can move on a guide surface 18G of the third plate18. The substrate stage 2 can move relative to the projection region PRby activating a driving system 25 with the substrate P held thereon. Thedriving system 25 includes a planar motor having a movable member 25Adisposed on the substrate stage 2 and a fixed member 2513 disposed onthe third plate 18. The planar motor allowing the substrate stage 2 tomove is disclosed, for example, in U.S. Pat. No. 6,452,292. Thesubstrate stage 2 can move in six directions of the X axis direction,the Y axis direction, the Z axis direction, the θX direction, the θYdirection, and the θZ direction by the driving system 25.

The substrate stage 2 includes a surface 26 disposed around thesubstrate holder 24 and opposed to the emission surface 23. In thisembodiment, the substrate stage 2 includes a plate member holder 27disposed at least around the substrate holder 24 so as to releasablyhold the bottom surface of a plate member T, an example of which isdisclosed in US Patent Application Laid-Open Publication No.2007/0177125. In this embodiment, the top surface 26 of the substratestage 2 includes the top surface of the plate member T. The surface 26is flat.

In this embodiment, the substrate holder 24 holds the substrate P sothat the surface of the substrate P is substantially parallel to the XYplane. The plate member holder 27 holds the plate member T so that thesurface 26 of the plate member T is substantially parallel to the XYplane.

The interferometer system 3 includes a first interferometer unit 3Aoptically measuring the position of the mask stage 1 (mask M) in the XYplane and a second interferometer unit 3B optical measuring the positionof the substrate stage 2 (substrate P) in the XY plane. At the time ofperforming an exposure process on the substrate P or at the time ofperforming a predetermined measurement process, the control apparatus 7activates the driving systems 20 and 25 on the basis of the measurementresult of the interferometer system 3 and controls the positions of themask stage 1 (mask M) and the substrate stage 2 (substrate P).

The immersion member 4 is disposed at least in a part of a surroundingof an optical path of the exposure light EL so that the optical path ofthe exposure light EL emitted from the emission surface 23 is filledwith the liquid LQ. The immersion member 4 forms an immersion space LSso that the optical path of the exposure light EL between the emissionsurface 23 and an object disposed at a position opposed to the emissionsurface 23 is filled with the liquid LQ. The immersion space LS is apart (space, region) filled with the liquid LQ. In this embodiment, theobject includes at least one of the substrate stage 2 (plate member T)and the substrate P held on the substrate stage 2. During the exposureof the substrate P, the immersion member 4 forms the immersion space LSso that the optical path of the exposure light EL between the finaloptical element 22 and the substrate P is filled with the liquid LQ.

In this embodiment, the immersion member 4 includes a first member 31and a second member 32. The first member 31 and the second member 32 aredisposed in the vicinity of the final optical element 22. In thisembodiment, the first member 31 is supported by a first supportmechanism 28. The second member 32 is supported by a second supportmechanism 29. In this embodiment, the first and second supportmechanisms 28 and 29 are supported by the first plate 13. In thisembodiment, the first member 31 is suspended on the first plate 13 withthe first support mechanism 28 interposed therebetween. The secondmember 32 is suspended on the first plate 13 with the second supportmechanism 29 interposed therebetween.

The exposure apparatus EX according to this embodiment is a scanningexposure apparatus (so-called scanning stepper) projecting the patternimage of the mask M onto the substrate P while causing the mask M andthe substrate P to synchronously move in a predetermined scanningdirection. At the time of exposing the substrate P, the controlapparatus 7 controls the mask stage 1 and the substrate stage 2 so thatthe mask M and the substrate P move in the predetermined scanningdirection in the XY plane intersecting the optical axis AX (the opticalpath of the exposure light EL). In this embodiment, the scanningdirection (synchronous moving direction) of the substrate P is the Yaxis direction and the scanning direction (synchronous moving direction)of the mask M is the Y axis direction. The control apparatus 7illuminates the substrate P with the exposure light EL through theprojection optical system PL and the liquid LQ in the immersion space LSon the substrate P, while causing the substrate P to move in the Y axisdirection relative to the projection region PR of the projection opticalsystem PL and causing the mask M to move in the Y axis directionrelative to the illumination region IR of the illumination system IL insynchronization with the movement of the substrate P in the Y axisdirection. Accordingly, the pattern image of the mask M is projectedonto the substrate P and the substrate P is exposed with the exposurelight EL.

FIG. 2 is a side sectional view of the vicinity of the immersion member4, FIG. 3 is a top view of the immersion member 4, and FIG. 4 is apartially enlarged view of FIG. 2.

As shown in FIGS. 2, 3, and 4, in this embodiment, the first member 31and the second member 32 are annular members. At least a part of thefirst member 31 is disposed in the vicinity of a partial optical path ofthe exposure light EL and the final optical element 22. At least a partof the second member 23 is disposed in the vicinity of the first member31. As shown in FIG. 3, in this embodiment, the outer shapes of thefirst member 31 and the second member 32 in the XY plane are circular.The outer shapes of the first member 31 and the second member 32 may beother shapes (for example, rectangular).

The immersion member 4 includes a first surface 41 disposed in at leasta part of a surrounding of the optical path of the exposure light ELemitted from the emission surface 23, a second surface 42 disposed lowerthan (in the −Z side of) the first surface 41 and in at least a part ofa surrounding of the first surface 41, a space portion 80 into which theliquid LQ can flow through a first aperture 33 between the first surface41 and the second surface 42 and which is opened to the atmospherethrough a second aperture 34 different from the first aperture 33, and afirst recovery portion 60 recovering at least a part of the liquid LQflowing into the space portion 80. In this embodiment, the first surface41 is disposed in the first member 31. The second surface 42 is disposedin the second member 32. The first surface 41 and the second surface 42can be opposed to the surface (top surface) of the object disposed belowthe immersion member 4. In this embodiment, the outer shapes of thefirst surface 41 and the second surface 42 in the XY plane are circular.The inner edge of the second surface 42 in the XY plane has a circularshape.

In this embodiment, the first surface 41 and the second surface 42cannot recover the liquid LQ. That is, in this embodiment, the firstsurface 41 and the second surface 42 are not provided with a liquidrecovery port. In this embodiment, the first surface 41 and the secondsurface 42 are flat. A first space 51 between the first surface 41 andthe surface (top surface) of the object can hold the liquid LQ. In thisembodiment, the first surface 41 and the second surface 42 are parallelto the XY plane (horizontal plane), but at least a part of the firstsurface 41 and/or the second surface 42 may be tilted about the XY planeor at least one of the first surface 41 and the second surface 42 maynot be parallel to each other. In this embodiment, the first surface 41and the second surface 42 may include a curved surface.

In at least a part of the exposure of the substrate P, the emissionsurface 23, the first surface 41, and the second surface 42 are opposedto the surface of the substrate P. In at least a part of the exposure ofthe substrate P, the liquid LQ is filled in the space between theemission surface 23 and the surface of the substrate P. In at least apart of the exposure of the substrate P, the liquid LQ is held in thefirst space 51 between the first surface 41 and the surface of thesubstrate P. The substrate P is exposed with the exposure light EL fromthe emission surface 23 through the liquid LQ between the emissionsurface 23 and the surface of the substrate P.

In this embodiment, a part of the immersion space LS is formed by theliquid LQ held between the first surface 41 and the object. In thisembodiment, the immersion space LS is formed so that a partial region ofthe surface of the substrate P including the projection region PR iscovered with the liquid LQ when the substrate P is being illuminatedwith the exposure light EL. A gas-liquid interface (meniscus, edge) LG1of the liquid LQ in the immersion space LS can be formed between atleast one of the first surface 41 and the second surface 42 and thesurface of the substrate P, but is preferably formed between the inneredge of the second surface 42 and the substrate P. The exposureapparatus EX according to this embodiment employs a local immersionmethod.

For the purpose of convenient explanation, it is assumed that thesubstrate P is disposed at a position opposed to the emission surface23, the first surface 41, and the second surface 42 and the liquid LQ isheld between the immersion member 4 and the substrate P to form theimmersion space LS. As described above, the immersion space LS can beformed between the emission surface 23 and the immersion member 4 andanother member (such as the plate member T of the substrate stage 2).

As described above, in this embodiment, the first surface 41 and thesecond surface 42 are substantially parallel to the XY plane. As shownin FIG. 4, the first surface 41 is opposed to the surface of thesubstrate P with a first gap G1 interposed therebetween and the secondsurface 42 is opposed thereto with a second gap G2 interposedtherebetween. The second gap G2 is smaller than the first gap G1.

In this embodiment, the first member 31 includes a first surface 41opposed to the surface of the substrate P, a third surface 43 opposed toat least a part of the emission surface 23 and directed in the oppositedirection of the first surface 41, a fourth surface 44 disposed aroundthe third surface 43 and opposed to the side surface 35 of the finaloptical element 22, and a fifth surface 45 disposed around the fourthsurface 44 and opposed to the outer surface 36 of the holding member 21.The first member 31 includes a plate portion 37 of which at least a partis opposed to the emission surface 23 and a body portion 38 of which atleast a part is disposed around the final optical element 22. The firstsurface 41 and the third surface 43 are disposed in the plate portion37. The fourth surface 44 and the fifth surface 45 are disposed in thebody portion 38. The plate portion 37 has an aperture 39 through whichthe exposure light EL emitted from the emission surface 23 can pass.During the exposure of the substrate P, the exposure light EL emittedfrom the emission surface 23 is applied to the surface of the substrateP via the aperture 39. As shown in FIG. 3, in this embodiment, theaperture 39 is longitudinal in the X axis direction intersecting thescanning direction (the Y axis direction) of the substrate P.

The third surface 43 is opposed to the emission surface 23 with a thirdgap G3 interposed therebetween. The fourth surface 44 is opposed to theside surface 35 with a fourth gap G4 interposed therebetween. The fifthsurface 45 is opposed to the outer surface 36 with a fifth gap G5interposed therebetween.

The side surface 35 of the final optical element 22 is a surface whichis different from the emission surface 23 and through which the exposurelight EL does not pass. The side surface 35 is disposed around theemission surface 23. The side surface 35 extends upward (in the +Zdirection) from the edge of the emission surface 23. The side surface 35extends in the radial direction (in the direction perpendicular to theoptical axis AX) of the optical axis AX from the edge of the emissionsurface 23. That is, the side surface 35 is tilted to extend in theradial direction about the optical axis AX and to the upside.

In this embodiment, the third surface 43 and the emission surface 23 aresubstantially parallel to each other. The fourth surface 44 and the sidesurface 35 are substantially parallel to each other. The fifth surface45 and the outer surface 36 are substantially parallel to each other.The third surface 43 and the emission surface 23 may not be parallel toeach other. The fourth surface 44 and the side surface 35 may not beparallel to each other. The fifth surface 45 and the outer surface 36may not be parallel to each other.

The space between the final optical element 22 and the holding member21, and the first member 31 includes a third space 53 defined by theemission surface 23 and the third surface 43, a fourth space 54 definedby the side surface 35 and the fourth surface 44, and a fifth space 55defined by the outer surface 36 and the fifth surface 45. The fourthspace 54 is a space tilted to extend in the radial direction about theoptical axis AX, in the direction getting apart from the image plane ofthe projection optical system PL, and in the +Z direction. The fifthspace 55 is a space to extend in the radial direction about the opticalaxis AX (in the direction perpendicular to the optical axis AX).

In this embodiment, the fourth surface 44 is opposed to the side surface35 of the final optical element 22, but at least a part of the fourthsurface 44 may be opposed to the outer surface of the holding member 21.In this embodiment, the fifth surface 45 is opposed to the outer surface36 of the holding member 21, but at least a part of the fifth surface 45may be opposed to the bottom surface of the final optical element 22when the bottom surface of the final optical element 22 is exposed fromthe vicinity of the side surface 35 of the final optical element 22.

The fourth space 54 may be parallel to the optical axis AX. The fifthspace 55 may not be perpendicular to the optical axis AX.

The first member 31 includes a sixth surface 46 disposed around thefirst surface 41 and a seventh surface 47 disposed around the sixthsurface 46. The sixth surface 46 and the seventh surface 47 are disposedin the body portion 38. In this embodiment, the fourth surface 44 andthe sixth surface 46 are substantially parallel to each other. The fifthsurface 45 and the seventh surface 47 are substantially parallel to eachother. The fourth surface 44 and the sixth surface 46 may not beparallel to each other. The fifth surface 45 and the seventh surface 47may not be parallel to each other.

In this embodiment, the second member 32 includes a second surface 42opposed to the surface of the substrate P, an eighth surface 48 opposedto the sixth surface 46, and a ninth surface 49 opposed to the seventhsurface 47.

The eighth surface 48 is opposed to the sixth surface 46 with a sixthgap G6 interposed therebetween. The ninth surface 49 is opposed to theseventh surface 47 with a seventh gap G7 interposed therebetween. Inthis embodiment, the eighth surface 48 and the sixth surface 46 aresubstantially parallel to each other. The ninth surface 49 and theseventh surface 47 are substantially parallel to each other. The eighthsurface 48 and the sixth surface 46 may not be parallel to each other.The ninth surface 49 and the seventh surface 47 may not be parallel toeach other.

The space between the first member 31 and the second member 32 includesa sixth space 56 defined by the sixth surface 46 and the eighth surface48 and a seventh space 57 defined by the seventh surface 47 and theninth surface 49. The sixth space 56 is a space tilted to extend in thedirection (in the +Z direction) getting apart from the image plane ofthe projection optical system PL in the radial direction of the opticalaxis AX. The seventh space 57 is a space extending in the radialdirection about the optical axis AX (in the direction perpendicular tothe optical axis AX). The sixth space 56 may be parallel to the opticalaxis AX. The seventh space 57 may not be perpendicular to the opticalaxis AX.

In this embodiment, the space portion 80 includes the sixth space 56.The bottom end of the space portion 80 (the sixth space 56) make afluidic communication with the first space 51 and the second space 52.The top end of the space portion 80 makes a fluidic communication withthe seventh space 57. In this embodiment, a first aperture 33 isdisposed at the bottom end of the space portion 80 and a second aperture34 is disposed at the top end of the space portion 80. In thisembodiment, the bottom end portion 48B of the eighth surface 48 definesthe bottom end of the space portion 80. The top end portion 48T of theeighth surface 48 defines the top end of the space portion 80.

In at least a part of the exposure of the substrate P, the firstaperture 33 is opposed to the surface of the substrate P. At least apart of the liquid LQ on the substrate P can be made to flow in thespace portion 80 via the first aperture 33. In this embodiment, thefirst aperture 33 is substantially flush with the first surface 41. Thefirst aperture 33 may not be directed to the downside (in the −Zdirection). For example, the first aperture 33 may be disposed in atwelfth surface 79 to be described later. The first aperture 33 may beformed in an annular shape by an aperture or may be formed by pluralapertures arranged in an annular shape with a predetermined gap.Similarly, the space portion 80 may be formed by plural space portionsarranged in an annular shape with a predetermined gap around the opticalaxis AX.

The first recovery portion 60 recovers the liquid LQ from the spaceportion 80. The first recovery portion 60 recovers the liquid LQoverflowing from the space portion 80. At least a part of the firstrecovery portion 60 is disposed outside the top end portion 48T in theradial direction about the optical axis AX.

In this embodiment, the first recovery portion 60 includes a firstrecess portion 61 disposed to the upside (in the +Z direction) outsidethe space portion 80 in the radial direction about the optical axis AX.The first recess portion 61 includes an opening 61K directed to theupside. The first recovery portion 60 recovers the liquid LQ flowinginto the first recess portion 61 via the opening 61K.

The first recess portion 61 is disposed outside the top end portion 48Tin the radial direction about the optical axis AX. In this embodiment,the first recess portion 61 is disposed around the ninth surface 49. Inthe XY plane, the first recess portion 61 has an annular shape. Thefirst recess portion 61 may be formed by plural recess portions arrangedin an annular shape with a predetermined gap. In this embodiment, thesecond member 32 includes a tenth surface 70 disposed around the firstrecess portion 61. The tenth surface 70 is substantially parallel to theXY plane. In this embodiment, the tenth surface 70 is flush with theninth surface 49. The tenth surface 70 may be disposed higher than theninth surface 49 (in the +Z direction).

The first recess portion 61 includes a first inner surface 611 connectedto the ninth surface 49, a second inner surface 612 connected to thetenth surface 70 and opposed to the first inner surface 611, and abottom surface 613 disposed between the first inner surface 611 and thesecond inner surface 612. The bottom surface 613 is directed to theupside (in the +Z direction). The bottom surface 613 is disposed lowerthan the top end portion 48T (in the −Z direction). In this embodiment,the bottom surface 613 is substantially parallel to the XY plane. Thebottom surface 613 may not be parallel to the XY plane. For example, thebottom surface 613 may be tilted about the XY plane. The bottom surface613 may include a curved surface.

The first recovery portion 60 includes a liquid guide portion 81 guidingthe liquid LQ from the space portion 80 to the first recess portion 61.In this embodiment, the liquid guide portion 81 includes the ninthsurface 49. In this embodiment, the liquid guide portion 81 includes theseventh space 57. The liquid guide portion 81 extends in the radialdirection about the optical axis AX from the top end portion 48T. Inthis embodiment, the liquid guide portion 81 is perpendicular to theoptical axis AX (parallel to the XY plane), but may not be perpendicularto the optical axis AX. For example, the ninth surface 49 may be tiltedto the downside from the top end portion 48T.

The first recess portion 61 is disposed outside the liquid guide portion81 in the radial direction about the optical axis AX from the top endportion 48T. The liquid LQ overflowing from the top end of the spaceportion 80 is guided by the liquid guide portion 81 and flows in thefirst recess portion 61.

The first recess portion 61 can gather the liquid LQ from the spaceportion 80. The first recess portion 61 suppresses the liquid LQ fromthe space portion 80 from returning to the space portion 80, bycollecting the flowing liquid LQ. That is, the first recess portion 61at least serves as a part of a reservoir portion collecting the liquidLQ from the space portion 80 so as not to return to the space portion80.

The first recovery portion 60 includes a recovery port 62 recovering theliquid LQ flowing in the first recess portion 61. The recovery port 62recovers the liquid LQ collected by the first recess portion 61.

In this embodiment, the recovery port 62 is opposed to the bottomsurface 613. In this embodiment, the recovery port 62 is disposed in thefirst recess portion 61. In other words, the recovery port 62 isdisposed lower than the opening 61K of the first recess portion 61 (inthe −Z direction).

In this embodiment, the recovery port 62 has an annular shape in the XYplane. The recovery port 62 may be divided and disposed at pluralposition around the optical axis AX.

In this embodiment, the recovery port 62 is disposed in the first member31. The first member 31 includes a convex portion 63 disposed around theseventh surface 47 to protrude downward. The recovery port 62 isdisposed at the bottom end of the convex portion 63.

A porous member 64 is disposed in the recovery port 62. The porousmember 64 is a plate-like member including plural openings or pores. Theporous member 64 may be a mesh filter which is a porous member havingplural small pores formed in mesh shapes.

In this embodiment, the outer surface of the convex portion 63 includingthe bottom surface of the porous member 64 and the inner surface of thefirst recess portion 61 including the bottom surface 613, the firstinner surface 611, and the second inner surface 612 are apart from eachother. That is, an eighth space 58 is formed between the recess portion63 and the first recess portion 61.

The first member 31 includes an eleventh surface 71 opposed to the tenthsurface 70. A ninth space 59 between the tenth surface 70 and theeleventh surface 71 is opened to the atmosphere via the third aperture72.

The space portion 80 is opened to the atmosphere via the second aperture34. The second aperture 34 is connected to the third aperture 72 via theseventh space 57, the eighth space 58, and the ninth space 59. In thisembodiment, the space portion 80 is opened to the atmosphere via thesecond aperture 34, the seventh, eighth, and ninth spaces 57, 58, and59, and the third aperture 72. That is, the space portion 80 is openedto the space around the immersion member 4 via the second aperture 34different from the first aperture 33. In other words, the space portion80 is opened to the gas space coming in contact with the interface ofthe liquid LQ in the immersion space LS via the second aperture 34.

In this embodiment, the “atmosphere” is a gas surrounding the immersionmember 4. In this embodiment, the gas surrounding the immersion member 4is a gas in the inner space 8 formed by the chamber 5. In thisembodiment, the chamber 5 fills the inner space 8 with a clean gas usingthe environment controller 5B. The chamber 5 adjusts the inner space 8substantially to the atmospheric pressure using the environmentcontroller 5B. The pressure of the inner space 8 may be set to be higherthan the atmospheric pressure.

In this embodiment, the third space 53, the fourth space 54, and thefifth space 55 are also opened to the gas space (inner space 8) aroundthe immersion member 4.

In this embodiment, the second surface 42 is lyophobic to the liquid LQ.In the second surface 42, a contact angle of the liquid LQ is equal toor greater than 90° and may be equal to or greater than 100°. In thisembodiment, the second surface 42 is formed of a film 73 which islyophobic to the liquid LQ. The film 73 is formed of, for example, alyophobic material containing fluorine. Examples of the lyophobicmaterial include PFA (Tetra Fluoro Ethylene-perfluoro alkylvinyl ethercopolymer), PTFE (Poly Tetra Fluoro Ethylene), PEEK(PolyEtherEtherKetone), and Teflon (registered trademark).

In this embodiment, the second member 32 has a twelfth surface 79connected to an inner edge of the second surface 42 and disposed to facethe optical path of the exposure light EL. The twelfth surface 79 isalso lyophobic to the liquid LQ. The twelfth surface 79 is also formedof the film 73. At least one of the second surface 42 and the twelfthsurface may not be a surface of a lyophobic film. For example, thesecond member 32 may be formed of a lyophobic material.

In this embodiment, the immersion member 4 includes an gas supply port74 disposed in at least a part of a surrounding of the first aperture33. In this embodiment, the gas supply port 74 is disposed in the secondsurface 42. The gas supply port 74 supplies a gas to the surface of theobject (substrate P) opposed to the second surface 42.

In this embodiment, the gas supply port 74 has an annular shape in theXY plane. The gas supply port 74 may be divided and arranged at pluralpositions around the optical axis AX.

In this embodiment, the immersion member 4 includes a supply port 75supplying the liquid LQ to the optical path of the exposure light EL.The supply port 75 is disposed at a position opposed to a surface of thefinal optical element 22 through which the exposure light EL does notpass. In this embodiment, the supply port 75 is disposed at the positionopposed to the side surface 35 of the final optical element 22. Thesupply port 75 may not be opposed to the surface of the final opticalelement 22. For example, the supply port 75 may be disposed in the firstmember 31 so as to face the third space 53 between the third surface 43and the emission surface 23.

As shown in FIG. 3, in this embodiment, the supply ports 75 are disposedon the +Y side and −Y side about the optical axis AX, respectively. Thesupply ports 75 may be disposed on the +X side and −X side about theoptical axis AX, respectively. The number of supply ports 75 may beequal to or greater than 3.

In this embodiment, the supply port 75 supplies the liquid LQ to thefourth space 54. The liquid LQ supplied to the fourth space 54 flowsdownward in the fourth space 54 and is supplied to the optical path ofthe exposure light EL emitted from the emission surface 23 via the thirdspace 53. At least a part of the liquid LQ supplied from the supply port75 to the third space 53 via the fourth space 54 is supplied to thefirst space 51 via the aperture 39.

As shown in FIG. 2, the supply port 75 is connected to a liquid supplydevice 76 via a supply flow channel. In this embodiment, the supply flowchannel includes a flow channel formed in the first member 31 and a flowchannel formed in the first support mechanism 28. The liquid supplydevice 76 can supply the clean liquid LQ adjusted in temperature to thesupply port 75. A part of the supply flow channel may not be disposed inthe first support mechanism 28 supporting the first member 31.

The recovery port 62 is connected to a liquid recovering device 77 via arecovery flow channel. In this embodiment, the recovery flow channelincludes a flow channel formed in the first member 31 and a flow channelformed in the first support mechanism 28. The liquid recovering device77 includes a vacuum system (such as a valve controlling a connectionstate between a vacuum source and the recovery port 62) and can suet andrecover the liquid LQ from the recovery port 62. A part of the recoveryflow channel may not be disposed in the first support mechanism 28supporting the first member 31.

The gas supply port 74 is connected to a gas supply device 78 via a gassupply channel. In this embodiment, the gas supply channel includes aflow channel formed in the second member 32 and a flow channel formed inthe second support mechanism 29. The gas supply device 78 can supply aclean gas adjusted in temperature and humidity to the gas supply port74. The humidity of the gas supplied from the gas supply port 74 ispreferably equal to or higher than the humidity of the gas supplied tothe inner space 8 by the environment controller 5B. A part of the gassupply channel may not be disposed in the second support mechanism 29supporting the second member 32.

The control apparatus 7 can control the liquid recovering device 77 tocontrol a difference in pressure between at the bottom surface and atthe top surface of the porous member 64 so that only the liquid LQpasses from the lower space (the eighth space 58) of the porous member64 to the upper space (recovery flow channel). In this embodiment, thepressure of the eighth space 58 on the lower side is opened to theatmosphere and is controlled by the chamber 5. The control apparatus 7controls the liquid recovering device 77 so that only the liquid LQpasses from the bottom surface of the porous member 64 to the topsurface thereof and adjusts the pressure on the top surface side on thebasis of the pressure on the bottom surface side. That is, the controlapparatus 7 makes a control so as to recover only the liquid LQ from theeighth space 58 via the pores of the porous member 64 and so as for thegas not to pass through the pores of the porous member 64. The techniqueof adjusting the difference in pressure between at one side and at theother side of the porous member 64 so as to pass only the liquid LQ fromone side of the porous member 64 to the other side is disclosed, forexample, in the specification of U.S. Pat. No. 7,292,313.

A method of exposing the substrate P using the exposure apparatus EXhaving the above-mentioned configuration will be described now.

First, the control apparatus 7 opposes the first surface 41 and thesecond surface 42 to the surface of the substrate P (or the top surface26 of the substrate stage 2). The first surface 41 and the surface ofthe substrate are opposed to each other with the first gap G1 interposedtherebetween and the second surface 42 and the surface of the substrateP are opposed to each other with the second gap G2 interposedtherebetween.

The control apparatus 7 sends out the liquid LQ from the liquid supplydevice 76 in the state where the first surface 41 and the second surface42 are opposed to the surface of the substrate P. The control apparatus7 activates the liquid recovering device 77. The control apparatus 7activates the gas supply device 78.

The liquid LQ sent from the liquid supply device 76 is supplied to thefourth space 54 from the supply port 75. The liquid LQ supplied to thefourth space 54 flows downward in the fourth space 54 and is thensupplied to the optical path of the exposure light EL emitted from theemission surface 23 via the third space 53. Accordingly, the opticalpath of the exposure light EL is filled with the liquid LQ.

At least a part of the liquid LQ supplied to the third space 53 from thesupply port 75 via the fourth space 54 is supplied to the first space 51via the aperture 39 and is held between the first surface 41 and thesurface of the substrate P. In this embodiment, the immersion space LSis formed so that the space surrounded with the surface of the substrateP, the first surface 41, and the twelfth surface 79 is almost filledwith the liquid LQ. The interface of the liquid LQ (the immersion spaceLS) is formed between the inner edge (the bottom end of the twelfthsurface 79) of the second surface 42 and the surface of the substrate P.

At least a part of the liquid LQ supplied to the first space 51 from theaperture 39 flows into the space portion 80 via the first aperture 31.

In this embodiment, the liquid LQ supplied to the first space 51 via theaperture 39 is suppressed from flowing into the second space 52. Thatis, in this embodiment, the interface LG1 of the liquid LQ in theimmersion space LS in the XY plane is suppressed from moving to theoutside from the twelfth surface 79, thereby suppressing the extensionof the immersion space LS.

In this embodiment, the first surface 41 is opposed to the surface ofthe substrate P with the first gap G1 interposed therebetween and thesecond surface 42 disposed around the first surface 41 is opposed to thesurface of the substrate P with the second gap G2 interposedtherebetween. The second gap G2 is smaller than the first gap G1 and is,for example, about in the range of 0.1 to 0.3 mm. Accordingly, theinterface LG1 is suppressed from moving to the outside of the firstaperture 33 in the radial direction about the optical axis AX. That is,since the second gap G2 is small, the position of the interface LG1 isheld between the inner edge of the second surface 42 and the surface ofthe substrate P due to the surface tension of the liquid LQ, as shown inFIG. 4 and the like. Accordingly, the liquid LQ in the immersion spaceLS is suppressed from flowing into the second space 52.

In this embodiment, since the second surface 42 is lyophobic to theliquid LQ, the liquid LQ is more effectively suppressed from flowinginto the second space 52. In this embodiment, since the twelfth surface79 is disposed so as to extend upward from the inner edge of the secondsurface 42 and to face the optical path, the extension of the immersionspace LS is suppressed. Since the twelfth surface 79 is lyophobic to theliquid LQ, the extension of the immersion space LS is also suppressed.

In this embodiment, the gas supply port 74 is disposed and the gas issupplied to the surface of the substrate P on the outside of the inneredge of the second surface 42 about the optical axis AX. Accordingly,the extension of the immersion space LS is suppressed by the force ofthe gas supplied from the gas supply port 74. That is, the gas supplyport 74 forms a gas seal between the surface of the substrate P and thesecond surface 42. Accordingly, the leakage of the liquid LQ issuppressed and thus the movement of the interface LG1 is restricted.

In this embodiment, the outer shape of the first surface 41 and theinner edge of the second surface 42 are circular and the outer shape ofthe immersion space LS in the XY plane is almost circular. Accordingly,the binding force acting to the center from all the sides of theinterface LG1 of the immersion space LS almost uniformly acts.Accordingly, the extension of the immersion space LS is effectivelysuppressed.

By supplying the liquid LQ from the supply port 75 in the state wherethe extension of the immersion space LS formed by the liquid LQ flowinginto the first space 51 via the aperture 39 is suppressed, the liquid LQflows into the space portion 80 opened to the atmosphere and theposition of the surface of the liquid LQ in the space portion 80 movesin the +Z direction (rises). When the space portion 80 is filled withthe liquid LQ, at least a part of the liquid LQ in the space portion 80overflows from the top end (the top end portion 48T) of the spaceportion 80. The liquid LQ overflowing from the space portion 80 isrecovered by the first recovery portion 60 disposed outside the top endof the space portion 80.

The liquid LQ overflowing from the space portion 80 is guided by theliquid guide portion 81 and then flows into the first recess portion 61.The liquid LQ flowing into the first recess portion 61 is collected inthe first recess portion 61.

FIG. 5(A) shows a state where the surface of the liquid LQ in the firstrecess portion 61 is located at a first position Z1 and FIG. 5(B) showsa state where the surface of the liquid LQ is located at a secondposition Z2. As shown in FIG. 5A, for example, in the state where thesurface of the liquid LQ is located at the first position Z1 and theliquid LQ does not come in contact with the recovery port 62 (the porousmember 64), the second aperture 34 is opened to the atmosphere via theseventh, eighth, and ninth spaces 57, 58, and 59 and the third aperture72. Accordingly, the liquid LQ in the first space 51 smoothly flows intothe space portion 80 via the first aperture 33. The liquid LQ flowinginto the space portion 80 and overflowing from the space portion 80smoothly flows into the first recess portion 61. The amount of theliquid LQ collected in the first recess portion 61 slowly increases.

As shown in FIG. 5(B), when the amount of the liquid LQ collected in thefirst recess portion 61 increases, the surface of the liquid LQ reachesthe second position Z2, and the liquid LQ comes in contact with therecovery port 62 (the porous member 64), the liquid LQ collected in thefirst recess portion 61 is recovered from the recovery port 62 (theporous member 64). When the liquid LQ is recovered from the recoveryport 62, the amount of the liquid LQ in the first recess portion 61decreases and the position of the surface of the liquid LQ in the firstrecess portion 61 moves in the −Z direction (drops). When the liquid LQflows into the first recess portion 61 from the space portion 80, theamount of the liquid LQ in the first recess portion 61 increases again,the liquid LQ comes in contact with the porous member 64, and the liquidLQ is recovered from the recovery port 62.

In this embodiment, since the difference in pressure between at thebottom surface side and at the top surface side of the porous member 64is controlled so that only the liquid LQ passes from the bottom surfaceto the top surface of the porous member 64, the first recovery portion60 can recover the liquid LQ while suppressing the vibration and thevaporization heat from being generated.

In this embodiment, since the first recovery portion 60 collects theliquid LQ on the substrate P recovered via the first aperture 33 and thespace portion 80 into the first recess portion 61, it is possible tosuppress the liquid LQ recovered via the space portion 80 from returningto the space portion 80. The first recovery portion 60 recovers theliquid LQ collected greater than a predetermined amount in the firstrecess portion 61 by the use of the recovery port 62. Accordingly, it ispossible to satisfactorily suppress the liquid LQ recovered via thespace portion 80 from returning to the space portion 80. Since theliquid LQ from the space portion 80 is collected in the first recessportion 61 so that the liquid LQ recovered via the space portion 80 doesnot return to the space portion 80, the liquid LQ coming into contactwith the porous member 64 is suppressed from returning to the firstspace 51 and the optical path of the exposure light EL via the spaceportion 80.

A method of exposing the substrate P will be described now. As describedabove, the control apparatus 7 supplies the liquid LQ from the supplyport 75 and holds the liquid LQ between the first surface 41 and thesurface of the substrate P so as to fill the optical path of theexposure light EL with the liquid LQ, thereby forming the immersionspace LS. At least a part of the liquid LQ on the substrate P flows intothe space portion 80 via the first aperture 33. The first recoveryportion 60 collects the liquid LQ from the space portion 80 in the firstrecess portion 61 and recovers the liquid LQ reaching a predeterminedamount in the first recess portion 61 by the use of the recovery port62. The control apparatus 7 performs a liquid recovering operation usingthe first recovery portion 60 along with a liquid supply operation usingthe supply port 75 and forms the immersion space LS so as to fill theoptical path of the exposure light EL with the liquid LQ. The controlapparatus 7 continuously supplies the gas from the gas supply port 74 toform the gas seal.

The control apparatus 7 collects at least a part of the liquid LQ on thesubstrate P into the first recess portion 61 via the space portion 80from the first aperture 33 and starts the exposure of the substrate Pwhile suppressing the liquid LQ recovered from the space portion 80 bythe first recovery portion 60 from returning to the space portion 80 andrestricting the extension of the immersion space LS using the second gapG2 or the like.

The control apparatus 7 controls the illumination system IL to emit theexposure light EL and illuminates the mask M with the exposure light EL.The exposure light EL from the mask M is emitted from the emissionsurface 23 of the projection optical system PL. The control apparatus 7illuminates the substrate P with the exposure light EL from the emissionsurface 23 via the liquid LQ between the emission surface 23 and thesubstrate P. Accordingly, the pattern image of the mask M is projectedto the substrate P and the substrate P is exposed with the exposurelight EL. During the exposure of the substrate P, the liquid LQ suppliedfrom the supply port 75 flows via the first aperture 33 and is recoveredby the recovery portion 60 via the space portion 80.

As described above, in this embodiment, since the space portion 80opened to the atmosphere is disposed and the liquid LQ flowing into thespace portion 80 is recovered by the first recovery portion 60, it ispossible to simplify the structure of the bottom surface of theimmersion member 4 opposed to the surface of the substrate P.Accordingly, it is possible to suppress foreign materials from beingattached to the bottom surface of the immersion member 4 coming incontact with the liquid LQ or to suppress the bottom surface from beingcontaminated.

For example, when the structure (shape) is complicated by disposing therecovery port recovering the liquid LQ in the bottom surface of theimmersion member 4 opposed to the surface of the substrate P ordisposing the porous member in the recovery port, foreign materials maybe easily attached to the bottom surface. For example, when the porousmember is disposed at a position opposed to the surface of the substrateP, the foreign materials (for example, the photosensitive film formingthe surface of the substrate P or a part of an overcoat film) generatedfrom the substrate P may be attached to the porous member. When theattached foreign materials are emitted to the optical path of theexposure light EL or are mixed into the liquid LQ in the immersion spaceLS during the exposure of the substrate P, the exposure failure such asa pattern defect caused in the substrate P may be caused. When thestructure (shape) of the bottom surface is complicated, for example,when plural recess and convex portions exist, the foreign materialsgenerated from the substrate P may be easily attached to the bottomsurface.

According to this embodiment, the space portion 80 opened to theatmosphere is disposed, the liquid LQ flowing into the space portion 80via the first aperture 33 is recovered by the first recovery portion 60disposed at the position not opposed to the surface of the substrate P,and the bottom surface of the immersion member 4 opposed to the surfaceof the substrate P has a simple structure. Accordingly, it is possibleto suppress the foreign materials from being attached to the bottomsurface of the immersion member 4. Since the structure of the bottomsurface of the immersion member 4 is simple, it is possible to smoothlyand reliably clean the bottom surface of the immersion member 4 evenwhen the foreign materials are attached to the bottom surface of theimmersion member 4.

In this embodiment, the space portion 80 (the sixth space 56) and liquidguide portion 81 (the seventh space 57) forming the flow channel throughwhich the liquid LQ flowing through the first aperture 33 flows areformed between the first member 31 and the second member 32 which can beseparated. Accordingly, it is possible to smoothly and reliably cleanthe sixth surface 46 of the first member 31 and the eighth surface 48 ofthe second member 32 forming the space portion 80 and the seventhsurface 47 of the first member 31 and the ninth surface 49 of the secondmember 32 forming the liquid guide portion 81.

In this embodiment, the first recovery portion 60 is constructed so thatthe liquid LQ recovered from the space portion 80 does not return to thespace portion 80. That is, the liquid LQ from the space portion 80 iscollected in the first recess portion 61. Accordingly, for example, whenthe porous member 64 of the first recovery portion 60 is contaminated,it is possible to suppress the liquid LQ coming into contact with theporous member 64 (the liquid LQ which might be contaminated) fromreturning (reversely flowing) to the first space 51 and the optical pathof the exposure light EL via the space portion 80. Accordingly, it ispossible to prevent the generation of the exposure failure.

When the porous member 64 is contaminated, it is possible to prevent thecontamination of the liquid LQ coming in contact with the porous member64 by replacing the contaminated porous member 64 with a new porousmember 64.

The liquid guide portion 81 (the ninth surface 49) disposed between thetop end portion 48T and the first recess portion 61 may not be disposed.That is, the first recess portion 61 may be disposed adjacent to the topend portion 48T.

Second Embodiment

A second embodiment of the invention will be described below. In thefollowing description, the elements equal or equivalent to those of theabove-mentioned embodiment are referenced by like reference numerals andsigns, and are described in brief or are not repeatedly described.

FIG. 6 is a diagram illustrating an example of an immersion member 4Baccording to the second embodiment of the invention. In FIG. 6, theimmersion member 4B includes a first member 31B having a first surface41, a second member 32 having a second surface 42, and a third member 82which is different from the first member 31B and the second member 32and which includes a recovery port 62 and a porous member 64. The thirdmember 82 can be detached from the first member 31B.

The third member 82 includes a body portion 82A and a flange portion 82Bdisposed at the top end of the body portion 82A. The body portion 82Acan be disposed in an aperture 83A disposed in the first member 31B. Theflange portion 82B is supported by a support surface 83B disposed in thefirst member 31B, whereby the position of the third member 82 relativeto the first member 31B is fixed. In the state where the flange portion82B is supported by the support surface 83B, the recovery port 62disposed at the bottom end of the third member 82 and the porous member64 disposed in the recovery port 62 are arranged inside the first recessportion 61.

For example, by pulling up the third member 82, the third member 82 canbe detached from the first member 31B. By inserting the body portion 82Aof the third member 82 into the aperture 83A from the upside of theaperture 83A and supporting the flange portion 82B on the supportsurface 83B, the third member 82 can be attached to the first member31B. The third member 82 can be easily replaced. Accordingly, forexample, when the porous member 64 is contaminated or at least a part ofthe third member 82 is contaminated, it is possible to easily replacethe third member 82 with a new one and to easily attach the contaminatedand cleaned third member 32 to the first member 31B again. Therefore, itis possible to suppress the liquid LQ coming in contact with the thirdmember 82 (the porous member 64) from being contaminated.

The detachment of the third member 82 from the first member 31B and/orthe attachment of the third member 82 to the first member 31B may becarried out in the state where the first member 31B is attached to theexposure apparatus EX (in the state where the first member is supportedby the first support mechanism 28) or may be carried out in the statewhere the first member 31B is detached from the exposure apparatus EX(in the state where the first member is released from the first supportmechanism 28).

Third Embodiment

A third embodiment of the invention will be described below. In thefollowing description, the elements equal or equivalent to those of theabove-mentioned embodiment are referenced by like reference numerals andsigns, and are described in brief or are not repeatedly described.

FIG. 7 is a diagram illustrating an example of an immersion member 4Caccording to the third embodiment of the invention. In FIG. 7, theimmersion member 4C includes a first member 31C having the first surface41 and a second member 32C having the second surface 42. A firstrecovery portion 60C includes a first recess portion 61C disposed in thesecond member 32C and a recovery port 62C recovering the liquid LQflowing into the first recess portion 61C. This embodiment is differentfrom the first and second embodiments, in that the recovery port 62C isdisposed in the first recess portion 61C but the second member 32Cincludes the recovery port 62C and a part of a recovery flow channel. Inthis embodiment, the recovery port 62C is disposed in the bottom 613C ofthe first recess portion 61C. That is, the bottom 613C of the firstrecess portion 61 includes at least a part of the recovery port 62C.

In this embodiment, a porous member 64C is disposed in the recovery port62C. The surface of the porous member 64C is disposed lower than the topend portion 48T (in the −Z direction).

In this embodiment, the liquid LQ can be reliably recovered by the firstrecovery portion 60C.

Instead of the recovery port 62C or in addition to the recovery port62C, a recovery port recovering the liquid LQ may be disposed in atleast one of a first inner surface 611C and a second inner surface 612Cof the first recess portion 61C.

Similarly to the second embodiment, the recovery port 62C (the porousmember 64C) may be held by a member other than the first member and thesecond member, thereby facilitating the attachment and detachment(replacement).

In addition to the recovery port 62 of the first and second embodiments,the recovery port 62C according to this embodiment may be furtherdisposed.

Fourth Embodiment

A fourth embodiment of the invention will be described below. The fourthembodiment is a modified example of the first embodiment. In thefollowing description, the elements equal or equivalent to those of theabove-mentioned embodiment are referenced by like reference numerals andsigns, and are described in brief or are not repeatedly described.

FIG. 8 is a diagram illustrating an example of an immersion member 4Daccording to the fourth embodiment of the invention. In FIG. 8, theimmersion member 4D includes a first member 31 having the first surface41 and a second member 32D having the second surface 42. In thisembodiment, the immersion member 4D includes a supply port 84 disposedat a position facing the first space 51 which the first surface 41 facesoutside the first aperture 33 in the radial direction about the opticalaxis AX. The supply port 84 supplies the liquid LQ to the optical pathof the exposure light EL. In this embodiment, the supply port 84 isdisposed in the second member 32D. In this embodiment, the supply port84 is disposed in the twelfth surface 79 extending to the upside (in the+Z direction) from the inner edge of the second surface 42.

In this embodiment, it is possible to form the immersion space LSreliably.

In this embodiment, the supply port 75 and the supply port 84 are bothformed, but the supply port 75 may not be disposed.

In the second embodiment and the third embodiment, a supply portsupplying the liquid LQ may be disposed in the second member having thesecond surface 42, similarly to this embodiment.

Fifth Embodiment

A fifth embodiment of the invention will be described below. The fifthembodiment is a modified example of the first embodiment. In thefollowing description, the elements equal or equivalent to those of theabove-mentioned embodiment are referenced by like reference numerals andsigns, and are described in brief or are not repeatedly described.

FIG. 9 is a diagram illustrating an example of an immersion member 4Eaccording to the fifth embodiment of the invention. In FIG. 9, theimmersion member 4E includes a first member 31E having the first surface41 and a second member 32 having the second surface 42. In thisembodiment, the immersion member 4E includes a second recovery portion85 recovering the liquid LQ overflowing from the fourth space 54 whichthe side surface 35 of the final optical element 22 faces. The secondrecovery portion 85 includes a second recess portion 86 disposed in thefifth surface 45 of the first member 31E and a recovery port 87 disposedinside the second recess portion 86. A porous member 88 is disposed inthe recovery port 87. The second recovery portion 85 recovers the liquidLQ overflowing from the top end portion 44T defining the top end of thefourth space 54. A part of the fifth surface 45 between the top endportion 44T and the second recess portion 86 serves as a liquid guideportion guiding the liquid LQ overflowing from the top end portion 44Tto the second recess portion 86. A part of the fifth surface 45 may notbe formed between the top end portion 44T and the second recess portion86. The second recovery portion 85 may not include the second recessportion 86. That is, the top end of the recovery port 87 (the topsurface of the porous member 88) may be flush with the fifth surface 45.

According to this embodiment, the liquid LQ overflowing from the fourthspace 54 is suppressed from leaking to the outside of the first member31E in the radial direction about the optical axis AX. Accordingly, itis possible to suppress the occurrence of the exposure failure.

In the second to fourth embodiments, the second recovery portionrecovering the liquid LQ overflowing from the fourth space 54 may bedisposed in the first member, similarly to this embodiment.

Sixth Embodiment

A sixth embodiment of the invention will be described below. In thefollowing description, the elements equal or equivalent to those of theabove-mentioned embodiment are referenced by like reference numerals andsigns, and are described in brief or are not repeatedly described.

FIG. 10 is a diagram illustrating an example of an immersion member 4Faccording to the sixth embodiment of the invention. In FIG. 10, theimmersion member 4F includes a first member 31F having the first surface41 and a second member 32F having the second surface 42.

In this embodiment, the second aperture 34 is disposed at a positionfacing the outer surface 36 of the holding member 21. The space whichthe outer surface 36 of the holding member 21 faces is opened to theatmosphere (the inner space 8) of the immersion member 4F and the spaceportion 80 is opened to the atmosphere around the immersion member 4Fvia the second aperture 34. The fourth space 54 which the side surface35 faces is opened to the atmosphere around the immersion member 4F.

In this embodiment, a first recovery portion 60F recovering the liquidLQ from the space portion 80 includes a ninth surface 49F extending inthe radial direction about the optical axis AX from a top end portion1048T defining the top end of the space portion 80, a first recessportion 61F disposed outside the ninth surface 49F in the radialdirection about the optical axis AX, a recovery port 62F disposed insidethe first recess portion 61F, and a porous member 64F disposed in therecovery port 62F. In this embodiment, the ninth surface 49F is disposedat a position lower than the fifth surface 45F of the first member 31Fand opposed to the outer surface 36. The first recess portion 61F isdisposed lower than the ninth surface 49F.

In this embodiment, a supply port 75F is disposed in the fifth surface45F of the first member 31F opposed to the outer surface 36. The liquidLQ supplied from the supply port 75F flows in the fourth space 54 and isthen supplied to the first space 51 via the third space 53 and theaperture 39. At least a part of the liquid LQ in the first space 51flows into the space portion 80 via the first aperture 33. The liquid LQoverflowing from the space portion 80 is recovered by the first recoveryportion 60F.

In this embodiment, it is possible to reliably form the immersion spaceLS while recovering the liquid LQ from the space portion 80 so that theliquid LQ from the space portion 80 does not return to the optical pathof the exposure light EL via the spaces 53 and 54.

Even when the liquid LQ overflows from the fourth space 54, the liquidLQ can be recovered by the first recovery portion 60F.

A supply port of the liquid LQ may be disposed in the fourth surface 44Fof the first member 31F. The supply port disposed in the fourth surface44F may be opposed to the side surface 35 or may not be opposed to theside surface 35.

The ninth surface 49F of the second member 32F may be disposed at thesame height as (being flush with) the fifth surface 45F of the firstmember 31F.

As described in the second embodiment, the recovery port 62F (the porousmember 64F) may be held by a member other than the first member 31F andthe second member 32F, thereby facilitating the attachment anddetachment (replacement) thereof.

As described in the fourth embodiment, instead of the supply port 75F orin addition to the supply port 75F, the supply port of the liquid LQ maybe disposed in the twelfth surface 79F of the second member 32F.

A recovery portion recovering the liquid LQ overflowing from the fourthspace 54 may be disposed in the fifth surface 45F of the first member31F. In this way, by disposing the recovery portion of the liquid LQ inthe fifth surface 45F, it is possible to recover the liquid LQ flowingfrom the space portion 80 to the fourth space 54.

Seventh Embodiment

A seventh embodiment of the invention will be described below. In thefollowing description, the elements equal or equivalent to those of theabove-mentioned embodiment are referenced by like reference numerals andsigns, and are described in brief or are not repeatedly described.

FIG. 11 is a diagram illustrating an example of an immersion member 4Gaccording to the seventh embodiment of the invention. In FIG. 11, theimmersion member 4G includes a first member 31G having the first surface41 and a second member 32G having the second surface 42.

The immersion member 4G according to this embodiment is a modifiedexample of the immersion member 4F according to the sixth embodiment.Accordingly, the explanation described in the sixth embodiment is notrepeated. As shown in FIG. 11, the seventh embodiment is different fromthe sixth embodiment, in that the second aperture 34 is disposed to facethe side surface 35 and the supply port 75F supplying the liquid LQfaces to the third space 53 between the emission surface 23 and thethird surface 43.

In this embodiment, the liquid LQ overflowing from the space portion 80(the top end portion 1148T) is recovered by the first recovery portion60F via the ninth surface 49F.

In this embodiment, it is possible to form the immersion space LSreliably.

Eighth Embodiment

An eighth embodiment of the invention will be described below. Thisembodiment is a modified example of the first embodiment. In thefollowing description, the elements equal or equivalent to those of theabove-mentioned embodiment are referenced by like reference numerals andsigns, and are described in brief or are not repeatedly described.

FIG. 12 is a diagram illustrating an example of an immersion member 4Haccording to the eighth embodiment of the invention. In FIG. 12, theimmersion member 4H includes a first member 31 having the first surface41 and a second member 32H having the second surface 42.

In this embodiment, the immersion member 4H includes a second recessportion 90 disposed between the first aperture 33 and the second surface42. In at least a part of the exposure of the substrate P, the secondrecess portion 90 is opposed to the surface of the substrate P.

The immersion member 4H includes a gas supply port 92 which is disposedin the inner surface defining the second recess portion 90 and whichsupplies a gas to the second recess portion 90 to enhance the pressureof the second recess portion 90. In this embodiment, the inner surfaceof the second recess portion 90 includes an inner surface 91A close tothe optical axis AX and an inner surface 91B disposed outside the innersurface 91A about the optical axis AX. The gas supply port 92 isdisposed in the inner surface 91B.

Since the second recess portion 90 having a high pressure is disposedoutside the first aperture 33 in the radial direction about the opticalaxis AX, it is possible to suppress the extension of the immersion spaceLS. That is, the gas-liquid interface LG1 of the immersion space LS isformed between the bottom end of the inner surface 91A and the surfaceof the substrate P by the high-pressure space formed in the secondrecess portion 90, thereby suppressing the movement of the interface LG1to the outside. Accordingly, it is possible to suppress the leakage ofthe liquid LQ.

In the second to seventh embodiments, the second recess portion 90(high-pressure space) may be disposed between the first aperture 33 andthe second surface 42, similarly to this embodiment.

Ninth Embodiment

A ninth embodiment of the invention will be described below. In thefollowing description, the elements equal or equivalent to those of theabove-mentioned embodiment are referenced by like reference numerals andsigns, and are described in brief or are not repeatedly described.

FIG. 13 is a diagram illustrating an example of an immersion member 4Iaccording to the ninth embodiment of the invention. In FIG. 13, theimmersion member 4I includes a first member 31 having the first surface41 and a second member 32I having the second surface 42.

The immersion member 4I includes a suction port 93 which is disposedoutside the gas supply port 74 in the radial direction about the opticalaxis AX and which can suck at least one of the liquid LQ and the gas.The suction port 93 can connect a suction flow channel to a suctiondevice including a vacuum system. The control apparatus 7 performs asuction operation using the suction port 93 in at least a part of theexposure of the substrate P.

Since the suction port 93 is disposed, it is possible to suck andrecover the liquid LQ by the use of the suction port 93 even when theliquid LQ of the immersion space LS flows into the second space 52.Accordingly, it is possible to suppress the liquid LQ from flowing outof the second member 32I or to suppress the liquid LQ from remaining onthe substrate P. The suction port 93 may be not used during the exposureof the substrate P and the suction port 93 may be used only when all theliquid LQ is recovered from the first space 51 below the first surface41.

In the first to ninth embodiments, the porous member is disposed in therecovery port 62 and the like of the first recovery portion and therecovery port 87 of the second recovery portion and only the liquid LQpasses from one side to the other side of the porous member, but therecovery port may recover the liquid LQ along with the gas. The porousmember may not be disposed in the recovery port.

In the above-mentioned embodiments, the first member 31 having the firstsurface 41 and the second member 32 having the second surface 42 may berelatively movable in the direction parallel to the optical axis AXand/or perpendicular to the optical axis AX. That is, at least one ofthe first member 31 and the second member 32 may be movably supported.For example, an actuator may be disposed in the second support mechanism29 and the position of the second member 32 may be made to move with thedriving force of the actuator. The second gap G2 can be adjusted byshifting the position of the second member 32 in the Z direction.

In the above-mentioned embodiments, the gas supply port 74 may not beprovided.

In the above-mentioned embodiments, for example, when the movement ofthe interface LG1 of the liquid LQ can be suppressed by the gas from thegas supply port 74, the second surface 42 may not be disposed lower thanthe first surface 41.

In the above-mentioned embodiments, at least a part of the secondsurface 42 may not be lyophobic to the liquid LQ.

In the above-mentioned embodiments, when the space portion 80 can beopened to the atmosphere around the immersion member 4 via the secondaperture 34 different from the first aperture 33, the first surface 41,the second surface 42, the space portion 80, and the like may be formedin a single member.

In the above-mentioned embodiments, the first surface 41 may not bedisposed between the emission surface 23 and the substrate P. In thiscase, the first surface 41 may be flush with the emission surface 23 ormay be disposed higher than the emission surface 23.

In the above-mentioned embodiments, the surface of the final opticalelement 22 through which the exposure light EL does not pass may nothave the surface (side surface 35) extending upward (in the +Zdirection) from the edge of the emission surface 23. For example, thesurface of the final optical element 22 through which the exposure lightEL does not pass may extend to be substantially parallel to the emissionsurface 23 (to be perpendicular to the optical axis AX).

Tenth Embodiment

A tenth embodiment of the invention will be described below. FIG. 14 isa diagram schematically illustrating the configuration of an exposureapparatus EX according to the tenth embodiment of the invention. In thefollowing description, the elements equal or equivalent to those of theabove-mentioned embodiment are referenced by like reference numerals andsigns, and are described in brief or are not repeatedly described.

As shown in FIG. 14, in this embodiment, the immersion member 4 includesa first member 231 and a second member 232. The first member 231 and thesecond member 232 are disposed in the vicinity of the final opticalelement 22. In this embodiment, the first member 231 is supported by afirst support mechanism 28. The second member 232 is supported by asecond support mechanism 29. In this embodiment, of the first and secondsupport mechanisms 28 and 29 are supported by the first plate 13. Inthis embodiment, the first member 231 is suspended on the first plate 13with the first support mechanism 28 interposed therebetween. The secondmember 232 is suspended on the first plate 13 with the second supportmechanism 29 interposed therebetween.

FIG. 15 is a side sectional view of the vicinity of the immersion member4, FIG. 16 is a top view of the immersion member 4, and FIG. 17 is apartially enlarged view of FIG. 15.

As shown in FIGS. 15, 16, and 17, in this embodiment, the first member231 and the second member 232 are annular members. At least a part ofthe first member 231 is disposed in the vicinity of a partial opticalpath of the exposure light EL and the final optical element 22. At leasta part of the second member 232 is disposed in the vicinity of the firstmember 231. As shown in FIG. 16, in this embodiment, the outer shapes ofthe first member 231 and the second member 232 in the XY plane arecircular. The outer shapes of the first member 231 and the second member232 may be other shapes (for example, rectangular).

The immersion member 4 includes a first surface 241 disposed in at leasta part of a surrounding of the optical path of the exposure light ELemitted from the emission surface 23, a first recess portion 290disposed in at least a part of a surrounding of the first surface 241,and a first gas supply port 291 which is disposed in an inner surface292 defining the first recess portion 290 and which supplies a gas toenhance the pressure of the first recess portion 290.

In this embodiment, the immersion member 4 includes a second surface 242disposed around the first recess portion 290 to face the same side asthe first surface 241. The first surface 241 and the second surface 242are directed in the −Z direction so as to be opposed to the surface ofthe substrate P. In this embodiment, the second surface 242 is disposedlower than the first surface 241 (in the −Z direction).

In this embodiment, the outer shapes of the first surface 241 and thesecond surface 242 in the XY plane are circular. The inner edge of thesecond surface 242 in the XY plane is also circular. The shape of thefirst recess portion 290 in the XY plane is annular. Plural recessportions may be arranged around the first surface 241 with apredetermined gap as the first recess portion 290.

The immersion member 4 includes a space portion 280 into which theliquid LQ can flow from a first aperture 233 between the first surface241 and the first recess portion 290 and which is opened to theatmosphere via a second aperture 234 different from the first aperture233 and a recovery portion 260 recovering at least a part of the liquidLQ flowing into the space portion 280.

In this embodiment, the first surface 241 is disposed in the firstmember 231. The first recess portion 290 is disposed in the secondmember 232. The second surface 242 is disposed in the second member 232.The first surface 241, the first recess portion 290, and the secondsurface 242 can be opposed to the surface (top surface) of an objectdisposed below the immersion member 4.

In this embodiment, the first surface 241 and the second surface 242cannot recover the liquid LQ. That is, in this embodiment, the firstsurface 241 and the second surface 242 are not provided with a liquidrecovery port. The inner surface 292 cannot recover the liquid LQ. Inthis embodiment, the first surface 241 and the second surface 242 areflat. A first space 251 between the first surface 241 and the surface(top surface) of the object can hold the liquid LQ. In this embodiment,the first surface 241 and the second surface 242 are parallel to the XYplane (horizontal plane), but at least a part of the first surface 241and/or the second surface 242 may be tilted about the XY plane or atleast one of the first surface 241 and the second surface 242 may not beparallel to each other. In this embodiment, the first surface 241 andthe second surface 242 may include a curved surface.

In at least a part of the exposure of the substrate P, the emissionsurface 23, the first surface 241, the first recess portion 290, and thesecond surface 242 are opposed to the surface of the substrate P. In atleast a part of the exposure of the substrate P, the liquid LQ is filledin the space between the emission surface 23 and the surface of thesubstrate P. In at least a part of the exposure of the substrate P, theliquid LQ is held in the first space 251 between the first surface 241and the surface of the substrate P. The substrate P is exposed with theexposure light EL from the emission surface 23 through the liquid LQbetween the emission surface 23 and the surface of the substrate P.

In this embodiment, a part of the immersion space LS is formed by theliquid LQ held between the first surface 241 and the object. In thisembodiment, the immersion space LS is formed so that a partial region ofthe surface of the substrate P including the projection region PR iscovered with the liquid LQ when the substrate P is being illuminatedwith the exposure light EL. A gas-liquid interface (meniscus, edge) LG1of the liquid LQ in the immersion space LS can be formed between thebottom surface of the immersion member 4 opposed to the surface of thesubstrate P and the surface of the substrate P, but is preferably formedbetween a twelfth surface 279 to be described later and the substrate P.The exposure apparatus EX according to this embodiment employs a localimmersion method.

For the purpose of convenient explanation, it is assumed that thesubstrate P is disposed at a position opposed to the emission surface23, the first surface 241, the first recess portion 290, and the secondsurface 242 and the liquid LQ is held between the immersion member 4 andthe substrate P to form the immersion space LS. As described above, theimmersion space LS can be formed between the emission surface 23 and theimmersion member 4 and another member (such as the plate member T of thesubstrate stage 2).

As described above, in this embodiment, the first surface 241 and thesecond surface 242 are substantially parallel to the XY plane. As shownin FIG. 17, the first surface 241 is opposed to the surface of thesubstrate P with a first gap G1 interposed therebetween and the secondsurface 242 is opposed thereto with a second gap G2 interposedtherebetween. The second gap G2 is smaller than the first gap G1.

In this embodiment, the first member 231 includes a first surface 241opposed to the surface of the substrate P, a third surface 243 opposedto at least a part of the emission surface 23 and directed in theopposite direction of the first surface 241, a fourth surface 244disposed around the third surface 243 and opposed to the side surface 35of the final optical element 22, and a fifth surface 245 disposed aroundthe fourth surface 244 and opposed to the outer surface 36 of theholding member 21. The first member 231 includes a plate portion 237 ofwhich at least a part is opposed to the emission surface 23 and a bodyportion 238 of which at least a part is disposed around the finaloptical element 22. The first surface 241 and the third surface 243 aredisposed in the plate portion 237. The plate portion 237 has an aperture239 through which the exposure light EL emitted from the emissionsurface 23 can pass. During the exposure of the substrate P, theexposure light EL emitted from the emission surface 23 is applied to thesurface of the substrate P via the aperture 239. As shown in FIG. 16, inthis embodiment, the aperture 239 is longitudinal in the X axisdirection intersecting the scanning direction (the Y axis direction) ofthe substrate P.

The third surface 243 is opposed to the emission surface 23 with a thirdgap G3 interposed therebetween. The fourth surface 244 is opposed to theside surface 35 with a fourth gap G4 interposed therebetween. The fifthsurface 245 is opposed to the outer surface 36 with a fifth gap G5interposed therebetween.

The side surface 35 of the final optical element 22 is a surface whichis different from the emission surface 23 and through which the exposurelight EL does not pass. The side surface 35 is disposed around theemission surface 23. The side surface 35 extends to the upside (in the+Z direction) from the edge of the emission surface 23. The side surface35 extends in the radial direction (in the direction perpendicular tothe optical axis AX) of the optical axis AX from the edge of theemission surface 23. That is, the side surface 35 is tilted to extend inthe radial direction about the optical axis AX and to the upside.

The holding member 21 holds the final optical element 22. The outersurface 36 of the holding member 21 is disposed around the side surface35. The outer surface 36 extends in the radial direction about theoptical axis AX.

In this embodiment, the third surface 243 and the emission surface 23are substantially parallel to each other. The fourth surface 244 and theside surface 35 are substantially parallel to each other. The fifthsurface 245 and the outer surface 36 are substantially parallel to eachother. The third surface 243 and the emission surface 23 may not beparallel to each other. The fourth surface 244 and the side surface 35may not be parallel to each other. The fifth surface 245 and the outersurface 36 may not be parallel to each other.

The space between the final optical element 22 and the holding member21, and the first member 231 includes a third space 253 defined by theemission surface 23 and the third surface 243, a fourth space 254defined by the side surface 35 and the fourth surface 244, and a fifthspace 255 defined by the outer surface 36 and the fifth surface 245. Thefourth space 254 is a space tilted to extend in the radial directionabout the optical axis AX, in the direction getting apart from the imageplane of the projection optical system PL, and in the +Z direction. Thefifth space 255 is a space to extend in the radial direction about theoptical axis AX (in the direction perpendicular to the optical axis AX).

In this embodiment, the fourth surface 244 is opposed to the sidesurface 35 of the final optical element 22, but at least a part of thefourth surface 244 may be opposed to the outer surface of the holdingmember 21. In this embodiment, the fifth surface 245 is opposed to theouter surface 36 of the holding member 21, but at least a part of thefifth surface 245 may be opposed to the bottom surface of the finaloptical element 22 when the bottom surface of the final optical element22 is exposed from the vicinity of the side surface 35 of the finaloptical element 22.

The fourth space 254 may be parallel to the optical axis AX. The fifthspace 255 may not be perpendicular to the optical axis AX.

The first member 231 includes a sixth surface 246 disposed around thefirst surface 241 and a seventh surface 247 disposed around the sixthsurface 246. The sixth surface 246 and the seventh surface 247 aredisposed in the body portion 238. In this embodiment, the fourth surface244 and the sixth surface 246 are substantially parallel to each other.The fifth surface 245 and the seventh surface 247 are substantiallyparallel to each other. The fourth surface 244 and the sixth surface 246may not be parallel to each other. The fifth surface 245 and the seventhsurface 247 may not be parallel to each other.

In this embodiment, the second member 232 includes a second surface 242opposed to the surface of the substrate P, an eighth surface 248 opposedto the sixth surface 246, and a ninth surface 249 opposed to the seventhsurface 247.

The eighth surface 248 is opposed to the sixth surface 246 with a sixthgap G6 interposed therebetween. The ninth surface 249 is opposed to theseventh surface 247 with a seventh gap G7 interposed therebetween. Inthis embodiment, the eighth surface 248 and the sixth surface 246 aresubstantially parallel to each other. The ninth surface 249 and theseventh surface 247 are substantially parallel to each other. The eighthsurface 248 and the sixth surface 246 may not be parallel to each other.The ninth surface 249 and the seventh surface 247 may not be parallel toeach other.

The space between the first member 231 and the second member 232includes a sixth space 256 defined by the sixth surface 246 and theeighth surface 248 and a seventh space 257 defined by the seventhsurface 247 and the ninth surface 249. The sixth space 256 is a spacetilted to extend in the direction (in the +Z direction) getting apartfrom the image plane of the projection optical system PL. The seventhspace 257 is a space extending in the radial direction about the opticalaxis AX (in the direction perpendicular to the optical axis AX). Thesixth space 256 may be parallel to the optical axis AX. The seventhspace 257 may not be perpendicular to the optical axis AX.

In this embodiment, the space portion 280 includes the sixth space 256.The bottom end of the space portion 280 (the sixth space 256) make afluidic communication with the first space 251. The top end of the spaceportion 280 makes a fluidic communication with the seventh space 257. Inthis embodiment, a first aperture 233 is disposed at the bottom end ofthe space portion 280 and a second aperture 234 is disposed at the topend of the space portion 280. In this embodiment, the bottom end portion248B of the eighth surface 248 defines the bottom end of the spaceportion 280. The top end portion 248T of the eighth surface 248 definesthe top end of the space portion 280.

In at least a part of the exposure of the substrate P, the firstaperture 233 is opposed to the surface of the substrate P. At least apart of the liquid LQ on the substrate P can be made to flow in thespace portion 280 via the first aperture 233. In this embodiment, thefirst aperture 233 is substantially flush with the first surface 241.The first aperture 233 may not be directed to the downside (in the −Zdirection). The first aperture 233 may be formed in an annular shape byan aperture or may be formed by plural apertures arranged in an annularshape with a predetermined gap. Similarly, the space portion 280 may beformed by plural space portions arranged in an annular shape with apredetermined gap around the optical axis AX.

The recovery portion 260 recovers the liquid LQ from the space portion280. The recovery portion 260 recovers the liquid LQ overflowing fromthe space portion 280. At least a part of the recovery portion 260 isdisposed outside the top end portion 248T in the radial direction aboutthe optical axis AX.

In this embodiment, the recovery portion 260 includes a second recessportion 261 disposed to the upside (in the +Z direction) outside thespace portion 280 in the radial direction about the optical axis AX. Thesecond recess portion 261 includes an opening 261K directed to theupside. The recovery portion 260 recovers the liquid LQ flowing into thesecond recess portion 261 via the opening 261K.

The second recess portion 261 is disposed outside the top end portion248T in the radial direction about the optical axis AX. In thisembodiment, the second recess portion 261 is disposed around the ninthsurface 249. In the XY plane, the second recess portion 261 has anannular shape. The second recess portion 261 may be formed by pluralrecess portions arranged in an annular shape with a predetermined gap.In this embodiment, the second member 232 includes a tenth surface 270disposed around the second recess portion 261. The tenth surface 270 issubstantially parallel to the XY plane. In this embodiment, the tenthsurface 270 is flush with the ninth surface 249. The tenth surface 270may be disposed higher than the ninth surface 249 (in the +Z direction).

The second recess portion 261 includes a first inner surface 2611connected to the ninth surface 249, a second inner surface 2612connected to the tenth surface 270 and opposed to the first innersurface 2611, and a bottom surface 2613 disposed between the first innersurface 2611 and the second inner surface 2612. The bottom surface 2613is disposed lower than the top end portion 248T (in the −Z direction).In this embodiment, the bottom surface 2613 is substantially parallel tothe XY plane. The bottom surface 2613 may not be parallel to the XYplane. For example, the bottom surface 2613 may be tilted about the XYplane. The bottom surface 2613 may include a curved surface.

The recovery portion 260 includes a liquid guide portion 281 guiding theliquid LQ from the space portion 280 to the second recess portion 261.In this embodiment, the liquid guide portion 281 includes the ninthsurface 249. In this embodiment, the liquid guide portion 281 includesthe seventh space 257. The liquid guide portion 281 extends in theradial direction about the optical axis AX from the top end portion248T. In this embodiment, the liquid guide portion 281 is perpendicularto the optical axis AX (parallel to the XY plane), but may not beperpendicular to the optical axis AX. For example, the ninth surface 249may be tilted to the downside from the top end portion 248T.

The second recess portion 261 is disposed outside the liquid guideportion 281 in the radial direction about the optical axis AX from thetop end portion 248T. The liquid LQ overflowing from the top end of thespace portion 280 is guided by the liquid guide portion 281 and flows inthe second recess portion 261.

The second recess portion 261 can gather the liquid LQ from the spaceportion 280. The second recess portion 261 suppresses the liquid LQ fromthe space portion 280 from returning to the space portion 280, bycollecting the flowing liquid LQ. That is, the second recess portion 261at least serves as a part of a reservoir portion collecting the liquidLQ from the space portion 280 so as not to return to the space portion280.

The recovery portion 260 includes a recovery port 262 recovering theliquid LQ flowing in the second recess portion 261. The recovery port262 recovers the liquid LQ collected by the second recess portion 261.

In this embodiment, the recovery port 262 is opposed to the bottomsurface 2613. In this embodiment, the recovery port 262 is disposed inthe second recess portion 261. In other words, the recovery port 262 isdisposed lower than the opening 261K of the second recess portion 261(in the −Z direction).

In this embodiment, the recovery port 262 has an annular shape in the XYplane. The recovery port 262 may be divided and disposed at pluralposition around the optical axis AX.

In this embodiment, the recovery port 262 is disposed in the firstmember 231. The first member 231 includes a convex portion 263 disposedaround the seventh surface 247 to protrude downward. The recovery port262 is disposed at the bottom end of the convex portion 263.

A porous member 264 is disposed in the recovery port 262. The porousmember 264 is a plate-like member including plural openings or pores.The porous member 264 may be a mesh filter which is a porous memberhaving plural small pores formed in meshes shapes.

In this embodiment, the outer surface of the convex portion 263including the bottom surface of the porous member 264 and the innersurface of the second recess portion 261 including the bottom surface2613, the first inner surface 2611, and the second inner surface 2612are apart from each other. That is, an eighth space 258 is formedbetween the recess portion 263 and the second recess portion 261.

The first member 231 includes an eleventh surface 271 opposed to thetenth surface 270. A ninth space 259 between the tenth surface 270 andthe eleventh surface 271 is opened to the atmosphere via the thirdaperture 272.

The space portion 280 is opened to the atmosphere via the secondaperture 234. The second aperture 234 is connected to the third aperture272 via the seventh space 257, the eighth space 258, and the ninth space259. In this embodiment, the space portion 280 is opened to theatmosphere via the second aperture 234, the seventh, eighth, and ninthspaces 257, 258, and 259, and the third aperture 272. That is, the spaceportion 280 is opened to the space around the immersion member 4 via thesecond aperture 234 different from the first aperture 233. In otherwords, the space portion 280 is opened to the gas space coming incontact with the interface of the liquid LQ in the immersion space LSvia the second aperture 234.

In this embodiment, the “atmosphere” is a gas surrounding the immersionmember 4. In this embodiment, the gas surrounding the immersion member 4is a gas in the inner space 8 formed by the chamber 5. In thisembodiment, the chamber 5 fills the inner space 8 with a clean gas usingthe environment controller 5B. The chamber 5 adjusts the inner space 8substantially to the atmospheric pressure using the environmentcontroller 5B. The pressure of the inner space 8 may be set to be higherthan the atmospheric pressure.

In this embodiment, the third space 253, the fourth space 254, and thefifth space 255 are also opened to the gas space (inner space 8) aroundthe immersion member 4.

In this embodiment, the second surface 242 is lyophobic to the liquidLQ. In the second surface 242, a contact angle of the liquid LQ is equalto or greater than 90° and may be equal to or greater than 100°. In thisembodiment, the second surface 242 is formed of a film 273 which islyophobic to the liquid LQ. The film 273 is formed of, for example, alyophobic material containing fluorine. Examples of the lyophobicmaterial include PFA (Tetra Fluoro Ethylene-perfluoro alkylvinyl ethercopolymer), PTFE (Poly Tetra Fluoro Ethylene), PEEK(PolyEtherEtherKetone), and Teflon (registered trademark).

In this embodiment, the second member 232 has a twelfth surface 279disposed between the first aperture 233 and the first recess portion 290to face the same direction as the first surface 241. The twelfth surface279 is directed in the −Z direction so as to be opposed to the surfaceof the substrate P. In this embodiment, the twelfth surface 279 is aflat portion disposed substantially in the same plane as the firstsurface 241. The twelfth surface 279 may be disposed lower than thefirst surface 241. The twelfth surface 279 may be tilted about the XYplane or may include a curved surface.

The first recess portion 290 has an opening 290K directed to thedownside. The inner surface 292 defining the first recess portion 290includes a first inner surface 2921 connected to the twelfth surface279, a second inner surface 2922 of which at least a part is opposed tothe first inner surface 2921 and which is connected to the secondsurface 242, and a top surface 2923 disposed between the first innersurface 2921 and the second inner surface 2922. The top surface 2923 isdirected to the downside (the −Z direction). The top surface 2923 isdisposed higher than the bottom end portion 248B (in the +Z direction).In this embodiment, the top surface 2923 is substantially parallel tothe XY plane. The top surface 2923 may not be parallel to the XY plane.For example, the top surface 2923 may be tilted about the XY plane. Thetop surface 2923 may include a curved surface.

The first gas supply port 291 is disposed in the second inner surface2922. The first gas supply port 291 supplies a gas to the inside of thefirst recess portion 290. In this embodiment, the first gas supply port291 plural apertures arranged in the second inner surface 2922 with apredetermined gap around the optical axis AX and supplies the gas fromthe plural apertures. The first gas supply port 291 supplies the gas tothe inside of the first recess portion 290 to set the pressure of thefirst recess portion 290 to be higher than the pressure of theatmosphere (the atmospheric pressure in this embodiment).

In this embodiment, the immersion member 4 includes a second gas supplyport 274 disposed in at least a part of a surrounding of the firstrecess portion 290. In this embodiment, the second gas supply port 274is disposed in the second surface 242. The second gas supply port 274supplies a gas to the surface of the object (substrate P) opposed to thesecond surface 242.

In this embodiment, the gas supply port 274 has an annular shape in theXY plane. The gas supply port 274 may be divided and arranged at pluralpositions around the optical axis AX.

In this embodiment, the immersion member 4 includes a supply port 275supplying the liquid LQ to the optical path of the exposure light EL.The supply port 275 is disposed at a position opposed to a surface ofthe final optical element 22 through which the exposure light EL doesnot pass. In this embodiment, the supply port 275 is disposed at theposition opposed to the side surface 35 of the final optical element 22.The supply port 275 may not be opposed to the surface of the finaloptical element 22. For example, the supply port 275 may be disposed inthe first member 231 so as to face the third space 253 between the thirdsurface 243 and the emission surface 23.

As shown in FIG. 16, in this embodiment, the supply ports 275 aredisposed on the +Y side and −Y side about the optical axis AX,respectively. The supply ports 275 may be disposed on the +X side and −Xside about the optical axis AX, respectively. The number of supply ports275 may be equal to or greater than 3.

In this embodiment, the supply port 275 supplies the liquid LQ to thefourth space 254. The liquid LQ supplied to the fourth space 254 flowsdownward in the fourth space 254 and is supplied to the optical path ofthe exposure light EL emitted from the emission surface 23 via the thirdspace 253. At least a part of the liquid LQ supplied from the supplyport 275 to the third space 253 via the fourth space 254 is supplied tothe first space 251 via the aperture 239.

As shown in FIG. 15, the supply port 275 is connected to a liquid supplydevice 276 via a supply flow channel. In this embodiment, the supplyflow channel includes a flow channel formed in the first member 231 anda flow channel formed in the first support mechanism 28. The liquidsupply device 276 can supply the clean liquid LQ adjusted in temperatureto the supply port 275. A part of the supply flow channel may not bedisposed in the first support mechanism 28 supporting the first member231.

The recovery port 262 is connected to a liquid recovering device 277 viaa recovery flow channel. In this embodiment, the recovery flow channelincludes a flow channel formed in the first member 231 and a flowchannel formed in the first support mechanism 28. The liquid recoveringdevice 277 includes a vacuum system (such as a valve controlling aconnection state between a vacuum source and the recovery port 262) andcan suck and recover the liquid LQ from the recovery port 262. Byconnecting the recovery port 262 to the liquid recovering device 277including a vacuum source, the liquid LQ is recovered from the recoveryport 262. A part of the recovery flow channel may not be disposed in thefirst support mechanism 28 supporting the first member 231.

The first gas supply port 291 is connected to a gas supply device 278Avia a gas supply channel. In this embodiment, the gas supply channelincludes a flow channel formed in the second member 232 and a flowchannel formed in the second support mechanism 29. The gas supply device278A can supply a clean gas adjusted in temperature and humidity to thefirst gas supply port 291. The humidity of the gas supplied from thefirst gas supply port 291 is preferably higher than the humidity of thegas supplied to the inner space 8 by the environment controller 5B.Accordingly, it is possible to suppress the vaporization of the liquidLQ in the interface LG. A part of the gas supply channel may not bedisposed in the second support mechanism 29 supporting the second member232.

The second gas supply port 274 is connected to a gas supply device 278Bvia a gas supply channel. In this embodiment, the gas supply channelincludes a flow channel formed in the second member 232 and a flowchannel formed in the second support mechanism 29. The gas supply device278B can supply a clean gas adjusted in temperature and humidity to thesecond gas supply port 274. The humidity of the gas supplied from thesecond gas supply port 274 is preferably higher than the humidity of thegas supplied to the inner space 8 by the environment controller 5B. Apart of the gas supply channel may not be disposed in the second supportmechanism 29 supporting the second member 232.

The humidity of the gas supplied from the first gas supply port 291 ispreferably substantially equal to higher than the humidity of the gassupplied from the second supply port 292.

At least one of the humidity of the gas supplied from the first gassupply port 291 and the humidity of the gas supplied from the secondsupply port 292 may be substantially equal to the humidity of the gassupplied to the inner space 8 by the environment controller 5B.

The control apparatus 7 can control the liquid recovering device 277 tocontrol a difference in pressure between at the bottom surface and atthe top surface of the porous member 264 so that only the liquid LQpasses from the lower space (the eighth space 258) of the porous member264 to the upper space (recovery flow channel). In this embodiment, thepressure of the eighth space 258 on the lower side is opened to theatmosphere and is controlled by the chamber 5. The control apparatus 7controls the liquid recovering device 277 so that only the liquid LQpasses from the bottom surface of the porous member 264 to the topsurface thereof and adjusts the pressure on the top surface side on thebasis of the pressure on the bottom surface side. That is, the controlapparatus 7 makes a control so as to recover only the liquid LQ from theeighth space 258 via the pores of the porous member 264 and so as forthe gas not to pass through the pores of the porous member 264. Thetechnique of adjusting the difference in pressure between at one sideand at the other side of the porous member 264 so as to pass only theliquid LQ from one side of the porous member 264 to the other side isdisclosed, for example, in the specification of U.S. Pat. No. 7,292,313.

A method of exposing the substrate P using the exposure apparatus EXhaving the above-mentioned configuration will be described now.

First, the control apparatus 7 moves the substrate stage 2 holding thesubstrate P so as to oppose the emission surface 23, the first surface241, and the first recess portion 290, and the second surface 242 to thesurface of the substrate P (or the top surface 26 of the substrate stage2). The first surface 241 and the surface of the substrate P are opposedto each other with the first gap G1 interposed therebetween and thesecond surface 242 and the surface of the substrate P are opposed toeach other with the second gap G2 interposed therebetween.

The control apparatus 7 sends out the liquid LQ from the liquid supplydevice 276 in the state where the first surface 241 and the secondsurface 242 are opposed to the surface of the substrate P. The controlapparatus 7 activates the liquid recovering device 277. The controlapparatus 7 activates the gas supply devices 278A and 278B.

The liquid LQ sent from the liquid supply device 276 is supplied to thefourth space 254 from the supply port 275. The liquid LQ supplied to thefourth space 254 flows downward in the fourth space 254 and is thensupplied to the optical path of the exposure light EL emitted from theemission surface 23 via the third space 253. Accordingly, the opticalpath of the exposure light EL is filled with the liquid LQ.

At least a part of the liquid LQ supplied to the third space 253 fromthe supply port 275 via the fourth space 254 is supplied to the firstspace 251 via the aperture 239 and is held between the first surface 241and the surface of the substrate P.

At least a part of the liquid LQ supplied to the first space 251 fromthe aperture 239 flows into the space portion 280 via the first aperture231.

In this embodiment, the liquid LQ supplied to the first space 251 viathe aperture 239 is suppressed from flowing into the space outside thetwelfth surface 279 in the radial direction about the optical axis AX.That is, in this embodiment, the interface LG1 of the liquid LQ in theimmersion space LS in the XY plane is suppressed from moving to theoutside, thereby suppressing the extension of the immersion space LS.

In this embodiment, the gas is supplied to the first recess portion 290disposed around the first surface 241 from the first gas supply port 291and the pressure of the first recess portion 290 increases, whereby ahigh-pressure space is formed below the first recess portion 290. Sincethe high-pressure space is disposed around the interface LG1 of theliquid LQ held between the first surface 241 and the surface of thesubstrate P to form the immersion space LS, it is possible to suppressthe extension of the immersion space LS. That is, the movement of theinterface LG1 to the outside is restricted by the high-pressure spaceformed by the first recess portion 290. In this embodiment, the positionof the interface LG1 is held between the twelfth surface 279 and thesurface of the substrate P by the high-pressure space, as shown in FIG.17 and the like. Accordingly, it is possible to suppress the leakage ofthe liquid LQ.

In this embodiment, the second inner surface 2922 connected to the inneredge of the second surface 242 and disposed to face the optical path isprovided. The size of the second inner surface 2922 in the Z axisdirection is greater than the size of the first inner surface 2911. Thatis, the lower end of the second inner surface 2922 is disposed on the −Zside (closer to the substrate P) of the first surface 241. Accordingly,it is possible to suppress the leakage of the gas from the lower spaceof the first recess portion 290 and to hold the high-pressure spaceoutside the interface LG1 so as to suppress the leakage of the liquidLQ.

In this embodiment, the gas supply port 274 is disposed and the gas issupplied to the surface of the substrate P on the outside of the inneredge of the second surface 242 about the optical axis AX. Accordingly,the leakage of the gas from the space below the first recess portion 290by the gas supplied from the gas supply port 274. That is, the gassupply port 274 forms a gas seal between the surface of the substrate Pand the second surface 242. Accordingly, the high-pressure space can beheld below the first recess portion 290 and thus the movement of theinterface LG1 to the outside is restricted.

In this embodiment, the first surface 241 is opposed to the surface ofthe substrate P with the first gap G1 interposed therebetween and thesecond surface 242 disposed around the first surface 241 is opposed tothe surface of the substrate P with the second gap G2 interposedtherebetween. The second gap G2 is smaller than the first gap G1 and is,for example, about in the range of 0.1 to 0.3 mm. Accordingly, even whenthe liquid LQ leaks out of the space below the twelfth surface 279, theliquid LQ is suppressed from flowing out of the first recess portion290.

In this embodiment, since the second surface 242 is lyophobic to theliquid LQ, the liquid LQ is suppressed from leaking.

In this embodiment, the shape of the first recess portion 290 in the XYplane is annular (in a ring shape) and the high-pressure space formed bythe first recess portion 290 is also annular. Accordingly, the bindingforce acting to the center from all the sides of the interface LG1 ofthe immersion space LS almost uniformly acts. Accordingly, the extensionof the immersion space LS is effectively suppressed.

By supplying the liquid LQ from the supply port 275 in the state wherethe extension of the immersion space LS formed by the liquid LQ flowinginto the first space 251 via the aperture 239 is suppressed, the liquidLQ flows into the space portion 280 opened to the atmosphere and theposition of the surface of the liquid LQ in the space portion 280 movesin the +Z direction (rises). When the space portion 280 is filled withthe liquid LQ, at least a part of the liquid LQ in the space portion 280overflows from the top end (the top end portion 248T) of the spaceportion 280. The liquid LQ overflowing from the space portion 280 isrecovered by the recovery portion 260 disposed outside the top end ofthe space portion 280.

The liquid LQ overflowing from the space portion 280 is guided by theliquid guide portion 281 and then flows into the second recess portion261. The liquid LQ flowing into the second recess portion 261 iscollected in the second recess portion 261.

FIG. 18A shows a state where the surface of the liquid LQ in the secondrecess portion 261 is located at a first position Z1 and FIG. 18B showsa state where the surface of the liquid LQ is located at a secondposition Z2. As shown in FIG. 18A, for example, in the state where thesurface of the liquid LQ is located at the first position Z1 and theliquid LQ does not come in contact with the recovery port 262 (theporous member 264), the second aperture 234 is opened to the atmospherevia the seventh, eighth, and ninth spaces 257, 258, and 259 and thethird aperture 272. Accordingly, the liquid LQ in the first space 251smoothly flows into the space portion 280 via the first aperture 233.The liquid LQ flowing into the space portion 280 and overflowing fromthe space portion 280 smoothly flows into the second recess portion 261.The amount of the liquid LQ collected in the second recess portion 261slowly increases.

As shown in FIG. 18B, when the amount of the liquid LQ collected in thesecond recess portion 261 increases, the surface of the liquid LQreaches the second position Z2, and the liquid LQ comes in contact withthe recovery port 262 (the porous member 264), the liquid LQ collectedin the second recess portion 261 is recovered from the recovery port 262(the porous member 264). When the liquid LQ is recovered from therecovery port 262, the amount of the liquid LQ in the second recessportion 261 decreases and the position of the surface of the liquid LQin the second recess portion 261 moves in the −Z direction (drops). Whenthe liquid LQ flows into the second recess portion 261 from the spaceportion 280, the amount of the liquid LQ in the second recess portion261 increases again, the liquid LQ comes in contact with the porousmember 264, and the liquid LQ is recovered from the recovery port 262.

In this embodiment, since the difference in pressure between at thebottom surface side and at the top surface side of the porous member 264is controlled so that only the liquid LQ passes from the bottom surfaceto the top surface of the porous member 264, the recovery portion 260can recover the liquid LQ while suppressing the vibration and thevaporization heat from being generated.

In this embodiment, since the recovery portion 260 collects the liquidLQ on the substrate P recovered via the first aperture 233 and the spaceportion 280 into the second recess portion 261, it is possible tosuppress the liquid LQ recovered via the space portion 280 fromreturning to the space portion 280. The recovery portion 260 recoversthe liquid LQ collected greater than a predetermined amount in thesecond recess portion 261 by the use of the recovery port 262.Accordingly, it is possible to satisfactorily suppress the liquid LQrecovered via the space portion 280 from returning to the space portion280. Since the liquid LQ from the space portion 280 is collected in thesecond recess portion 261 so that the liquid LQ recovered via the spaceportion 280 does not return to the space portion 280, the liquid LQcoming into contact with the porous member 264 is suppressed fromreturning to the first space 251 and the optical path of the exposurelight EL via the space portion 280.

A method of exposing the substrate P will be described now. As describedabove, the control apparatus 7 supplies the liquid LQ from the supplyport 275 and holds the liquid LQ between the first surface 241 and thesurface of the substrate P so as to fill the optical path of theexposure light EL with the liquid LQ, thereby forming the immersionspace LS. At least a part of the liquid LQ on the substrate P flows intothe space portion 280 via the first aperture 233. The recovery portion260 collects the liquid LQ from the space portion 280 in the secondrecess portion 261 and recovers the liquid LQ reaching a predeterminedamount in the second recess portion 261 by the use of the recovery port262. The control apparatus 7 performs a liquid recovering operationusing the recovery portion 260 along with a liquid supply operationusing the supply port 275 and forms the immersion space LS so as to fillthe optical path of the exposure light EL with the liquid LQ. Thecontrol apparatus 7 forms a high-pressure space around the interface LG1by supplying the gas from the first gas supply port 291 to enhance thepressure of the first recess portion 290. The control apparatus 7continuously supplies the gas from the second gas supply port 274 toform the gas seal.

The control apparatus 7 collects at least a part of the liquid LQ on thesubstrate P into the second recess portion 261 via the space portion 280from the first aperture 233 and starts the exposure of the substrate Pwhile suppressing the liquid LQ recovered from the space portion 280 bythe recovery portion 260 from returning to the space portion 280 andrestricting the extension of the immersion space LS using the second gapG2 or the like.

The control apparatus 7 controls the illumination system IL to emit theexposure light EL and illuminates the mask M with the exposure light EL.The exposure light EL from the mask M is emitted from the emissionsurface 23 of the projection optical system PL. The control apparatus 7illuminates the substrate P with the exposure light EL from the emissionsurface 23 via the liquid LQ between the emission surface 23 and thesubstrate P. Accordingly, the pattern image of the mask M is projectedto the substrate P and the substrate P is exposed with the exposurelight EL. During the exposure of the substrate P, the liquid LQ suppliedfrom the supply port 275 flows via the first aperture 233 and isrecovered by the recovery portion 260 via the space portion 280.

As described above, in this embodiment, the gas is supplied from thefirst gas supply port 291 disposed in the inner surface 292 defining thefirst recess portion 290 to form the high-pressure space around theimmersion space LS. Accordingly, for example, even when the substrate Pis moved in the state where the immersion space LS is formed, the spacebetween the projection optical system PL and the substrate P can bereliably filled with the liquid LQ. It is possible to suppress theleakage or remaining of the liquid LQ. Accordingly, it is possible toprevent the occurrence of the exposure failure and the generation of adefective device.

As described above, in this embodiment, since the space portion 280opened to the atmosphere is disposed and the liquid LQ flowing into thespace portion 280 is recovered by the recovery portion 260, it ispossible to simplify the structure of the bottom surface of theimmersion member 4 opposed to the surface of the substrate P.Accordingly, it is possible to suppress foreign materials from beingattached to the bottom surface of the immersion member 4 coming incontact with the liquid LQ or to suppress the bottom surface from beingcontaminated.

In this embodiment, the space portion 280 (the sixth space 256) and theliquid guide portion 281 (the seventh space 257) forming the flowchannel through which the liquid LQ flowing through the first aperture233 flows are formed between the first member 231 and the second member232 which can be separated. Accordingly, it is possible to smoothly andreliably clean the sixth surface 246 of the first member 231 and theeighth surface 248 of the second member 232 forming the space portion280 and the seventh surface 247 of the first member 231 and the ninthsurface 249 of the second member 232 forming the liquid guide portion281.

In this embodiment, the recovery portion 260 is constructed so that theliquid LQ recovered from the space portion 280 does not return to thespace portion 280. That is, the liquid LQ from the space portion 280 iscollected in the second recess portion 261. Accordingly, for example,when the porous member 264 of the recovery portion 260 is contaminated,it is possible to suppress the liquid LQ coming into contact with theporous member 264 (the liquid LQ which might be contaminated) fromreturning (reversely flowing) to the first space 251 and the opticalpath of the exposure light EL via the space portion 280. Accordingly, itis possible to prevent the generation of the exposure failure.

When the porous member 264 is contaminated, it is possible to preventthe contamination of the liquid LQ coming in contact with the porousmember 264 by replacing the contaminated porous member 264 with a newporous member 264.

In the above-mentioned embodiment, the twelfth surface 279 is formedbetween the first aperture 233 and the first recess portion 290, but thefirst aperture 233 and the first recess portion 290 may be adjacent toeach other without forming the twelfth surface 279. The twelfth surface279 may be disposed lower than the first surface 241.

Eleventh Embodiment

An eleventh embodiment of the invention will be described below. In thefollowing description, the elements equal or equivalent to those of theabove-mentioned embodiment are referenced by like reference numerals andsigns, and are described in brief or are not repeatedly described.

FIG. 19 is a diagram illustrating an example of an immersion member 204Baccording to the eleventh embodiment of the invention. In thisembodiment, the immersion member 204B includes a first surface 241disposed around the optical path of the exposure light EL emitted fromthe emission surface 23, a first recess portion 290 disposed around thefirst surface 241, a first gas supply port 291 which is disposed in theinner surface 292 defining the first recess portion 290 and whichsupplies the gas to raise the pressure of the first recess portion 290,and a recovery port 287 which is disposed between the first surface 241and the first recess portion 290 in the radial direction about theoptical axis AX and which recovers the liquid LQ. A porous member 288 isdisposed in the recovery port 287.

The immersion member 204B includes a second surface 242 disposed aroundthe first recess portion 290 and directed to the same side as the firstsurface 241, a second gas supply port 274 disposed in the second surface242, and a supply port 275 disposed at the position opposed to the sidesurface 35.

In this embodiment, the first surface 241, the first recess portion 290,the first gas supply port 291, the recovery port 287, the second surface242, the second gas supply port 274, and the supply port 275 aredisposed in the same member.

In this embodiment, the recovery port 287 is directed in the directionso as to be opposed to the surface of the substrate P. The recovery port287 can recover the liquid LQ on the substrate P. The bottom surface ofthe porous member 288 can be opposed to the surface of the substrate P.The bottom surface of the porous member 288 is disposed in at least apart of a surrounding of the first surface 241. In this embodiment, thefirst surface 241 and the bottom surface of the porous member 288 aresubstantially flush with each other.

The recovery port 287 is connected to the liquid recovering device 277via a recovery flow channel. By connecting the recovery port 287 to theliquid recovering device 277 including a vacuum source, the liquid LQ isrecovered from the recovery port 287. In this embodiment, the controlapparatus 7 controls the liquid recovering device 277 to adjust thedifference in pressure between at the bottom surface side and at the topsurface side of the porous member 288 so as to pass only the liquid LQfrom the bottom surface side to the top surface side of the porousmember 288.

In this embodiment, the first recess portion 290 is disposed outside therecovery port 287 in the radial direction about the optical axis AX,whereby the interface LG of the liquid LQ in the immersion space LS issuppressed from moving to the outside from the space below the recoveryport 287. Accordingly, in this embodiment, it is possible to prevent theleakage and remaining of the liquid LQ.

Twelfth Embodiment

A twelfth embodiment of the invention will be described below. Thisembodiment is a modified example of the tenth embodiment. In thefollowing description, the elements equal or equivalent to those of theabove-mentioned embodiment are referenced by like reference numerals andsigns, and are described in brief or are not repeatedly described.

FIG. 20 is a diagram illustrating an example of an immersion member 204Caccording to the twelfth embodiment of the invention. In FIG. 20, theimmersion member 204C includes a first member 231C having the firstsurface 241 and a second member 232C having the second surface 242.

The immersion member 204C includes a recovery portion 260C recovering atleast a part of the liquid LQ flowing into the space portion 280. Inthis embodiment, the recovery portion 260C includes a second recessportion 261C disposed in the second member 232C and a recovery port 262Crecovering the liquid LQ flowing into the second recess portion 261C. Inthis embodiment, the recovery port 262C is disposed in the second recessportion 261C. In this embodiment, the recovery port 262C is disposed inthe bottom surface 2613C of the second recess portion 261C. A porousmember 264C is disposed in the recovery port 262C. The top surface ofthe porous member 264C is disposed lower than the top end portion 248T(in the −Z direction). In this embodiment, it is possible to recover theliquid LQ reliably by the use of the recovery portion 260C.

In this embodiment, the immersion member 204C includes a supply port 284disposed at a position facing the first space 251, which the firstsurface 241 faces, outside the first surface 241 in the radial directionabout the optical axis AX. The supply port 284 supplies the liquid LQ tothe optical path of the exposure light EL. In this embodiment, thesupply port 284 is disposed in the second member 232C. The supply port284 is disposed outside the first aperture 233 in the radial directionabout the optical axis AX. The supply port 284 is disposed in athirteenth surface 285 connected to the inner edge of the twelfthsurface 279 to face the first space 251.

Similarly to the tenth and eleventh embodiments, the immersion member204C includes the first recess portion 290 disposed around the firstsurface 241, the first gas supply port 291 disposed in the inner surface292 defining the first recess portion 290, and the second gas supplyport 274 disposed in the second surface 242. In this embodiment, thesupply port 284 is disposed between the first aperture 233 and the firstrecess portion 290.

In this embodiment, it is possible to form the immersion space LSreliably, thereby suppressing the leakage and remaining of the liquidLQ.

In this embodiment, the supply port 275 and the supply port 284 are bothprovided, but the supply port 275 may not be provided.

In this embodiment, the recovery port 262C may be disposed in at leastone of the first inner surface 2611C and the second inner surface 2612Cof the second recess portion 261C.

In the tenth and twelfth embodiments, the first member 231 having thefirst surface 241 and the second member 232 having the second surface242 may be relatively movable in the direction parallel to the opticalaxis AX and/or perpendicular to the optical axis AX. That is, at leastone of the first member 231 and the second member 232 may be movablysupported. For example, an actuator may be disposed in the secondsupport mechanism 29 and the position of the second member 232 may bemade to move with the driving force of the actuator. The second gap G2can be adjusted by shifting the position of the second member 232 in theZ direction.

In the tenth and twelfth embodiments, the first surface 241, the secondsurface 242, and the space portion 280 may be formed in the same member.

In the tenth and twelfth embodiments, the space portion 280 may bedisposed to oppose the second aperture 234 to the outer surface 36 ofthe holding member 21. In this case, since the fifth space 255 below theouter surface 36 is opened to the atmosphere (the gas space around theimmersion member 4), it is possible to smoothly recover the liquid LQfrom the space portion 280 by disposing the recovery portion 260 outsidethe space portion 280 in the radial direction about the optical axis AX.

In the above-mentioned embodiments, at least a part of the secondsurface 242 may not be lyophobic to the liquid LQ.

In the tenth to twelfth embodiments, the porous member is disposed inthe recovery ports 262, 287, and 262C so as to pass only the liquid LQfrom one side to the other side of the porous member, but the recoveryport may recover the liquid LQ along with the gas. The porous member maynot be disposed in the recovery port.

In the above-mentioned embodiments, the gas supply port 274 may not beprovided.

In the above-mentioned embodiments, when the high-pressure space can beheld below the first recess portion 290 by the gas from the gas supplyport 274, the second surface 242 may not be disposed lower than thefirst surface 241.

In the above-mentioned embodiments, the first surface 241 may bedisposed in a part of a surrounding of the optical path of the exposurelight EL. The second surface 242 may be disposed in a part of asurrounding of the first recess portion 290.

In the above-mentioned embodiments, the first surface 241 may not bedisposed between the emission surface 23 and the substrate P. In thiscase, the first surface 241 may be flush with the emission surface 23,or may be disposed higher than the emission surface 23.

In the above-mentioned embodiments, the surface of the final opticalelement 22 through which the exposure light EL does not pass may notinclude the surface (side surface 35) extending upward (in the +Zdirection) from the edge of the emission surface 23. For example, thesurface of the final optical element 22 through which the exposure lightEL does not pass may extend in a direction substantially parallel to theemission surface 23 (in a direction perpendicular to the optical axisAX).

Thirteenth Embodiment

A thirteenth embodiment of the invention will be described below. FIG.21 is a diagram schematically illustrating the configuration of anexposure apparatus EX according to the thirteenth embodiment of theinvention. In the following description, the elements equal orequivalent to those of the above-mentioned embodiment are referenced bylike reference numerals and signs, and are described in brief or are notrepeatedly described.

As shown in FIG. 21, in this embodiment, the exposure apparatus EXincludes an immersion member 304 which can form an immersion space LS soas to fill at least a part of the optical path of the exposure light ELwith the liquid LQ.

The immersion member 304 is disposed in at least a part of a surroundingof the optical path of the exposure light EL so as to fill the opticalpath of the exposure light EL emitted from the emission surface 23 withthe liquid LQ. The immersion member 304 forms the immersion space LS sothat the optical path of the exposure light EL between the emissionsurface 23 and an object disposed at the position opposed to theemission surface 23 is filled with the liquid LQ. The immersion space LSis a portion (space or region) filled with the liquid LQ. In thisembodiment, the object includes at least one of the substrate stage 2(plate member T) and the substrate P held on the substrate stage. Duringthe exposure of the substrate P, the immersion member 304 forms theimmersion space LS so that the optical path of the exposure light ELbetween the final optical element 22 and the substrate P is filled withthe liquid LQ.

The immersion member 304 is disposed in the vicinity of the finaloptical element 22. In this embodiment, the immersion member 304 issupported by a support mechanism 28. In this embodiment, the supportmechanism 28 is supported by the first plate 13. In this embodiment, theimmersion member 304 is suspended from the first plate 13 with thesupport mechanism 28 interposed therebetween.

FIG. 22 is a side sectional view of the vicinity of the immersion member304, FIG. 23 is a top view of the immersion member 304, and FIG. 24 is apartially enlarged view of FIG. 22.

As shown in FIGS. 22, 23, and 24, in this embodiment, the immersionmember 304 is an annular member. At least a part of the immersion member304 is disposed in the vicinity of a partial optical path of theexposure light EL and the final optical element 22. As shown in FIG. 23,in this embodiment, the outer shape of the immersion member 304 in theXY plane is circular. The outer shape of the immersion member 304 may beother shapes (for example, rectangular).

The immersion member 304 includes a first surface 341 disposed in atleast a part of a surrounding of the optical path of the exposure lightEL emitted from the emission surface 23, a supply port 375 which isdisposed in at least a part of a surrounding of the first surface 341 soas to face a first space 351 which the first surface 341 faces and whichsupplies the liquid LQ to the first space 351 to fill the optical pathof the exposure light EL emitted from the emission surface 23 with theliquid LQ, and a recovery portion 360 recovering at least a part of theliquid LQ, which is supplied from the supply port 375 and which flowsinto a space portion 380 which the side surface 35 of the projectionoptical system PL extending upward from the edge of the emission surface23 and in the radial direction about the optical axis AX of theprojection optical system PL, via a first aperture 339.

In this embodiment, the immersion member 304 includes a second surface342 disposed in at least a part of a surrounding of the first surface341 and disposed lower than the first surface 341 (in the −Z direction).The first surface 341 and the second surface 342 can be opposed to thesurface (top surface) of the object disposed below the immersion member304. In this embodiment, the outer shapes of the first surface 341 andthe second surface 342 in the XY plane are circular. The inner edge ofthe second surface 342 in the XY plane has a circular shape.

In this embodiment, the first surface 341 and the second surface 342cannot recover the liquid LQ. That is, in this embodiment, the firstsurface 341 and the second surface 342 are not provided with a liquidrecovery port. That is, in this embodiment, the bottom surface of theimmersion member 304 opposed to the surface of the substrate P duringthe exposure is not provided with the liquid recovering port, except forthe first aperture 339 through which the exposure light EL passes. Inthis embodiment, the first surface 341 and the second surface 342 areflat. A first space 351 between the first surface 341 and the surface(top surface) of the object can hold the liquid LQ. In this embodiment,the first surface 341 and the second surface 342 are parallel to the XYplane (horizontal plane), but at least a part of the first surface 341and/or the second surface 342 may be tilted about the XY plane or atleast one of the first surface 341 and the second surface 342 may not beparallel to each other. In this embodiment, the first surface 341 andthe second surface 342 may include a curved surface.

In at least a part of the exposure of the substrate P, the emissionsurface 23, the first surface 341, and the second surface 342 areopposed to the surface of the substrate P disposed below the emissionsurface 23. In at least a part of the exposure of the substrate P, theliquid LQ is filled in the space between the emission surface 23 and thesurface of the substrate P. In at least a part of the exposure of thesubstrate P, the liquid LQ is held in the first space 351 between thefirst surface 341 and the surface of the substrate P. The substrate P isexposed with the exposure light EL from the emission surface 23 throughthe liquid LQ between the emission surface 23 and the surface of thesubstrate P.

In this embodiment, a part of the immersion space LS is formed by theliquid LQ held between the first surface 341 and the object. In thisembodiment, the immersion space LS is formed so that a partial region ofthe surface of the substrate P including the projection region PR iscovered with the liquid LQ when the substrate P is being illuminatedwith the exposure light EL. A gas-liquid interface (meniscus, edge) LG1of the liquid LQ in the immersion space LS can be formed between atleast one of the first surface 341 and the second surface 342 and thesurface of the substrate P, but is preferably formed between the inneredge of the second surface 342 and the substrate P. The exposureapparatus EX according to this embodiment employs a local immersionmethod.

For the purpose of convenient explanation, it is assumed that thesubstrate P is disposed at a position opposed to the emission surface23, the first surface 341, and the second surface 342 and the liquid LQis held between the immersion member 304 and the substrate P to form theimmersion space LS. As described above, the immersion space LS can beformed between the emission surface 23 and the immersion member 304 andanother member (such as the plate member T of the substrate stage 2).

As described above, in this embodiment, the first surface 341 and thesecond surface 342 are substantially parallel to the XY plane. As shownin FIG. 24, the first surface 341 is opposed to the surface of thesubstrate P with a first gap G1 interposed therebetween and the secondsurface 342 is opposed thereto with a second gap G2 interposedtherebetween. The second gap G2 is smaller than the first gap G1.

In this embodiment, the supply port 375 is disposed lower than the firstsurface 341. In this embodiment, the supply port 375 is disposed betweenthe first surface 341 and the second surface 342. In this embodiment,the immersion member 304 includes a third surface 343 which is disposedbetween the first surface 341 and the second surface 342 to face thefirst space 351. The top end of the third surface 343 is connected tothe outer edge of the first surface 341. The bottom end of the thirdsurface 343 is connected to the inner edge of the second surface 342.The supply port 375 is disposed in the third surface 343.

In this embodiment, the supply ports 375 are disposed on the +Y side and−Y side about the optical axis AX, respectively. The supply ports 375may be disposed on the +X side and −X side about the optical axis AX,respectively. The number of supply ports 375 may be equal to or greaterthan 3.

The third surface 343 is disposed around the exposure light EL. Thefirst space 351 is defined by the first surface 341 and the thirdsurface 343. In this embodiment, the third surface 343 is substantiallyparallel to the optical axis AX. The third surface 343 may not beparallel to the optical axis AX. For example, the angle formed by thefirst surface 341 and the third surface 343 may be smaller than 90degrees or may be greater than 90 degrees.

In this embodiment, the side surface 35 of the projection optical systemPL includes at least one of the side surface 35A of the final opticalelement 22 and the outer surface 35B of the holding member 21. The sidesurface 35A of the final optical element 22 is a surface different fromthe emission surface 23 and a surface through which the exposure lightEL does not pass. The side surface 35A is disposed around the emissionsurface 23. The side surface 35A extends upward from the edge of theemission surface 23 and in the radial direction (in the directionperpendicular to the optical axis AX) about the optical axis AX. Thatis, the side surface 35A is tilted to extend upward (in the +Zdirection) from the edge of the emission surface 23.

The holding member 21 holds the final optical element 22. The outersurface 35B of the holding member 21 is disposed around the side surface35A. The outer surface 35B is a surface through which the exposure lightEL does not pass. The outer surface 35B extends in the radial directionabout the optical axis AX.

In this embodiment, the immersion member 304 includes fourth surface 344opposed to at least a part of the emission surface 23 in the oppositedirection of the first surface 341, a fifth surface 345 disposed aroundthe fourth surface 344 and opposed to the side surface 35A of the finaloptical element 22, and a sixth surface 346 disposed around the fifthsurface 345 and opposed to the outer surface 35B of the holding member21. In this embodiment, the final optical element 22 is held by theholding member 21 so as to expose the side surface 35, but the finaloptical element 22 may be held by the hold member 21 so that the fifthsurface 345 faces the holding member 21 or so that the sixth surface 346faces the final optical element 22.

The immersion member 304 includes a plate portion 337 of which at leasta part is opposed to the emission surface 23 and a body portion 338 ofwhich at least a part is disposed around the final optical element 22.The first surface 341 and the fourth surface 344 are disposed in theplate portion 337. The fifth surface 345 and the sixth surface 346 aredisposed in the body portion 338.

The first aperture 339 is disposed in the plate portion 337. Theexposure light EL emitted from the emission surface 23 can pass throughthe first aperture 339. During the exposure of the substrate P, theexposure light EL emitted from the emission surface 23 is applied to thesurface of the substrate P via the first aperture 339. As shown in FIG.23, in this embodiment, the first aperture 339 is longitudinal in the Xaxis direction intersecting the scanning direction (the Y axisdirection) of the substrate P.

The fourth surface 344 is opposed to the emission surface 23 with athird gap G3 interposed therebetween. The fifth surface 345 is opposedto the side surface 35A with a fourth gap G4 interposed therebetween.The sixth surface 346 is opposed to the outer surface 35B with a fifthgap G5 interposed therebetween.

In this embodiment, the fourth surface 344 and the emission surface 23are substantially parallel to each other. The fifth surface 345 and theside surface 35A are substantially parallel to each other. The sixthsurface 346 and the outer surface 35B are substantially parallel to eachother. The fourth surface 344 and the emission surface 23 may not beparallel to each other. The fifth surface 345 and the side surface 35Amay not be parallel to each other. The sixth surface 346 and the outersurface 35B may not be parallel to each other.

The space portion 380 includes a first space portion 381 and a secondspace portion 382. The first space portion 381 includes a space betweenthe side surface 35A and the fifth surface 345. The first space portion381 extends in the radial direction about the optical axis AX and to theupside (in the +Z direction). In this embodiment, the bottom end portion345B of the fifth surface 345 defines the bottom end of the first spaceportion 381. The top end portion 345T of the fifth surface 345 definesthe top end of the first space portion 381.

The second space portion 382 includes a space between the outer surface35B and the sixth surface 346. The second space portion 382 makes afluidic communication with the top end of the first space portion 381.The second space portion 382 extends in the radial direction about theoptical axis AX.

The first space portion 381 may be parallel to the optical axis AX. Thesecond space portion 382 may not be perpendicular to the optical axisAX.

The recovery portion 360 recovers at least a part of the liquid LQflowing into the space portion 380 (the first space portion 381) via thefirst aperture 339. The first aperture 339 faces the first space 351. Atleast a part of the liquid LQ supplied to the first space 351 from thesupply port 375 can flow into the first space portion 381 via the firstaperture 339. In at least a part of the exposure of the substrate P, thefirst aperture 339 is opposed to the surface of the substrate P.Accordingly, at least a part of the liquid LQ on the substrate P canflow into the first space portion 381 via the first aperture 339.

In this embodiment, the first space portion 381 is opened to theatmosphere via a second aperture 334 different from the first aperture339. In this embodiment, the second aperture 334 is disposed at the topend of the first space portion 381.

The recovery portion 360 recovers at least a part of the liquid LQ,which flows into the first space portion 381 via the first aperture 339,via the second aperture 334. The recovery portion 360 recovers theliquid LQ overflowing from the first space portion 381. At least a partof the recovery portion 360 is disposed outside the top end portion 345Tin the radial direction about the optical axis AX. At least a part ofthe recovery portion 360 is opposed to the outer surface 35B in thesecond space portion 382.

In this embodiment, the recovery portion 360 includes a recess portion361 disposed upward (in the +Z direction) outside the first spaceportion 381 in the radial direction about the optical axis AX. Therecess portion 361 is disposed in the immersion member 304. The recessportion 361 includes an opening 361K directed to the upside. Therecovery portion 360 recovers the liquid LQ flowing into the recessportion 361 via the opening 361K.

The recess portion 361 is disposed outside the top end portion 345T inthe radial direction about the optical axis AX. In this embodiment, therecess portion 361 is disposed around the sixth surface 346. In the XYplane, the recess portion 361 has an annular shape. The recess portion361 may be formed by plural recess portions arranged in an annular shapewith a predetermined gap. In this embodiment, the immersion member 304includes a seventh surface 347 disposed around the recess portion 361.The seventh surface 347 is substantially parallel to the XY plane. Inthis embodiment, the seventh surface 347 is flush with the sixth surface346. The seventh surface 347 may be disposed higher than the sixthsurface 346 (in the +Z direction).

The recess portion 361 includes a first inner surface 3611 connected tothe sixth surface 346, a second inner surface 3612 connected to theseventh surface 347 and opposed to the first inner surface 3611, and abottom surface 3613 disposed between the first inner surface 3611 andthe second inner surface 3612. The bottom surface 3613 is directed tothe upside (in the +Z direction). The bottom surface 3613 is disposedlower than the top end portion 345T (in the direction). In thisembodiment, the bottom surface 3613 is substantially parallel to the XYplane. The bottom surface 3613 may not be parallel to the XY plane. Forexample, the bottom surface 3613 may be tilted about the XY plane. Thebottom surface 3613 may include a curved surface.

The recovery portion 360 includes a liquid guide portion 383 guiding theliquid LQ from the first space portion 381 to the recess portion 361. Inthis embodiment, the liquid guide portion 383 includes the sixth surface346. In this embodiment, the liquid guide portion 383 includes the spacebetween the outer surface 35B and the sixth surface 346. That is, theliquid guide portion 383 is disposed in a part of the second spaceportion 382. The liquid guide portion 383 extends in the radialdirection about the optical axis AX from the top end portion 345T.

In this embodiment, the liquid guide portion 383 is perpendicular to theoptical axis AX (parallel to the XY plane), but may not be perpendicularto the optical axis AX. For example, the sixth surface 346 may be tiltedto the downside from the top end portion 345T.

The recess portion 361 is disposed outside the liquid guide portion 383in the radial direction about the optical axis AX from the top endportion 345T. The liquid LQ overflowing from the top end of the firstspace portion 381 is guided by the liquid guide portion 383 and flows inthe recess portion 361.

The recess portion 361 can gather the liquid LQ from the first spaceportion 381. The recess portion 361 suppresses the liquid LQ from thefirst space portion 381 from returning to the first space portion 381,by collecting the flowing liquid LQ. That is, the recess portion 361 atleast serves as a part of a reservoir portion collecting the liquid LQfrom the first space portion 381 so as not to return to the first spaceportion 381.

The recovery portion 360 includes a recovery port 362 recovering theliquid LQ flowing in the recess portion 361. The recovery port 362recovers the liquid LQ collected by the recess portion 361.

In this embodiment, the recovery port 362 is disposed in the recessportion 361. In other words, the recovery port 362 is disposed lowerthan the opening 361K of the recess portion 361 (in the −Z direction).In this embodiment, the recovery port 362 is disposed in the bottomsurface 3613 of the recess portion 361. That is, the bottom surface 3613of the recess portion 361 includes at least a part of the recovery port362.

In this embodiment, the recovery port 362 has an annular shape in the XYplane. The recovery port 362 may be divided and disposed at pluralposition around the optical axis AX.

A porous member 364 is disposed in the recovery port 362. The porousmember 364 is a plate-like member including plural openings or pores.The porous member 364 may be a mesh filter which is a porous memberhaving plural small pores formed in meshes shapes.

As described above, in this embodiment, the first space portion 381 isopened to the atmosphere via the second aperture 334. In thisembodiment, the first space portion 381 is opened to the atmosphere viathe second aperture 334 and the second space portion 382.

As described above, the second space portion 382 includes the spacebetween the outer surface 35B and the sixth surface 346. In thisembodiment, the second space portion 382 includes the space between theouter surface 35B and the recess portion 361 and the space between theouter surface 35B and the seventh surface 347. The space between theouter surface 35B and the seventh surface 347 is opened to theatmosphere via the third aperture 372.

That is, the first space portion 381 is opened to the space around theimmersion member 304 via the second aperture 334 and the second spaceportion 382. In other words, the first space portion 381 is opened tothe gas space coming in contact with the interface of the liquid LQ inthe immersion space LS via the second aperture 334.

In this embodiment, the “atmosphere” is a gas surrounding the immersionmember 304. In this embodiment, the gas surrounding the immersion member304 is a gas in the inner space 8 formed by the chamber 5. In thisembodiment, the chamber 5 fills the inner space 8 with a clean gas usingthe environment controller 5B. The chamber 5 adjusts the inner space 8substantially to the atmospheric pressure using the environmentcontroller 5B. The pressure of the inner space 8 may be set to be higherthan the atmospheric pressure.

In this embodiment, the second surface 342 is lyophobic to the liquidLQ. In the second surface 342, a contact angle of the liquid LQ is equalto or greater than 90° and may be equal to or greater than 100°. In thisembodiment, the second surface 342 is formed of a film 373 which islyophobic to the liquid LQ. The film 373 is formed of, for example, alyophobic material containing fluorine. Examples of the lyophobicmaterial include PFA (Tetra Fluoro Ethylene-perfluoro alkylvinyl ethercopolymer), PTFE (Poly Tetra Fluoro Ethylene), PEEK(PolyEtherEtherKetone), and Teflon (registered trademark).

In this embodiment, the third surface 343 is also lyophobic to theliquid LQ. The third surface 343 is also formed of the film 373. Atleast one of the second surface 342 and the third surface 343 may not bea surface of a lyophobic film 373. For example, the immersion member 304may be formed of a lyophobic material.

In this embodiment, the immersion member 304 includes a gas supply port374 disposed in at least a part of a surrounding of the supply port 375.In this embodiment, the gas supply port 374 is disposed in the secondsurface 342. The gas supply port 374 can supply the gas to the secondspace 352 between the second surface 342 and the surface of thesubstrate P. The gas supply port 374 supplies a gas to the surface ofthe object (substrate P) opposed to the second surface 342.

In this embodiment, the gas supply port 374 has an annular shape in theXY plane. The gas supply port 374 may be divided and arranged at pluralpositions around the optical axis AX.

As shown in FIG. 22, the supply port 375 is connected to a liquid supplydevice 376 via a supply flow channel. In this embodiment, the supplyflow channel includes a flow channel formed in the immersion member 304and a flow channel formed in the support mechanism 28. The liquid supplydevice 376 can supply the clean liquid LQ adjusted in temperature to thesupply port 375. A part of the supply flow channel may not be disposedin the support mechanism 28 supporting the immersion member 304.

The recovery port 362 is connected to a liquid recovering device 377 viaa recovery flow channel. In this embodiment, the recovery flow channelincludes a flow channel formed in the immersion member 304 and a flowchannel formed in the support mechanism 28. The liquid recovering device377 includes a vacuum system (such as a valve controlling a connectionstate between a vacuum source and the recovery port 362) and can suckand recover the liquid LQ from the recovery port 362. A part of therecovery flow channel may not be disposed in the support mechanism 28supporting the immersion member 304.

The gas supply port 374 is connected to the gas supply device 378 via agas supply channel. In this embodiment, the gas supply channel includesa flow channel formed in the immersion member 304 and a flow channelformed in the support mechanism 28. The gas supply device 378 can supplya clean gas adjusted in temperature and humidity to the gas supply port374. The humidity of the gas supplied from the gas supply port 374 ispreferably equal to or higher than the humidity of the gas supplied tothe inner space 8 by the environment controller 5B. A part of the gassupply channel may not be disposed in the support mechanism 28supporting the immersion member 304.

The liquid LQ supplied to the first space 351 from the supply port 375is supplied to the optical path of the exposure light EL emitted fromthe emission surface 23. At least a part of the liquid LQ in the firstspace 351 flows into the third space 353 between the emission surface 23and the fourth surface 344 via the first aperture 339 and then flowsinto the first space portion 381 via the third space 353. At least apart of the liquid LQ flowing into the first space portion 381 isrecovered by the recovery portion 360.

In this embodiment, the different in pressure between at the top surfaceside and at the bottom surface side of the porous member 364 iscontrolled so that only the liquid LQ passes from the top side space(the second space portion 382) of the porous member 364 to the bottomside space (the recovery flow channel). In this embodiment, the pressureof the second space portion 382 which is the top side space is opened tothe atmosphere and is controlled by the chamber 5. The control apparatus7 controls the liquid recovering device 377 so that only the liquid LQfrom the first space portion 381 passes from the top side to the bottomside of the porous member 364, and adjusts the pressure of the bottomside on the basis of the pressure of the top side. That is, the controlapparatus 7 makes a control so as to recover only the liquid LQ from thefirst space portion 381 via the pores of the porous member 364 and so asfor the gas not to pass through the pores of the porous member 364. Thetechnique of adjusting the difference in pressure between at one sideand at the other side of the porous member 364 so as to pass only theliquid LQ from one side of the porous member 364 to the other side isdisclosed, for example, in the specification of U.S. Pat. No. 7,292,313.

A method of exposing the substrate P using the exposure apparatus EXhaving the above-mentioned configuration will be described now.

First, the control apparatus 7 moves the substrate stage 2 holding thesubstrate P so that the emission surface 23 and the first surface 341opposed to the surface of the substrate P (or the top surface 26 of thesubstrate stage 2). The first surface 341 and the surface of thesubstrate P are opposed to each other with the first gap G1 interposedtherebetween and the second surface 342 and the surface of the substrateP are opposed to each other with the second gap G2 interposedtherebetween.

The control apparatus 7 sends out the liquid LQ from the liquid supplydevice 376 in the state where the first surface 341 and the secondsurface 342 are opposed to the surface of the substrate P. The controlapparatus 7 activates the liquid recovering device 377. The controlapparatus 7 activates the gas supply device 378.

The liquid LQ sent from the liquid supply device 376 is supplied to thefirst space 351 from the supply port 375 and is held between the firstsurface 341 and the surface of the substrate P. The liquid LQ suppliedto the first space 351 is supplied to the optical path of the exposurelight EL emitted from the emission surface 23. Accordingly, the opticalpath of the exposure light EL between the emission surface 23 and thesubstrate P is filled with the liquid LQ.

In this embodiment, the immersion space LS is formed so that the firstspace 351 surrounded with the surface of the substrate P, the firstsurface 341, and the third surface 343 is almost filled with the liquidLQ. The interface LG1 of the liquid LQ (the immersion space LS) isformed between the inner edge (the bottom end of the third surface 343)of the second surface 42 and the surface of the substrate P.

In this embodiment, the liquid LQ supplied to the first space 351 fromthe supply port 375 is suppressed from flowing into the second space352. That is, in this embodiment, the interface LG1 of the liquid LQ inthe immersion space LS in the XY plane is suppressed from moving to theoutside from the third surface 343, thereby suppressing the extension ofthe immersion space LS.

In this embodiment, the first surface 341 is opposed to the surface ofthe substrate P with the first gap G1 interposed therebetween and thesecond surface 342 disposed around the first surface 341 is opposed tothe surface of the substrate P with the second gap G2 interposedtherebetween. The second gap G2 is smaller than the first gap G1 and is,for example, about in the range of 0.1 to 0.3 mm. Accordingly, theinterface LG1 is suppressed from moving to the outside of the thirdsurface 343 in the radial direction about the optical axis AX. That is,since the second gap G2 is small, the position of the interface LG1 isheld between the inner edge of the second surface 342 and the surface ofthe substrate P due to the surface tension of the liquid LQ, as shown inFIG. 24 and the like. Accordingly, the liquid LQ in the immersion spaceLS is suppressed from flowing into the second space 352.

In this embodiment, since the second surface 342 is lyophobic to theliquid LQ, the liquid LQ is more effectively suppressed from flowinginto the second space 352. In this embodiment, since the third surface343 is disposed so as to extend upward from the inner edge of the secondsurface 342 and to face the optical path, the extension of the immersionspace LS is suppressed. Since the third surface 343 is lyophobic to theliquid LQ, the extension of the immersion space LS is also suppressed.

In this embodiment, the gas supply port 374 is disposed and the gas issupplied to the surface of the substrate P on the outside of the inneredge of the second surface 342 about the optical axis AX. Accordingly,the extension of the immersion space LS is suppressed by the force ofthe gas supplied from the gas supply port 374. That is, the gas supplyport 374 forms a gas seal between the surface of the substrate P and thesecond surface 342. Accordingly, the leakage of the liquid LQ issuppressed and thus the movement of the interface LG1 is restricted.

In this embodiment, the outer shape of the first surface 341 and theinner edge of the second surface 342 are circular and the outer shape ofthe immersion space LS in the XY plane is almost circular. Accordingly,the binding force acting to the center from all the sides of theinterface LG1 of the immersion space LS almost uniformly acts.Accordingly, the extension of the immersion space LS is effectivelysuppressed.

By supplying the liquid LQ from the supply port 375 to the first space351 in the state where the extension of the immersion space LS issuppressed, at least a part of the liquid LQ in the first space 351flows into the first space portion 381 opened to the atmosphere via thefirst aperture 339 through which the exposure light EL passes and thethird space 353. When the liquid LQ flows into the first space portion381, the position of the surface of the liquid LQ in the first spaceportion 381 moves in the +Z direction (rises). That is, the liquid LQflows upward in the first space portion 381 extending to the upside.When the liquid LQ is continuously supplied from the supply port 375, atleast a part of the liquid LQ in the first space portion 381 overflowsfrom the top end (the top end portion 345T) of the first space portion381. The liquid LQ overflowing from the first space portion 381 isrecovered by the recovery portion 360 disposed outside the top end ofthe first space portion 381. That is, the liquid LQ overflowing from thefirst space portion 381 is guided by the liquid guide portion 383 andthen flows into the recess portion 361. The liquid LQ flowing into therecess portion 361 is recovered from the recovery port 362 (the porousmember 364).

In this embodiment, since the difference in pressure between at the topsurface side and at the bottom surface side of the porous member 364 iscontrolled so that only the liquid LQ passes from the top surface to thebottom surface of the porous member 364, the recovery portion 360 canrecover the liquid LQ while suppressing the vibration and thevaporization heat from being generated.

In this embodiment, since the recovery portion 360 collects the liquidLQ on the substrate P recovered via the first aperture 339 and the firstspace portion 381 into the recess portion 361, it is possible tosuppress the liquid LQ recovered via the first space portion 381 fromreturning to the first space portion 381. Since the liquid LQ from thefirst space portion 381 is collected in the recess portion 361 so thatthe liquid LQ recovered via the first space portion 381 does not returnto the first space portion 381, the liquid LQ coming into contact withthe porous member 364 is suppressed from returning to the first space351 and the optical path of the exposure light EL via the first spaceportion 381.

A method of exposing the substrate P will be described now. As describedabove, the control apparatus 7 supplies the liquid LQ from the supplyport 375 and holds the liquid LQ between the first surface 341 and thesurface of the substrate P so as to fill the optical path of theexposure light EL with the liquid LQ, thereby forming the immersionspace LS. At least a part of the liquid LQ on the substrate P flows intothe first space portion 381 via the first aperture 339. The recoveryportion 360 recovers the liquid LQ from the first space portion 381. Thecontrol apparatus 7 performs a liquid recovering operation using therecovery portion 360 along with a liquid supply operation using thesupply port 375 and forms the immersion space LS so as to fill theoptical path of the exposure light EL with the liquid LQ. The controlapparatus 7 continuously supplies the gas from the gas supply port 374to form the gas seal.

The control apparatus 7 starts the exposure of the substrate P whilesuppressing the liquid recovered from the first space portion 381 to therecovery portion 360 from returning to the first space 351 (the opticalpath of the exposure light EL) via the first space portion 381 andrestricting the extension of the immersion space LS using the second gapG2 or the like.

The control apparatus 7 controls the illumination system IL to emit theexposure light EL and illuminates the mask M with the exposure light EL.The exposure light EL from the mask M is emitted from the emissionsurface 23 of the projection optical system PL. The control apparatus 7illuminates the substrate P with the exposure light EL from the emissionsurface 23 via the liquid LQ between the emission surface 23 and thesubstrate P. Accordingly, the pattern image of the mask M is projectedto the substrate P and the substrate P is exposed with the exposurelight EL. During the exposure of the substrate P, the liquid LQ suppliedfrom the supply port 375 flows via the first aperture 339 and isrecovered by the recovery portion 360 via the first space portion 381.

As described above, in this embodiment, since the supply port 375 isprovided to face the first space 351 and the liquid LQ flowing into thefirst space portion 381 via the first aperture 339 is recovered by therecovery portion 360, it is possible to simplify the structure of thebottom surface of the immersion member 304 opposed to the surface of thesubstrate P. Accordingly, it is possible to suppress foreign materialsfrom being attached to the bottom surface of the immersion member 304coming in contact with the liquid LQ or to suppress the bottom surfacefrom being contaminated.

For example, when the structure (shape) is complicated by disposing therecovery port recovering the liquid LQ in the bottom surface of theimmersion member 304 opposed to the surface of the substrate P ordisposing the porous member in the recovery port, foreign materials maybe easily attached to the bottom surface. For example, when the porousmember is disposed at a position opposed to the surface of the substrateP, the foreign materials (for example, the photosensitive film formingthe surface of the substrate P or a part of an overcoat film) generatedfrom the substrate P may be attached to the porous member. When theattached foreign materials are emitted to the optical path of theexposure light EL or are mixed into the liquid LQ in the immersion spaceLS during the exposure of the substrate P, the exposure failure such asa pattern defect caused in the substrate P may be caused. When thestructure (shape) of the bottom surface is complicated, for example,when plural recess and convex portions exist, the foreign materialsgenerated from the substrate P may be easily attached to the bottomsurface.

According to this embodiment, the first space portion 381 is provided,the liquid LQ flowing into the first space portion 381 via the firstaperture 339 through which the exposure light EL passes is recovered bythe recovery portion 360 disposed at the position not opposed to thesurface of the substrate P, and the bottom surface of the immersionmember 304 opposed to the surface of the substrate P has a simplestructure. Accordingly, it is possible to suppress the foreign materialsfrom being attached to the bottom surface of the immersion member 304.Since the structure of the bottom surface of the immersion member 304 issimple, it is possible to smoothly and reliably clean the bottom surfaceof the immersion member 304 even when the foreign materials are attachedto the bottom surface of the immersion member 304.

In this embodiment, the first space portion 381 is opened to theatmosphere via the second aperture 334. The third space 353 fluidicallyconnected to the first space portion 381 is also opened to theatmosphere. Accordingly, the liquid LQ in the first space 351 cansmoothly flow into the third space 353 and the first space portion 381via the first aperture 339. As a result, it is possible to suppress theextension of the immersion space LS.

In this embodiment, the recovery portion 360 is constructed so that theliquid LQ recovered from the first space portion 381 does not return tothe first space portion 381. That is, the liquid LQ from the first spaceportion 381 is collected in the recess portion 361. Accordingly, forexample, when the porous member 364 of the recovery portion 360 iscontaminated, it is possible to suppress the liquid LQ coming intocontact with the porous member 364 (the liquid LQ which might becontaminated) from returning (reversely flowing) to the first space 351and the optical path of the exposure light EL via the first spaceportion 381. Accordingly, it is possible to prevent the generation ofthe exposure failure.

When the porous member 364 is contaminated, it is possible to preventthe contamination of the liquid LQ coming in contact with the porousmember 364 by replacing the contaminated porous member 364 with a newporous member 364.

The liquid guide portion 383 (the sixth surface 346) disposed betweenthe top end portion 345T and the recess portion 361 may not be disposed.That is, the recess portion 361 may be disposed adjacent to the top endportion 345T.

In the above-mentioned embodiment, the supply port 375 is disposed inthe third surface 343, but may be disposed in the first surface 341.That is, the supply port 375 may be disposed in the first surface 341 tobe directed to the downside.

In the above-mentioned embodiment, the porous member 364 is disposed inthe recovery port 362 of the recovery portion 360 so as to pass only theliquid LQ from one side to the other side of the porous member 364, butthe recovery port 362 may recover the liquid LQ along with the gas. Theporous member may not be disposed in the recovery port 362.

In the above-mentioned embodiment, the liquid LQ in the first space 351flows into the first space portion 381 via the first aperture 339through which the exposure light EL passes, but an aperture differentfrom the first aperture 339 through the exposure light EL passes may bedisposed in at least a part of the first surface 341 opposed to thesurface of the substrate P and the liquid LQ in the first space 351 maybe made to flow into the first space portion 381 via the aperture.

In the above-mentioned embodiments, the gas supply port 374 may not beprovided.

In the above-mentioned embodiment, when the movement of the interfaceLG1 of the liquid LQ can be suppressed by the gas from the gas supplyport 374, the second surface 342 may not be disposed lower than thefirst surface 341.

In the above-mentioned embodiment, at least a part of the second surface342 may not be lyophobic to the liquid LQ.

In the above-mentioned embodiment, the member having the first surface341 and the member having the second surface 342 may not be the same aseach other. The member having the third surface 343 may be a memberdifferent from at least one of the member having the first surface 341and the member having the second surface 342.

In the above-mentioned embodiments, the first surface 341 may not bedisposed between the emission surface 23 and the substrate P. In thiscase, the first surface 341 may be flush with the emission surface 23,or may be disposed higher than the emission surface 23.

In the above-mentioned embodiments, the surface of the final opticalelement 22 through which the exposure light EL does not pass may notinclude the surface (side surface 35A) extending upward (in the +Zdirection) from the edge of the emission surface 23. For example, thesurface of the final optical element 22 through which the exposure lightEL does not pass may extend in a direction substantially parallel to theemission surface 23 (in a direction perpendicular to the optical axisAX).

The side surface 35 of the projection optical system PL through whichthe exposure light EL does not pass may be disposed at the same heightas (may be flush with) the emission surface 23 in at least a part of thesurrounding of the emission surface 23. That is, the side surface 35 maynot extend upward from the edge of the emission surface 23 but mayextend in the radial direction about the optical axis AX. The sidesurface 35 may be substantially parallel to the optical axis AX. Thatis, the side surface 35 may not extend in the radial direction about theoptical axis AX, but may extend upward from the edge of the emissionsurface 23.

In the above-mentioned embodiment, the first space portion 381 intowhich the liquid LQ flows via the first aperture 339 is opened to theatmosphere via the second space portion 382 and the liquid LQoverflowing from the first space portion 381 is recovered by therecovery portion 360. However, the first space portion 381 and thesecond space portion 382 may be set to form a substantially closed spaceand thus the fluid (the liquid LQ and/or the gas) in the first spaceportion 381 and/or the second space portion 382 may be recovered by therecovery portion 360.

In the above-mentioned embodiment, the liquid LQ flowing into the secondspace portion 382 is recovered by the recovery portion 360, but arecovery portion recovering the liquid LQ in the first space portion 381may be provided instead of the recovery portion 360 or in addition tothe recovery portion 360.

Fourteenth Embodiment

A fourteenth embodiment of the invention will be described below. FIG.25 is a diagram schematically illustrating the configuration of anexposure apparatus EX according to the fourteenth embodiment of theinvention. In the following description, the elements equal orequivalent to those of the above-mentioned embodiment are referenced bylike reference numerals and signs, and are described in brief or are notrepeatedly described.

As shown in FIG. 25, in this embodiment, the exposure apparatus EXincludes an immersion member 404 which can form an immersion space LS soas to fill at least a part of the optical path of the exposure light ELwith the liquid LQ.

The immersion member 404 is disposed in at least a part of a surroundingof the optical path of the exposure light EL so as to fill the opticalpath of the exposure light EL emitted from the emission surface 23 withthe liquid LQ. The immersion member 404 forms the immersion space LS sothat the optical path of the exposure light EL between the emissionsurface 23 and an object disposed at the position opposed to theemission surface 23 is filled with the liquid LQ. The immersion space LSis a portion (space or region) filled with the liquid LQ. In thisembodiment, the object includes at least one of the substrate stage 2(plate member T) and the substrate P held on the substrate stage 2.During the exposure of the substrate P, the immersion member 404 formsthe immersion space LS so that the optical path of the exposure light ELbetween the final optical element 22 and the substrate P is filled withthe liquid LQ.

The immersion member 404 is disposed in the vicinity of the finaloptical element 22. In this embodiment, the immersion member 404 issupported by a support mechanism 28. In this embodiment, the supportmechanism 28 is supported by the first plate 13. In this embodiment, theimmersion member 404 is suspended from the first plate 13 with thesupport member 28 interposed therebetween.

FIG. 26 is a partially enlarged view of the immersion member 404. Asshown in FIG. 26, the immersion member 404 includes a first member 431and a second member 432. In this embodiment, the first member 431 andthe second member 432 are annular members. At least a part of the firstmember 431 is disposed in the vicinity of a partial optical path of theexposure light EL and the final optical element 22. At least a part ofthe second member 432 is disposed in the vicinity of the first member431. In this embodiment, the outer shapes of the first member 431 andthe second member 432 in the XY plane are circular. The outer shapes ofthe first member 431 and the second member 432 may be other shapes (forexample, rectangular).

In this embodiment, the second member 432 is connected to a part of thefirst member 431 via a connection member (not shown). By supporting thesecond member 432 by the use of the support mechanism 28 and fixing theposition of the second member 432, the position of the first member 431is also fixed.

The immersion member 404 includes a first surface 441 disposed in atleast a part of a surrounding of the optical path of the exposure lightEL emitted from the emission surface 23, a second surface 442 disposedin at least a part of a surrounding of the first surface 441, a firstspace portion 481 which the side surface 35 of the projection opticalsystem PL extending upward from the edge of the emission surface 23 andin the radial direction about the optical axis AX of the projectionoptical system PL (in the direction perpendicular to the optical axisAX) faces and which is opened to the atmosphere, a second space portion482 into which the liquid LQ can flow from the first aperture 433disposed between the first surface 441 and the second surface 442 andwhich is opened to the atmosphere via the second aperture 434 differentfrom the first aperture 433, and a recovery portion 460 of which atleast a part is disposed at a position opposed to the side surface 35 ofthe projection optical system PL and which recovers at least a part ofthe liquid LQ, which has flown into the second space portion 482 fromthe first aperture 433, via the second aperture 434.

In this embodiment, the first surface 441 is disposed in the firstmember 431. The second surface 442 is disposed in the second member 432.The first surface 441 and the second surface 442 can be opposed to thesurface (top surface) of the object disposed below the immersion member404. In this embodiment, the outer shapes of the first surface 441 andthe second surface 442 in the XY plane are circular. The inner edge ofthe second surface 442 in the XY plane has a circular shape.

In this embodiment, the first surface 441 and the second surface 442cannot recover the liquid LQ. That is, in this embodiment, the firstsurface 441 and the second surface 442 are not provided with a liquidrecovery port. In this embodiment, the first surface 441 and the secondsurface 442 are flat. A first space 451 between the first surface 441and the surface (top surface) of the object can hold the liquid LQ. Inthis embodiment, the first surface 441 and the second surface 442 areparallel to the XY plane (horizontal plane), but at least a part of thefirst surface 441 and/or the second surface 442 may be tilted about theXY plane or at least one of the first surface 441 and the second surface442 may not be parallel to each other. In this embodiment, the firstsurface 441 and the second surface 442 may include a curved surface.

In at least a part of the exposure of the substrate P, the emissionsurface 23, the first surface 441, and the second surface 442 areopposed to the surface of the substrate P. In at least a part of theexposure of the substrate P, the liquid LQ is filled in the spacebetween the emission surface 23 and the surface of the substrate P. Inat least a part of the exposure of the substrate P, the liquid LQ isheld in the first space 451 between the first surface 441 and thesurface of the substrate P. The substrate P is exposed with the exposurelight EL from the emission surface 23 through the liquid LQ between theemission surface 23 and the surface of the substrate P.

In this embodiment, a part of the immersion space LS is formed by theliquid LQ held between the first surface 441 and the object. In thisembodiment, the immersion space LS is formed so that a partial region ofthe surface of the substrate P including the projection region PR iscovered with the liquid LQ when the substrate P is being illuminatedwith the exposure light EL. A gas-liquid interface (meniscus, edge) LG1of the liquid LQ in the immersion space LS can be formed between atleast one of the first surface 441 and the second surface 442 and thesurface of the substrate P, but is preferably formed between the inneredge of the second surface 442 and the substrate P. The exposureapparatus EX according to this embodiment employs a local immersionmethod.

For the purpose of convenient explanation, it is assumed that thesubstrate P is disposed at a position opposed to the emission surface23, the first surface 441, and the second surface 442 and the liquid LQis held between the immersion member 404 and the substrate P to form theimmersion space LS. As described above, the immersion space LS can beformed between the emission surface 23 and the immersion member 404 andanother member (such as the plate member T of the substrate stage 2).

In this embodiment, the side surface 35 of the projection optical systemPL includes at least one of the side surface 35A of the final opticalelement 22 and the outer surface 35B of the holding member 21. The sidesurface 35A of the final optical element 22 is a surface different fromthe emission surface 23 and a surface through which the exposure lightEL does not pass. The side surface 35A is disposed around the emissionsurface 23. The side surface 35A extends upward from the edge of theemission surface 23 and in the radial direction (in the directionperpendicular to the optical axis AX) about the optical axis AX. Thatis, the side surface 35A is tilted to extend upward (in the +Zdirection) from the edge of the emission surface 23.

The holding member 21 holds the final optical element 22. The outersurface 35B of the holding member 21 is disposed around the side surface35A. The outer surface 35B is a surface through which the exposure lightEL does not pass. The outer surface 35B extends in the radial directionabout the optical axis AX.

In this embodiment, the second surface 442 is disposed lower than thefirst surface 441 (in the −Z direction). In this embodiment, the firstsurface 441 and the second surface 442 are substantially parallel to theXY plane. As shown in FIG. 26, the first surface 441 is opposed to thesurface of the substrate P with a first gap G1 interposed therebetweenand the second surface 442 is opposed thereto with a second gap G2interposed therebetween. The second gap G2 is smaller than the first gapG1.

In this embodiment, the first member 431 includes a first surface 441opposed to the surface of the substrate P, a third surface 443 opposedto at least a part of the emission surface 23 and directed in theopposite direction of the first surface 441, a fourth surface 444disposed around the third surface 443 and opposed to the side surface35A of the final optical element 22, and a fifth surface 445 disposedaround the fourth surface 444 and opposed to the outer surface 35B ofthe holding member 21. In this embodiment, the final optical element 22is held by the holding member 21 so as to expose the side surface 35,the end optical terminal 22 may be held by the holding member 21 so thatthe fifth surface 445 faces the holding member 21 or so that the sixthsurface 446 faces the final optical element 22.

The first member 431 includes a plate portion 437 of which at least apart is opposed to the emission surface 23 and a body portion 438 ofwhich at least a part is disposed around the final optical element 22.The first surface 441 and the third surface 443 are disposed in theplate portion 437. The fourth surface 444 and the fifth surface 445 aredisposed in the body portion 438. The plate portion 437 has an aperture439 through which the exposure light EL emitted from the emissionsurface 23 can pass. During the exposure of the substrate P, theexposure light EL emitted from the emission surface 23 is applied to thesurface of the substrate P via the aperture 439. In this embodiment, theaperture 439 is longitudinal in the X axis direction intersecting thescanning direction (the Y axis direction) of the substrate P.

The third surface 443 is opposed to the emission surface 23 with a thirdgap G3 interposed therebetween. The fourth surface 444 is opposed to theside surface 35A with a fourth gap G4 interposed therebetween. The fifthsurface 445 is opposed to the outer surface 35B with a fifth gap G5interposed therebetween.

In this embodiment, the third surface 443 and the emission surface 23are substantially parallel to each other. The fourth surface 444 and theside surface 35A are substantially parallel to each other. The fifthsurface 445 and the outer surface 35B are substantially parallel to eachother. The third surface 443 and the emission surface 23 may not beparallel to each other. The fourth surface 444 and the side surface 35Amay not be parallel to each other. The fifth surface 445 and the outersurface 35B may not be parallel to each other.

The first member 431 includes a sixth surface 446 disposed around thefirst surface 441. The sixth surface 446 are disposed in the bodyportion 438. In this embodiment, the fourth surface 444 and the sixthsurface 446 are substantially parallel to each other. The fourth surface444 and the sixth surface 446 may not be parallel to each other.

In this embodiment, the second member 432 includes a second surface 442opposed to the surface of the substrate P, a seventh surface 447connected to the inner edge of the second surface 442 and disposed toface the optical path of the exposure light EL, an eighth surface 448opposed to the sixth surface 446, and a ninth surface 449 disposedaround the eighth surface 448.

The eighth surface 448 is opposed to the sixth surface 446 with a sixthgap G6 interposed therebetween. In this embodiment, the eighth surface448 and the sixth surface 446 are substantially parallel to each other.The eighth surface 448 and the sixth surface 446 may not be parallel toeach other.

The first space portion 481 includes a first portion 481A and a secondportion 481B. The first portion 481A includes the space between the sidesurface 35A and the fourth surface 444. The first portion 481A extendsin the radial direction about the optical axis AX and to the upside (inthe +Z direction). The second portion 481B includes the space betweenthe outer surface 35B and the fifth surface 445 and the ninth surface449. The second portion 481B fluidically communicates with the top endof the first portion 481A. The second portion 481B extends in the radialdirection about the optical axis AX.

The first portion 481A may be parallel to the optical axis AX. Thesecond portion 481B may not be perpendicular to the optical axis AX.

The second space portion 482 includes the space between the sixthsurface 446 and the eighth surface 448. The second space portion 482extends in the radial direction about the optical axis AX and to theupside (in the +Z direction). In this embodiment, the bottom end portion448B of the eighth surface 448 defines the bottom end of the secondspace portion 482. The top end portion 448T of the eighth surface 448defines the top end of the second space portion 482. The space betweenthe sixth surface 446 and the eighth surface 448 may be parallel to theoptical axis AX.

The first aperture 433 is disposed at the bottom end of the second spaceportion 482. In this embodiment, the first aperture 433 faces the firstspace 451. The second aperture 434 is disposed at the top end of thesecond space portion 482. The second aperture 434 faces the first spaceportion 481. In this embodiment, the second aperture 434 faces thesecond portion 481B.

In at least a part of the exposure of the substrate P, the firstaperture 433 is opposed to the surface of the substrate P. At least apart of the liquid LQ on the substrate P can be made to flow in thesecond space portion 482 via the first aperture 433. In this embodiment,the first aperture 433 is substantially flush with the first surface441. The first aperture 433 may not be directed to the downside (in the−Z direction). For example, the first aperture 433 may be disposed in aseventh surface 447 to be described later. The first aperture 433 may beformed in an annular shape by an aperture or may be formed by pluralapertures arranged in an annular shape with a predetermined gap.Similarly, the second space portion 482 may be formed by plural spaceportions arranged in an annular shape with a predetermined gap aroundthe optical axis AX.

The recovery portion 460 recovers at least a part of the liquid LQ,which flows into the second space portion 482 via the first aperture433, via the second aperture 434. The recovery portion 460 recovers theliquid LQ overflowing from the second space portion 482. At least a partof the recovery portion 460 is disposed outside the top end portion 448Tin the radial direction about the optical axis AX. At least a part ofthe recovery portion 460 is opposed to the outer surface 35B in thesecond portion 481B.

In this embodiment, the recovery portion 460 includes a recess portion461 disposed upward (in the +Z direction) outside the second spaceportion 482 in the radial direction about the optical axis AX. Therecess portion 461 is disposed in the second member 432. The recessportion 461 includes an opening 461K directed to the upside. Therecovery portion 460 recovers the liquid LQ flowing into the recessportion 461 via the opening 461K.

The recess portion 461 is disposed outside the top end portion 448T inthe radial direction about the optical axis AX. In this embodiment, therecess portion 461 is disposed around the ninth surface 449. In the XYplane, the recess portion 461 has an annular shape. The recess portion461 may be formed by plural recess portions arranged in an annular shapewith a predetermined gap. In this embodiment, the second member 432includes a tenth surface 470 disposed around the recess portion 461. Thetenth surface 470 is substantially parallel to the XY plane. In thisembodiment, the tenth surface 470 is flush with the ninth surface 449.The tenth surface 470 may be disposed higher than the ninth surface 449(in the +Z direction).

The recess portion 461 includes a first inner surface 4611 connected tothe ninth surface 449, a second inner surface 4612 connected to thetenth surface 470 and opposed to the first inner surface 4611, and abottom surface 4613 disposed between the first inner surface 4611 andthe second inner surface 4612. The bottom surface 4613 is directed tothe upside (in the +Z direction). The bottom surface 4613 is disposedlower than the top end portion 448T (in the −Z direction). In thisembodiment, the bottom surface 4613 is substantially parallel to the XYplane. The bottom surface 4613 may not be parallel to the XY plane. Forexample, the bottom surface 4613 may be tilted about the XY plane. Thebottom surface 4613 may include a curved surface.

The recovery portion 460 includes a liquid guide portion 480 guiding theliquid LQ from the second space portion 482 to the recess portion 461.In this embodiment, the liquid guide portion 480 includes the ninthsurface 449. In this embodiment, the liquid guide portion 480 includesthe space between the outer surface 35B and the ninth surface 449. Theliquid guide portion 480 extends in the radial direction about theoptical axis AX from the top end portion 448T. In this embodiment, theliquid guide portion 480 is perpendicular to the optical axis AX(parallel to the XY plane), but may not be perpendicular to the opticalaxis AX. For example, the ninth surface 449 may be tilted to thedownside from the top end portion 448T.

The recess portion 461 is disposed outside the liquid guide portion 480in the radial direction about the optical axis AX from the top endportion 448T. The liquid LQ overflowing from the top end of the secondspace portion 482 is guided by the liquid guide portion 480 and flows inthe recess portion 461.

The recess portion 461 can gather the liquid LQ from the second spaceportion 482. The recess portion 461 suppresses the liquid LQ from thesecond space portion 482 from returning to the second space portion 482,by collecting the flowing liquid LQ. That is, the recess portion 461 atleast serves as a part of a reservoir portion collecting the liquid LQfrom the second space portion 482 so as not to return to the secondspace portion 482.

The recovery portion 460 includes a recovery port 462 recovering theliquid LQ flowing in the recess portion 461. The recovery port 462recovers the liquid LQ collected by the recess portion 461.

In this embodiment, the recovery port 462 is disposed in the recessportion 461. In other words, the recovery port 462 is disposed lowerthan the opening 461K of the recess portion 461 (in the −Z direction).In this embodiment, the recovery portion 462 is disposed in the bottomsurface 4613 of the recess portion 461. That is, the bottom surface 4613of the recess portion 461 includes at least a part of the recovery port462.

In this embodiment, the recovery port 462 has an annular shape in the XYplane. The recovery port 462 may be divided and disposed at pluralposition around the optical axis AX.

A porous member 464 is disposed in the recovery port 462. The porousmember 464 is a plate-like member including plural openings or pores.The porous member 464 may be a mesh filter which is a porous memberhaving plural small pores formed in meshes shapes.

The first space portion 481 is opened to the atmosphere. As describedabove, the second portion 481B includes the space between the outersurface 435B and the fifth surface 445 and the ninth surface 449. Inthis embodiment, the second portion 481B includes the space between theouter surface 35B and the recess portion 461 and the space between theouter surface 35B and the tenth surface 470. The space between the outersurface 35B and the tenth surface 470 is opened to the atmosphere viathe third aperture 472.

The second space portion 482 is opened to the atmosphere via the secondaperture 434. The second aperture 434 faces the first space portion 481(the second portion 481B). In this embodiment, the second space portion482 is opened to the atmosphere via the second aperture 434, the secondportion 481B, and the third aperture 472. That is, the second spaceportion 482 is opened to the space around the immersion member 404 viathe second aperture 434 different from the first aperture 433. In otherwords, the second space portion 482 is opened to the gas space coming incontact with the interface of the liquid LQ in the immersion space LSvia the second aperture 434. Similarly, the first space portion 481 isopened to the gas space (the inner space 8) around the immersion member404.

In this embodiment, the “atmosphere” is a gas surrounding the immersionmember 404. In this embodiment, the gas surrounding the immersion member404 is a gas in the inner space 8 formed by the chamber 5. In thisembodiment, the chamber 5 fills the inner space 8 with a clean gas usingthe environment controller 5B. The chamber 5 adjusts the inner space 8substantially to the atmospheric pressure using the environmentcontroller 5B. The pressure of the inner space 8 may be set to be higherthan the atmospheric pressure.

In this embodiment, the immersion member 404 includes a preventer 490preventing at least a part of the liquid LQ flowing into the secondspace portion 482 from flowing into the first portion 481A from thesecond portion 481B.

In this embodiment, the preventer 490 includes a wall portion(protruding portion) 492 formed in the fifth surface 445. The wallportion 490 includes an opposing surface (top surface) 491 opposed tothe outer surface 35B. In this embodiment, the opposing surface 491 andthe outer surface 35B are substantially parallel to each other. Theopposing surface 491 is opposed to the outer surface 35B with a seventhgap G7 interposed therebetween. The seventh gap G7 between the opposingsurface 491 and the outer surface 35B is smaller than the fifth gap G5between the fifth surface 445 and the outer surface 35B formed in thewall portion 492 close to the second portion 481B. The seventh gap G7 issmaller than the gap between the ninth surface 449 and the outer surface35B formed in the wall portion 492 close to the second portion 481B.

In this embodiment, the second surface 442 is lyophobic to the liquidLQ. In the second surface 442, a contact angle of the liquid LQ is equalto or greater than 90° and may be equal to or greater than 100°. In thisembodiment, the second surface 442 is formed of a film 473A which islyophobic to the liquid LQ. The film 473A is formed of, for example, alyophobic material containing fluorine. Examples of the lyophobicmaterial include PEA (Tetra Fluoro Ethylene-perfluoro alkylvinyl ethercopolymer), PTFE (Poly Tetra Fluoro Ethylene), PEEK(PolyEtherEtherKetone), and Teflon (registered trademark).

In this embodiment, the seventh surface 447 is also lyophobic to theliquid LQ. The seventh surface 447 is also formed of the film 473A. Atleast one of the second surface 442 and the seventh surface 447 may notbe a surface of a lyophobic film. For example, the second member 432 maybe formed of a lyophobic material.

In this embodiment, the opposing surface 491 of the wall portion 492 islyophobic to the liquid LQ. In the opposing surface 491, the contactangle of the liquid LQ is equal to or greater than 90° and may be equalto or greater than 100°. In this embodiment, the opposing surface 491 isformed of a film 473B which is lyophobic to the liquid LQ. The film 473Bmay be formed of a material equal to or different from the film 473A.The opposing surface 491 may not be the surface of a lyophobic film. Forexample, the wall portion 492 may be formed of a lyophobic material.

The outer surface 35B opposed to the opposing surface 91 may belyophobic to the liquid LQ. Both the opposing surface 91 and the outersurface 35B may be lyophobic to the liquid LQ.

In this embodiment, the immersion member 404 includes an gas supply port474 disposed in at least a part of a surrounding of the first aperture433. In this embodiment, the gas supply port 474 is disposed in thesecond surface 442. The gas supply port 474 supplies a gas to thesurface of the object (substrate P) opposed to the second surface 442.

In this embodiment, the gas supply port 474 has an annular shape in theXY plane. The gas supply port 474 may be divided and arranged at pluralpositions around the optical axis AX.

In this embodiment, the immersion member 404 includes a supply port 475supplying the liquid LQ to the optical path of the exposure light EL.The supply port 475 is disposed at a position opposed to a surface ofthe final optical element 22 through which the exposure light EL doesnot pass. In this embodiment, the supply port 475 is disposed at theposition opposed to the side surface 35A of the final optical element22. That is, the supply port 475 is disposed to face the first portion481A of the first space portion 481. The supply port 475 may not beopposed to the side surface 35A of the final optical element 22. Forexample, the supply port 475 may be disposed in the first member 431 soas to face the space between the third surface 443 and the emissionsurface 23.

In this embodiment, the supply ports 475 are disposed on the +Y side and−Y side about the optical axis AX, respectively. The supply ports 475may be disposed on the +X side and −X side about the optical axis AX,respectively. The number of supply ports 475 may be equal to or greaterthan 3.

In this embodiment, the supply port 475 supplies the liquid LQ to thefirst portion 481A. The liquid LQ supplied to the first portion 481Aflows downward in the first portion 481A and is supplied to the opticalpath of the exposure light EL emitted from the emission surface 23 viathe space between the emission surface 23 and the third surface 443. Atleast a part of the liquid LQ supplied from the supply port 475 issupplied to the first space 451 between the first surface 441 and thesurface of the substrate P via the aperture 439.

The supply port 475 is connected to a liquid supply device (not shown)via a supply flow channel. At least a part of the supply flow channel isformed in the immersion member 404. The liquid supply device can supplythe clean liquid LQ adjusted in temperature to the supply port 475.

The recovery port 462 is connected to a liquid recovering device 477 viaa recovery flow channel. At least a part of the recovery flow channel isformed in the immersion member 404 (the second member 32). The liquidrecovering device 477 includes a vacuum system (such as a valvecontrolling a connection state between a vacuum source and the recoveryport 462) and can suct and recover the liquid LQ from the recovery port462.

The gas supply port 474 is connected to a gas supply device 478 via agas supply channel. At least a part of the gas supply channel is formedin the immersion member 404 (the second member 32). The gas supplydevice 478 can supply a clean gas adjusted in temperature and humidityto the gas supply port 474. The humidity of the gas supplied from thegas supply port 474 is preferably equal to or higher than the humidityof the gas supplied to the inner space 8 by the environment controller5B.

The control apparatus 7 can control the liquid recovering device 477 tocontrol a difference in pressure between at the bottom surface and atthe top surface of the porous member 464 so that only the liquid LQpasses from the top surface side (the first space portion 481) of theporous member 464 to the bottom surface side (recovery flow channel). Inthis embodiment, the pressure of the top-surface space is opened to theatmosphere and is controlled by the chamber 5. The control apparatus 7controls the liquid recovering device 477 so that only the liquid LQpasses from the top surface side of the porous member 464 to the bottomsurface side thereof and adjusts the pressure of the bottom surface sideon the basis of the pressure of the top surface side. That is, thecontrol apparatus 7 makes a control so as to recover only the liquid LQvia the pores of the porous member 464 and so as for the gas not to passthrough the pores of the porous member 464. The technique of adjustingthe difference in pressure between at one side and at the other side ofthe porous member 464 so as to pass only the liquid LQ from one side ofthe porous member 464 to the other side is disclosed, for example, inthe specification of U.S. Pat. No. 7,292,313.

A method of exposing the substrate P using the exposure apparatus EXhaving the above-mentioned configuration will be described below.

First, the control apparatus 7 moves the substrate stage 2 holding thesubstrate P so that the emission surface 23 and the first surface 441opposed to the surface of the substrate P (or the top surface 426 of thesubstrate stage 2). The first surface 441 and the surface of thesubstrate P are opposed to each other with the first gap G1 interposedtherebetween and the second surface 442 and the surface of the substrateP are opposed to each other with the second gap G2 interposedtherebetween.

The control apparatus 7 sends out the liquid LQ from the liquid supplydevice in the state where the first surface 441 and the second surface442 are opposed to the surface of the substrate P. The control apparatus7 activates the liquid recovering device 477. The control apparatus 7activates the gas supply device 478.

The liquid LQ sent from the liquid supply device is supplied to thefirst portion 481A from the supply port 475. The liquid LQ supplied tothe first portion 481A flows downward in the first portion 481A and isthen supplied to the optical path of the exposure light EL emitted fromthe emission surface 23. Accordingly, the optical path of the exposurelight EL is filled with the liquid LQ.

At least a part of the liquid LQ supplied to the first portion 481A fromthe supply port 475 is supplied to the first space 451 via the aperture439 and is held between the first surface 441 and the surface of thesubstrate P. In this embodiment, the immersion space LS is formed sothat the space surrounded with the surface of the substrate P, the firstsurface 441, and the seventh surface 447 is almost filled with theliquid LQ. The interface LG1 of the liquid LQ (the immersion space LS)is formed between the inner edge (the bottom end of the seventh surface447) of the second surface 442 and the surface of the substrate P.

At least a part of the liquid LQ supplied to the first space 451 fromthe aperture 439 flows into the second space portion 482 via the firstaperture 433.

In this embodiment, the liquid LQ supplied to the first space 451 viathe aperture 439 is suppressed from flowing into the second space 452between the second surface 442 and the surface of the substrate P. Thatis, in this embodiment, the interface LG1 of the liquid LQ in theimmersion space LS in the XY plane is suppressed from moving to theoutside from the seventh surface 447, thereby suppressing the extensionof the immersion space LS.

In this embodiment, the first surface 441 is opposed to the surface ofthe substrate P with the first gap G1 interposed therebetween and thesecond surface 442 disposed around the first surface 441 is opposed tothe surface of the substrate P with the second gap G2 interposedtherebetween. The second gap G2 is smaller than the first gap G1 and is,for example, about in the range of 0.1 to 0.3 mm. Accordingly, theinterface LG1 is suppressed from moving to the outside of the firstaperture 33 in the radial direction about the optical axis AX. That is,since the second gap G2 is small, the position of the interface LG1 isheld between the inner edge of the second surface 442 and the surface ofthe substrate P due to the surface tension of the liquid LQ, as shown inFIG. 26 and the like. Accordingly, the liquid LQ in the immersion spaceLS is suppressed from flowing into the second space 452.

In this embodiment, since the second surface 442 is lyophobic to theliquid LQ, the liquid LQ is more effectively suppressed from flowinginto the second space 452. In this embodiment, since the seventh surface447 is disposed so as to extend upward from the inner edge of the secondsurface 442 and to face the optical path, the extension of the immersionspace LS is suppressed. Since the seventh surface 447 is lyophobic tothe liquid LQ, the extension of the immersion space LS is alsosuppressed.

In this embodiment, the gas supply port 474 is disposed and the gas issupplied to the surface of the substrate P on the outside of the inneredge of the second surface 442 about the optical axis. Accordingly, theextension of the immersion space LS is suppressed by the force of thegas supplied from the gas supply port 474. That is, the gas supply port474 forms a gas seal between the surface of the substrate P and thesecond surface 442. Accordingly, the leakage of the liquid LQ issuppressed and thus the movement of the interface LG1 is restricted.

In this embodiment, the outer shape of the first surface 441 and theinner edge of the second surface 442 are circular and the outer shape ofthe immersion space LS in the XY plane is almost circular. Accordingly,the binding force acting to the center from all the sides of theinterface LG1 of the immersion space LS almost uniformly acts.Accordingly, the extension of the immersion space LS is effectivelysuppressed.

By supplying the liquid LQ from the supply port 475 in the state wherethe extension of the immersion space LS is suppressed, the liquid LQflows into the second space portion 482 opened to the atmosphere and theposition of the surface of the liquid LQ in the second space portion 482moves in the +Z direction (rises). In this embodiment, since the secondaperture 434 is opened to the atmosphere, the liquid LQ in the firstspace 451 smoothly flows into the second space portion 482 via the firstaperture 433.

When the second space portion 482 is filled with the liquid LQ, at leasta part of the liquid LQ in the second space portion 482 overflows fromthe top end (the top end portion 448T) of the second space portion 482.The liquid LQ overflowing from the second space portion 482 is recoveredby the recovery portion 460 disposed outside the top end of the secondspace portion 482. That is, the liquid LQ overflowing from the secondspace portion 482 is guided by the liquid guide portion 480 and thenflows into the recess portion 461. The liquid LQ flowing into the recessportion 461 is recovered from the recovery port 462 (the porous member464).

In this embodiment, since the difference in pressure between at the topsurface side and at the bottom surface side of the porous member 464 iscontrolled so that only the liquid LQ passes from the top surface to thebottom surface of the porous member 464, the recovery portion 460 canrecover the liquid LQ while suppressing the vibration and thevaporization heat from being generated.

In this embodiment, since the recovery portion 460 collects the liquidLQ on the substrate P recovered via the first aperture 433 and thesecond space portion 482 into the recess portion 461, it is possible tosuppress the liquid LQ recovered via the second space portion 482 fromreturning to the second space portion 482. Since the liquid LQ from thesecond space portion 482 is collected in the recess portion 461 so thatthe liquid LQ recovered via the second space portion 482 does not returnto the second space portion 482, the liquid LQ coming into contact withthe porous member 464 is suppressed from returning to the first space451 and the optical path of the exposure light EL via the second spaceportion 482.

In this embodiment, the preventer 490 having the wall portion 492prevents the liquid LQ in the second portion 481B from flowing into thefirst portion 481A. Accordingly, for example, the liquid LQ coming incontact with the porous member 464 is prevented from returning to thefirst space 451 and the optical path of the exposure light EL via thefirst space portion 481 (the first portion 481A).

The leakage of the liquid LQ from the first portion 481A to the secondportion 481B is suppressed by the wall portion 492. However, even whenthe liquid LQ leaks from the first portion 481A to the second portion481B, the liquid LQ leaking via the seventh gap G7 from the firstportion 481A can be recovered by the recovery portion 460.

A method of exposing the substrate P will be described now. As describedabove, the control apparatus 7 supplies the liquid LQ from the supplyport 475 and holds the liquid LQ between the first surface 441 and thesurface of the substrate P so as to fill the optical path of theexposure light EL with the liquid LQ, thereby forming the immersionspace LS. At least a part of the liquid LQ on the substrate P flows intothe second space portion 482 via the first aperture 433. The recoveryportion 460 recovers the liquid LQ from the second space portion 482.The control apparatus 7 performs a liquid recovering operation using therecovery portion 460 along with a liquid supply operation using thesupply port 475 and forms the immersion space LS so as to fill theoptical path of the exposure light EL with the liquid LQ. The controlapparatus 7 continuously supplies the gas from the gas supply port 474to form the gas seal.

The control apparatus 7 starts the exposure of the substrate P whilesuppressing the liquid recovered from the second space portion 482 tothe recovery portion 460 from returning to the first space 451 (theoptical path of the exposure light EL) via the second space portion 482and the first space portion 481 and restricting the extension of theimmersion space LS using the second gap G2 or the like.

The control apparatus 7 controls the illumination system IL to emit theexposure light EL and illuminates the mask M with the exposure light EL.The exposure light EL from the mask M is emitted from the emissionsurface 23 of the projection optical system PL. The control apparatus 7illuminates the substrate P with the exposure light EL from the emissionsurface 23 via the liquid LQ between the emission surface 23 and thesubstrate P. Accordingly, the pattern image of the mask M is projectedto the substrate P and the substrate P is exposed with the exposurelight EL. During the exposure of the substrate P, the liquid LQ suppliedfrom the supply port 475 flows via the first aperture 433 and isrecovered by the recovery portion 460 via the second space portion 482.

As described above, in this embodiment, since the first space portion481 and the second space portion 482 opened to the atmosphere areprovided and the liquid LQ flowing into the second space portion 482 isrecovered by the recovery portion 460, it is possible to simplify thestructure of the bottom surface of the immersion member 404 opposed tothe surface of the substrate P. Accordingly, it is possible to suppressforeign materials from being attached to the bottom surface of theimmersion member 404 coming in contact with the liquid LQ or to suppressthe bottom surface from being contaminated.

For example, when the structure (shape) is complicated by disposing therecovery port recovering the liquid LQ in the bottom surface of theimmersion member 404 opposed to the surface of the substrate P ordisposing the porous member in the recovery port, foreign materials maybe easily attached to the bottom surface. For example, when the porousmember is disposed at a position opposed to the surface of the substrateP, the foreign materials (for example, the photosensitive film formingthe surface of the substrate P or a part of an overcoat film) generatedfrom the substrate P may be attached to the porous member. When theattached foreign materials are emitted to the optical path of theexposure light EL or are mixed into the liquid LQ in the immersion spaceLS during the exposure of the substrate P, the exposure failure such asa pattern defect caused in the substrate P may be caused. When thestructure (shape) of the bottom surface is complicated, for example,when plural recess and convex portions exist, the foreign materialsgenerated from the substrate P may be easily attached to the bottomsurface.

According to this embodiment, the second space portion 482 opened to theatmosphere is provided, the liquid LQ flowing into the second spaceportion 482 via the first aperture 433 through which the exposure lightEL passes is recovered by the recovery portion 460 disposed at theposition not opposed to the surface of the substrate P, and the bottomsurface of the immersion member 404 opposed to the surface of thesubstrate P has a simple structure. Accordingly, it is possible tosuppress the foreign materials from being attached to the bottom surfaceof the immersion member 404. Since the structure of the bottom surfaceof the immersion member 404 is simple, it is possible to smoothly andreliably clean the bottom surface of the immersion member 404 even whenthe foreign materials are attached to the bottom surface of theimmersion member 404.

In this embodiment, the recovery portion 460 is constructed so that theliquid LQ recovered from the second space portion 482 does not return tothe second space portion 482. That is, the liquid LQ from the secondspace portion 482 is collected in the recess portion 461. Accordingly,for example, when the porous member 464 of the recovery portion 460 iscontaminated, it is possible to suppress the liquid LQ coming in contactwith the porous member 464 (the liquid LQ which might be contaminated)from returning (reversely flowing) to the first space 451 and theoptical path of the exposure light EL via the second space portion 482.Accordingly, it is possible to prevent the generation of the exposurefailure.

In this embodiment, the liquid LQ recovered from the second spaceportion 482 and collected in the second portion 481B does not return tothe first portion 481A by the preventer 490. Accordingly, for example,when the porous member 464 of the recovery portion 460 is contaminated,it is possible to suppress the liquid LQ coming in contact with theporous member 464 (the liquid LQ which might be contaminated) fromreturning (reversely flowing) to the first space 451 and the opticalpath of the exposure light EL via the first portion 481A. Accordingly,it is possible to prevent the generation of the exposure failure.

Fifteenth Embodiment

A fifteenth embodiment of the invention will be described below. In thefollowing description, the elements equal or equivalent to those of theabove-mentioned embodiment are referenced by like reference numerals andsigns, and are described in brief or are not repeatedly described.

FIG. 27 is a diagram illustrating an example of an immersion member 404Baccording to the fifteenth embodiment of the invention. In FIG. 27, theimmersion member 404B includes a first member 431B having the firstsurface 441 and a second member 432B having the second surface 442.

The immersion member 404B according to this embodiment is a modifiedexample of the immersion member 404 according to the fourteenthembodiment. Accordingly, the explanation described in the fourteenthembodiment is not repeated. As shown in FIG. 27, the fifteenthembodiment is different from the fourteenth embodiment, in that thesecond aperture 434 is disposed to face the side surface 35A and thesupply port 475B supplying the liquid LQ faces to the third space 453between the emission surface 23 and the third surface 443.

In this embodiment, the liquid LQ overflowing from the second spaceportion 482 (the top end portion 1148T) is recovered by the recoveryportion 460 via the liquid guide portion 480. In this embodiment, it ispossible to for the immersion space LS reliably.

In the above-mentioned embodiments, the porous member 464 is disposed inthe recovery port 462 of the recovery portion 460 so as to pass only theliquid LQ from one side to the other side of the porous member 464, butthe recovery port 462 may recover the liquid LQ along with the gas. Theporous member 464 may not be disposed in the recovery port 462.

In the above-mentioned embodiments, the gas supply port 474 may not beprovided.

In the above-mentioned embodiments, when the movement of the interfaceLG of the liquid LQ can be suppressed by the use of the gas from the gassupply port 474, the second surface 442 may not be disposed lower thanthe first surface 441.

In the above-mentioned embodiments, the first member 431 having thefirst surface 441 and the second member 432 having the second surface442 may be relatively movable in the direction parallel to the opticalaxis AX and/or perpendicular to the optical axis AX. That is, at leastone of the first member 431 and the second member 432 may be movablysupported. For example, the position of the second member 432 may bemade to move with the driving force of the actuator. The second gap G2can be adjusted by shifting the position of the second member in the Zdirection.

In the above-mentioned embodiments, the first surface 441, the secondsurface 442, and the second space portion 482 may be formed in a singlemember.

In the above-mentioned embodiments, the preventer 490 may have a gasseal mechanism. For example, by supplying the gas to the outer surface35B from the gas supply port disposed in the fifth surface 445 to form agas seal between the fifth surface 445 and the outer surface 35B, it ispossible to prevent the liquid LQ from flowing into the first portion481A from the second portion 481B. The gas supply port of the prevent490 may be disposed in the opposing surface 491 or in the outer surface35B. As the preventer 490, a liquid supply port supplying the liquid LQto the second portion 481B which the second aperture 434 faces may beprovided to prevent the liquid LQ from flowing into the first portion481A to the second portion 481B. On the other hand, the preventer 490and the like (such as the wall portion 492) may not be provided. In thiscase, it is preferable that the fifth surface 445 be disposed higherthan the ninth surface 449 (in the +Z direction), but the fifth surface445 and the ninth surface 449 have substantially the same height (aresubstantially flush with each other).

In the above-mentioned embodiments, the first surface 441 may not bedisposed between the emission surface 23 and the substrate P. In thiscase, the first surface 441 may be flush with the emission surface 23,or may be disposed higher than the emission surface 23.

In the above-mentioned embodiments, the surface of the final opticalelement 22 through which the exposure light EL does not pass may notinclude the surface (side surface 35) extending upward (in the +Zdirection) from the edge of the emission surface 23. For example, thesurface of the final optical element 22 through which the exposure lightEL does not pass may extend in a direction substantially parallel to theemission surface 23 (in a direction perpendicular to the optical axisAX). That is, the side surface 35 of the projection optical system PLmay be substantially flush with the emission surface.

The side surface 35 of the projection optical system PL through whichthe exposure light EL does not pass may have the same height as (may beflush with) the emission surface 23 in at least a part of thesurrounding of the emission surface 23. That is, the side surface 35 maynot extend upward from the edge of the emission surface 23 but mayextend in the radial direction about the optical axis AX. The sidesurface 35 may be substantially parallel to the optical axis AX. Thatis, the side surface 35 may not extend in the radial direction about theoptical axis AX, but may extend upward from the edge of the emissionsurface 23.

In the above-mentioned embodiments, the side surface 35A defining thefirst portion 481A may be a part of the holding member 21. The outersurface 35B defining the second portion 481B may be a part of the finaloptical element 22.

In the above-mentioned embodiments, a suction port may be disposed inthe second surface 442. For example, the suction port may not be usedduring the exposure of the substrate P but the suction port may be usedonly when all the liquid LQ is recovered from the space below the firstsurface 441.

In the above-mentioned embodiments, a supply port supplying the liquidLQ may be disposed in the first space 451 which the first surface 441faces. In this case, the supply port supplying the liquid LQ may bedisposed in the first surface 441.

In the above-mentioned embodiments, for example, a temperature adjustingmechanism disclosed in the specification US Patent Application Laid-OpenPublication No. 2008/0106707 may be disposed in the immersion members 4,304, and 404. For example, by causing a temperature adjusting liquid toflow to the flow channel formed in the immersion member, it is possibleto adjust the temperature of the immersion member.

In the above-mentioned embodiments, the emission-side (top-side) opticalpath of the final optical element 22 of the projection optical system PLis filled with the liquid LQ, but for example, as described in PCTPublication No. 2004/019128, a projection optical system in which theincidence-side (object-side) optical path of the final optical element22 is filled with the liquid LQ.

In the above-mentioned embodiments, the liquid LQ is water, but may be aliquid other than the water. For example, hydrofluoro ethyl (HFE),perfluoro polyether (PFPE), or Fomblin oil may be used as the liquid LQ.Various fluids such as a supercritical fluid may be used as the liquidLQ.

In the above-mentioned embodiments, a glass substrate for a displaydevice, a ceramic wafer for a thin-film magnetic head, or an originalplate (synthetic quartz, silicon wafer) of a mask or a reticle used inan exposure apparatus in addition to a semiconductor wafer used tomanufacture a semiconductor device can be used as the substrate P.

A step-and-repeat type projection exposure apparatus (stepper) in whichpatterns of a mask M are exposed at a time in a state where the mask Mand the substrate P are stopped and the substrate P is sequentiallymoved step by step can be employed as the exposure apparatus EX, inaddition to the step-and-scan type scanning exposure apparatus (scanningstepper) in which the patterns of the mask M are scanned and exposed insynchronization of the mask M and the substrate P with each other.

In the step-and-repeat type exposure, the reduced image of a firstpattern may be transferred onto the substrate P by one shot using theprojection optical system in a state where the first pattern and thesubstrate P are substantially stopped, and the reduced image of a secondpattern may then be exposed onto the substrate P by one shot using theprojection optical system to partially overlap with the first pattern ina state where the second pattern and the substrate P are substantiallystopped (stitch type one-shot exposure). A step-and-stitch type exposureapparatus in which at least two patterns are transferred to thesubstrate P to partially overlap with each other and the substrate P issequentially moved can be employed as the stitch type exposureapparatus.

For example, the invention can be applied to an exposure apparatus inwhich the patterns of two masks are combined on a substrate using aprojection optical system and one shot region on the substrate isdouble-exposed at the same time by one scanning exposure operation, asdisclosed in the specification of U.S. Pat. No. 6,611,316. The inventionmay be applied to a proximity-type exposure apparatus or amirror-projection aligner.

The invention may be applied to a twin-stage type exposure apparatushaving plural substrate stages as disclosed in the specifications ofU.S. Pat. Nos. 6,341,007, 6,208,407, and 6,262,796.

The invention may be applied to an exposure apparatus including asubstrate stage holding a substrate and a measurement stage on which asubstrate to be exposed is not held and which is provided with areference member having a reference mark and/or various photoelectricsensors, for example, as disclosed in the specification of U.S. Pat. No.6,897,963 and the specification of US Patent Application Laid-OpenPublication No. 2007/0127006. The invention may be applied to anexposure apparatus having plural substrate stages and a measurementstage.

The type of the exposure apparatus EX is not limited to the exposureapparatus used to manufacture a semiconductor device in which thesubstrate P is exposed with a pattern of the semiconductor device, butexposure apparatuses for manufacturing a liquid crystal display deviceor a display device, a thin-film magnetic head, an imaging device (CCD),a micro machine, an MEMS, a DNA chip, or a reticle or mask may beemployed.

In the above-mentioned embodiments, the ArF excimer laser is used as alight source generating an ArF excimer laser beam as the exposure lightEL, but a harmonic generator including a solid laser source such as aDFB semiconductor laser or a fiber laser, a light amplifier having afiber amplifier, and a wavelength converter and outputting a pulse beamwith a wavelength of 193 nm may be used, for example, as disclosed inthe specification of U.S. Pat. No. 7,023,610. In the above-mentionedembodiments, the illumination region and the projection region arerectangular, but may have other shapes such as an arc shape.

In the above-mentioned embodiments, a light-transmitting mask in which apredetermined light-shielding pattern (or a phase pattern or aphotosensitive pattern) is formed on a light-transmitting substrate isused, but a variable shaped mask (also referred to as an electronicmask, an active mask, or an image generator) in which a transmissivepattern or a reflective pattern or a light-emitting pattern is formed onthe basis of electronic data of the pattern to be exposed may be usedinstead of the above-mentioned mask, for example, as disclosed in thespecification of U.S. Pat. No. 6,778,257. The variable shaped maskincludes a DMD (Digital Micro-mirror Device) which a type ofnon-emission image display device (spatial light modulator). Instead ofthe variable shaped mask including the non-emission image displaydevice, a pattern forming device including a self-emission image displaydevice may be used. Examples of the self-emission image display deviceinclude a CRT (Cathode Ray Tube), an inorganic EL display, an organic ELdisplay (OLED: Organic Light Emitting Diode), an LED display, an LDdisplay, a field emission display (FED), and a plasma display panel(PDP).

In the above-mentioned embodiments, the exposure apparatus including theprojection optical system PL is exemplified, but the invention may beapplied to an exposure apparatus and an exposure method not employingthe projection optical system PL. When the projection optical system PLis not used, the exposure light is applied to a substrate through anoptical member such as a lens and an immersion space is formed in apredetermined space between the optical member and the substrate.

For example, as disclosed in the specification of PCT Publication No.2001/035168, the invention can be applied to an exposure apparatus(lithography system) exposing a substrate P with a line-and-spacepattern by forming an interference fringe on the substrate P.

As described above, the exposure apparatuses EX according to theembodiments are manufactured by combining various sub systems includingthe elements described in the appended claims so as to maintainpredetermined mechanical precision, electrical precision, and opticalprecision. To guarantee such a variety of precision, the adjustment foraccomplishing the optical precision is carried out on various opticalsystems, the adjustment for accomplishing the mechanical precision iscarried out on various mechanical systems, and the adjustment foraccomplishing the electrical precision is carried out on variouselectrical systems, before or after the combination. The combination ofvarious sub systems into the exposure apparatus includes the mechanicalconnection of various sub systems, the wiring connection of variouselectrical circuits, and piping connections of various pressure pipes.Before the combination of various sub systems into the exposureapparatus, individual combinations of the sub systems should be carriedout, of course. When the combination of various sub systems into theexposure apparatus is finished, the general adjustment is carried out toguarantee a variety of precision of the exposure apparatus as a whole.It is preferable that the exposure apparatus be manufactured in a cleanroom of which the temperature and the cleanness are managed.

A micro device such as a semiconductor device is manufactured, as shownin FIG. 28, by a step 201 of designing functions and performance of themicro device, a step 202 of producing a mask (reticle) based on the stepof design, a step 203 of manufacturing a substrate which is a basemember of the device, a substrate processing step 204 including exposingthe substrate with the exposure light using the pattern of the maskaccording to the above-mentioned embodiments and developing the exposedsubstrate, a device assembling step (including processing processes suchas a dicing process, a bonding process, and a package process) 205, andan inspection step 206.

The requirements of the above-mentioned embodiments can be suitablycombined. Some elements may not be employed. All the publications andU.S. patents on the exposure apparatuses cited in the above-mentionedembodiments and modified examples are cited herein by reference.

Reference Signs List

What is claimed is:
 1. An exposure apparatus that exposes a substrate,comprising: an optical system that includes an emission surface fromwhich an exposure light is emitted; a first immersion member having aliquid supply port and a first surface that is disposed in at least apart of a surrounding of an optical path of the exposure light emittedfrom the emission surface; a second immersion member having a secondsurface that is disposed in at least a part of a surrounding of thefirst surface and at a position lower than the first surface, the secondimmersion member being movable relative to the first immersion member; aspace portion into which a liquid can flow via a first aperture betweenthe first surface and the second surface and which is opened to theatmosphere via a second aperture different from the first aperture; anda first recovery portion that recovers at least a part of the liquidflowing into the space portion, wherein the emission surface, the firstsurface, and the second surface are opposed to the surface of thesubstrate in at least a part of the exposure of the substrate, and thesubstrate is exposed with the exposure light from the emission surfacevia the liquid between the emission surface and the surface of thesubstrate.
 2. The exposure apparatus according to claim 1, wherein thefirst recovery portion recovers the liquid overflowing from the spaceportion.
 3. The exposure apparatus according to claim 1, wherein thefirst recovery portion includes a first recess portion, which isdisposed facing upward, outside the space portion in a radial directionabout an optical axis of the optical system and recovers the liquidflowing into the first recess portion.
 4. The exposure apparatusaccording to claim 3, wherein the first recovery portion includes arecovery port that recovers the liquid flowing into the first recessportion.
 5. The exposure apparatus according to claim 4, wherein therecovery port is opposed to the bottom of the first recess portion. 6.The exposure apparatus according to claim 4, wherein the recovery portis disposed in the first recess portion.
 7. The exposure apparatusaccording to claim 6, wherein the recovery port is disposed at thebottom of the first recess portion.
 8. The exposure apparatus accordingto claim 4, further comprising a porous member disposed in the recoveryport.
 9. The exposure apparatus according to claim 8, wherein adifference in pressure between at one side and at the other side of theporous member is controlled so that only the liquid passes from one sideto the other side of the porous member.
 10. The exposure apparatusaccording to claim 4, wherein the recovery port recovers the liquidflowing into the first recess portion along with a gas.
 11. The exposureapparatus according to claim 4, wherein the second immersion memberincludes the first recess portion.
 12. The exposure apparatus accordingto claim 1, further comprising a top end portion defining a top end ofthe space portion, wherein at least a part of the first recovery portionis disposed outside the top end portion in the radial direction aboutthe optical axis of the optical system.
 13. The exposure apparatusaccording to claim 12, wherein the first recovery portion includes afirst recess portion, the bottom of which is formed lower than the topend portion, outside the top end portion in the radial direction aboutthe optical axis of the optical system and recovers the liquid flowinginto the first recess portion.
 14. The exposure apparatus according toclaim 13, wherein the first recovery portion includes a liquid guideportion extending in the radial direction about the optical axis of theoptical system from the top end portion, and wherein the first recessportion is disposed outside the liquid guide portion in the radialdirection about the optical axis of the optical system from the top endportion.
 15. The exposure apparatus according to claim 1, wherein thefirst surface and the second surface cannot recover the liquid.
 16. Theexposure apparatus according to claim 1, wherein the second surface islyophobic to the liquid.
 17. The exposure apparatus according to claim1, wherein the first aperture is opposed to the surface of the substratein at least a part of the exposure of the substrate.
 18. The exposureapparatus according to claim 1, further comprising a gas supply portdisposed in at least a part of a surrounding of the first aperture. 19.The exposure apparatus according to claim 18, wherein the gas supplyport is disposed in the second surface.
 20. The exposure apparatusaccording to claim 18, further comprising a second recess portion thatis disposed between the first aperture and the second surface, whereinthe second recess portion is opposed to the surface of the substrate inat least a part of the exposure of the substrate, and wherein the gassupply port is disposed in the inner surface defining the second recessportion and supplies the gas thereto to enhance the pressure of thesecond recess portion.
 21. The exposure apparatus according to claim 18,further comprising a suction port that is disposed outside the gassupply port in the radial direction about the optical axis of theoptical system so as to suck at least one of the liquid and the gas. 22.The exposure apparatus according to claim 1, wherein the liquid supplyport supplies the liquid to the optical path.
 23. The exposure apparatusaccording to claim 1, wherein the optical system includes an opticalmember that has the emission surface, and wherein the liquid supply portis disposed at a position opposed to a surface of the optical memberthrough which the exposure light does not pass.
 24. The exposureapparatus according to claim 23, wherein the surface of the opticalmember through which the exposure light does not pass includes a sidesurface of the optical member extending to the upside from the edge ofthe emission surface.
 25. The exposure apparatus according to claim 1,wherein the second immersion member has another supply port disposed ata position, which faces a first space facing the first surface, outsidethe first aperture in the radial direction about the optical axis of theoptical system.
 26. The exposure apparatus according to claim 1, whereinthe optical system includes an optical member that has the emissionsurface, and wherein the exposure apparatus further comprises a secondrecovery portion that recovers the liquid overflowing from a space whichfaces a side surface of the optical member extending to the upside fromthe edge of the emission surface.
 27. A device manufacturing methodcomprising: exposing a substrate using the exposure apparatus accordingto claim 1; and developing the exposed substrate.
 28. An exposureapparatus that exposes a substrate, comprising: an optical system thatincludes an emission surface from which an exposure light is emitted; afirst immersion member having a liquid supply port and a first surfacedisposed in at least a part of a surrounding of an optical path of theexposure light emitted from the emission surface; a second immersionmember which has a second surface that is disposed in at least a part ofa surrounding of the first surface, the second immersion member beingmovable relative to the first immersion member; a space portion intowhich a liquid can flow via a first aperture between the first surfaceand the second surface and which is opened to the atmosphere via asecond aperture different from the first aperture; a top end portiondefining a top end of the space portion; and a first recovery portion ofwhich at least a part is disposed outside the top end portion in aradial direction about an optical axis of the optical system and whichrecovers at least a part of the liquid flowing into the space portion,wherein the emission surface, the first surface, and the second surfaceare opposed to the surface of the substrate in at least a part of theexposure of the substrate, and the substrate is exposed with theexposure light from the emission surface via the liquid between theemission surface and the surface of the substrate.
 29. An exposureapparatus that exposes a substrate, comprising: an optical system thatincludes an emission surface from which an exposure light is emitted; aspace portion into which a liquid can flow via a first aperture disposedin at least a part of a surrounding of an optical path of the exposurelight and which is opened to the atmosphere via a second aperturedifferent from the first aperture; and a first recovery portion thatrecovers the liquid from the space portion, wherein the first recoveryportion includes a reservoir portion that collects the liquid from thespace portion so as not to return to the space portion, wherein at leasta part of the liquid on the substrate is collected in the reservoirportion via the space portion from the first aperture in at least a partof the exposure of the substrate, and wherein the substrate is exposedwith the exposure light from the emission surface via the liquid betweenthe emission surface and the surface of the substrate.
 30. The exposureapparatus according to claim 29, wherein the first recovery portionincludes a recovery port that recovers the liquid collected in thereservoir portion.
 31. The exposure apparatus according to claim 29,wherein the first aperture is opposed to the surface of the substrate inat least a part of the exposure of the substrate.
 32. A devicemanufacturing method comprising: exposing a substrate using the exposureapparatus according to claim 29; and developing the exposed substrate.33. An exposure method comprising: opposing a first surface of a firstimmersion member disposed in at least a part of a surrounding of anoptical path of an exposure light emitted from an emission surface of anoptical system to a substrate with a first gap interposed therebetweenand holding a liquid between the first surface and the substrate, thefirst immersion member having a liquid supply port; opposing a secondsurface of a second immersion member disposed in at least a part of asurrounding of the first surface to the substrate with a second gap thanthe first gap, the second immersion member being movable relative to thefirst immersion member; recovering at least a part of the liquid flowinginto a space portion, which is opened to the atmosphere via a secondaperture different from a first aperture, from the first aperturebetween the first surface and the second surface; and exposing thesubstrate with the exposure light from the emission surface via theliquid between the emission surface and the substrate.
 34. A devicemanufacturing method comprising: exposing a substrate using the exposuremethod according to claim 33; and developing the exposed substrate. 35.An exposure method comprising: opposing a first surface of a firstimmersion member disposed in at least a part of a surrounding of anoptical path of an exposure light emitted from an emission surface of anoptical system to a substrate with a first gap interposed therebetweenand holding a liquid between the first surface and the substrate, thefirst immersion member having a liquid supply port; opposing a secondsurface of a second immersion member disposed in at least a part of asurrounding of the first surface to the substrate, the second immersionmember being movable relative to the first immersion member; recoveringat least a part of the liquid flowing into a space portion, which isopened to the atmosphere via a second aperture different from a firstaperture, from the first aperture between the first surface and thesecond surface outside a top end of the space portion in the radialdirection about the optical axis of the optical system; and exposing thesubstrate with the exposure light from the emission surface via theliquid between the emission surface and the substrate.
 36. An exposuremethod comprising: filling an optical path of an exposure light betweenan emission surface of an optical system and a substrate with a liquid;exposing the substrate with the exposure light from the emission surfacevia the liquid between the emission surface and the substrate; andrecovering at least a part of the liquid on the substrate from a firstaperture disposed in at least a part of a surrounding of the opticalpath via a space portion opened to the atmosphere via a second aperturedifferent from the first aperture, wherein the recovering of at least apart of the liquid includes collecting the liquid from the space portionin a reservoir portion so that the recovered liquid does not return tothe space portion.
 37. An exposure apparatus that exposes a substrate,comprising: an optical system that includes an emission surface fromwhich an exposure light is emitted; a first surface that is disposed inat least a part of a surrounding of an optical path of the exposurelight emitted from the emission surface; a first recess portion that isdisposed in at least a part of a surrounding of the first surface; afirst gas supply port that is disposed in an inner surface defining thefirst recess portion so as to supply a gas, a space portion into whichthe liquid can flow from a first aperture between the first surface andthe first recess portion and which is opened to atmosphere via a secondaperture different from the first aperture; and a recovery portion thatrecovers at least a part of the liquid flowing into the space portion,wherein the surface of the substrate faces the emission surface, thefirst surface, and the first recess portion in at least a part of theexposure of the substrate, and the substrate is exposed with theexposure light from the emission surface via the liquid between theemission surface and the surface of the substrate.
 38. The exposureapparatus according to claim 37, further comprising a second surfacethat is disposed in at least a part of a surrounding of the first recessportion and directed in the same direction as the first surface, whereinthe surface of the substrate is opposed to the second surface in atleast a part of the exposure of the substrate.
 39. The exposureapparatus according to claim 38, wherein the second surface is disposedlower than the first surface.
 40. The exposure apparatus according toclaim 39, further comprising a second gas supply port disposed in thesecond surface.
 41. The exposure apparatus according to claim 38,wherein the second surface cannot recover the liquid.
 42. The exposureapparatus according to claim 38, wherein the second surface is lyophobicto the liquid.
 43. The exposure apparatus according to claim 37, furthercomprising a first recovery port that is disposed between the firstsurface and the first recess portion in a radial direction about anoptical axis of the optical system so as to recover the liquid.
 44. Theexposure apparatus according to claim 43, wherein the liquid isrecovered from the first recovery port by connecting the first recoveryport to a vacuum source.
 45. The exposure apparatus according to claim37, wherein the recovery portion recovers the liquid overflowing fromthe space portion.
 46. The exposure apparatus according to claim 37,further comprising a top end portion that defines a top end of the spaceportion, wherein at least a part of the recovery portion is disposedoutside the top end portion in the radial direction about the opticalaxis of the optical system.
 47. The exposure apparatus according toclaim 37, wherein the recovery portion includes a second recess portiondisposed outside the space portion in the radial direction about theoptical axis of the optical system so as to be directed to the upsideand recovers the liquid flowing into the second recess portion.
 48. Theexposure apparatus according to claim 47, wherein the recovery portionincludes a liquid guide portion extending in the radial direction aboutthe optical axis of the optical system from the top end portion definingthe top end of the space portion, and wherein the second recess portionis disposed outside the liquid guide portion in the radial directionabout the optical axis of the optical system.
 49. The exposure apparatusaccording to claim 47, wherein the recovery portion includes a secondrecovery port that recovers the liquid flowing into the second recessportion.
 50. The exposure apparatus according to claim 49, wherein thesecond recovery port is opposed to the bottom of the second recessportion.
 51. The exposure apparatus according to claim 49, wherein thesecond recovery port is disposed in the second recess portion.
 52. Theexposure apparatus according to claim 51, wherein the second recoveryport is disposed at the bottom of the second recess portion.
 53. Theexposure apparatus according to claim 49, further comprising a porousmember disposed in the second recovery port.
 54. The exposure apparatusaccording to claim 53, wherein a difference in pressure between at oneside and at the other side of the porous member is controlled so thatonly the liquid passes from one side to the other side of the porousmember.
 55. The exposure apparatus according to claim 49, wherein thesecond recovery port recovers the liquid flowing into the second recessportion along with a gas.
 56. The exposure apparatus according to claim37, further comprising a supply port that supplies the liquid to theoptical path.
 57. The exposure apparatus according to claim 56, whereinthe optical system includes an optical member having the emissionsurface, and wherein the supply port is disposed at a position opposedto a surface of the optical member through which the exposure light doesnot pass.
 58. The exposure apparatus according to claim 57, wherein thesurface of the optical member through which the exposure light does notpass includes a side surface of the optical member extending to theupside from the edge of the emission surface and/or in the radialdirection about the optical axis of the optical system.
 59. The exposureapparatus according to claim 58, wherein the optical system includes anoptical member that has the emission surface and a holding memberholding the optical member, and wherein the side surface includes atleast one of the surface of the optical member and the surface of theholding member.
 60. The exposure apparatus according to claim 56,wherein the supply port is disposed at a position, which faces a firstspace facing the first surface, outside the first surface in the radialdirection about the optical axis of the optical system.
 61. A devicemanufacturing method comprising: exposing a substrate using the exposureapparatus according to claim 37; and developing the exposed substrate.62. An exposure method comprising: causing a substrate to move so thatan emission surface of an optical system and a first surface disposed inat least a part of a surrounding of an optical path of an exposure lightemitted from the emission surface of the optical system are facing thesubstrate; supplying a gas from a first gas supply port disposed in aninner surface defining a first recess portion disposed in at least apart of a surrounding of the first surface to increase a pressure of thefirst recess portion; exposing the substrate with the exposure lightfrom the emission surface via a liquid between the emission surface andthe substrate; flowing the liquid into a space portion from a firstaperture between the first surface and the first recess portion, thespace portion being opened to atmosphere via a second aperture differentfrom the first aperture; and recoverying at least a part of the liquidflowing into the space portion, the recoverying step being performedthrough a recovery portion.
 63. A device manufacturing methodcomprising: exposing a substrate using the exposure method according toclaim 62; and developing the exposed substrate.
 64. An exposureapparatus that exposes a substrate, comprising: an optical system thatincludes an emission surface from which an exposure light is emitted; afirst surface that is disposed in at least a part of a surrounding of anoptical path of the exposure light emitted from the emission surface; asecond surface that is disposed in at least a part of a surrounding ofthe first surface; a first space portion which a side surface of theoptical system extending to the upside from the edge of the emissionsurface and/or in a radial direction about the optical axis of theoptical system faces; a second space portion into which a liquid canflow from a first aperture disposed between the first surface and thesecond surface and which is opened to the atmosphere via a secondaperture different from the first aperture; and a recovery portion ofwhich at least a part is disposed at a position opposed to the sidesurface of the optical system and which recovers at least a part of theliquid flowing into the second space portion from the first aperture viathe second aperture, wherein the optical system includes an opticalmember having the emission surface and a holding member holding theoptical member, wherein the side surface includes at least one of thesurface of the optical member and the surface of the holding member,wherein the surface of the substrate is opposed to the emission surface,the first surface, and the second surface in at least a part of theexposure of the substrate, and wherein the substrate is exposed with theexposure light from the emission surface via the liquid between theemission surface and the surface of the substrate.
 65. The exposureapparatus according to claim 64, wherein the first space portionincludes a first portion and a second portion, and wherein at least apart of the recovery portion is opposed to a side surface of the opticalsystem in the second portion.
 66. The exposure apparatus according toclaim 65, further comprising a liquid supply port facing the firstportion of the first space portion, wherein the liquid from the liquidsupply port is supplied to the optical path.
 67. The exposure apparatusaccording to claim 65, further comprising an antivibration device thatprevents at least a part of the liquid flowing into the second spaceportion from flowing from the second portion into the first portion. 68.The exposure apparatus according to claim 65, wherein the antivibrationdevice includes a wall portion having an opposing surface opposed to theside surface of the optical system, and wherein a gap between theopposing surface of the wall portion and the side surface of the opticalsystem is smaller than the gap formed in the wall portion close to thesecond portion.
 69. The exposure apparatus according to claim 68,wherein at least one of the opposing surface of the wall portion and theside surface of the optical system facing the opposed to the opposingsurface is lyophobic to the liquid.
 70. The exposure apparatus accordingto claim 65, wherein the first portion extends in the radial directionand to the upside.
 71. The exposure apparatus according to claim 64,wherein the second surface is disposed lower than the first surface. 72.The exposure apparatus according to claim 64, wherein the recoveryportion recovers the liquid overflowing from the second space portion.73. The exposure apparatus according to claim 64, further comprising atop end portion that defines a top end of the second space portion,wherein at least a part of the recovery portion is disposed outside thetop end portion in the radial direction about the optical axis of theoptical system.
 74. The exposure apparatus according to claim 64,wherein the recovery portion includes a recess portion, which isdisposed to the upside, outside the top end portion defining the top endof the second space portion in a radial direction about the optical axisof the optical system and recovers the liquid flowing into the recessportion.
 75. The exposure apparatus according to claim 74, wherein therecovery portion includes a liquid guide portion extending in the radialdirection about the optical axis of the optical system from the top endportion defining the top end of the second space portion, and whereinthe recess portion is disposed outside the liquid guide portion in theradial direction about the optical axis of the optical system from thetop end portion.
 76. The exposure apparatus according to claim 74,wherein the recess portion includes a bottom lower than the top endportion.
 77. The exposure apparatus according to claim 74, wherein therecovery portion includes a recovery port recovering the liquid flowinginto the recess portion.
 78. The exposure apparatus according to claim77, wherein the recovery port is disposed in the recess portion.
 79. Theexposure apparatus according to claim 77, wherein the recovery port isdisposed at the bottom of the recess portion.
 80. The exposure apparatusaccording to claim 77, further comprising a porous member disposed inthe recovery port.
 81. The exposure apparatus according to claim 80,wherein a difference in pressure between at one side and at the otherside of the porous member is controlled so that only the liquid passesfrom one side to the other side of the porous member.
 82. The exposureapparatus according to claim 77, wherein the recovery port recovers theliquid flowing into the recess portion along with a gas.
 83. Theexposure apparatus according to claim 64, wherein the second surface islyophobic to the liquid.
 84. The exposure apparatus according to claim64, wherein the first aperture is opposed to the surface of thesubstrate in at least a part of the exposure of the substrate.
 85. Theexposure apparatus according to claim 64, further comprising a gassupply port disposed in at least a part of a surrounding of the firstaperture.
 86. The exposure apparatus according to claim 85, wherein thegas supply port is disposed in the second surface.
 87. A devicemanufacturing method comprising: exposing a substrate using the exposureapparatus according to claim 64; and developing the exposed substrate.88. An exposure method comprising: causing a substrate to move so thatan emission surface of an optical system and a first surface disposed inat least a part of a surrounding of an optical path of an exposure lightemitted from the emission surface of the optical system are opposed tothe substrate; exposing the substrate with the exposure light from theemission surface via a liquid between the emission surface and thesurface of the substrate; and recovering at least a part of the liquidflowing into a second space portion, which is opened to the atmospherevia a second aperture different from a first aperture, from the firstaperture between the first surface and a second surface disposed in atleast a part of a surrounding of the first surface via the secondaperture by the use of a recovery portion which a side surface of theoptical system extending to the upside from the edge of the emissionsurface and/or in a radial direction about an optical axis of theoptical system faces, wherein the optical system includes an opticalmember having the emission surface and a holding member holding theoptical member, and wherein the side surface includes at least one ofthe surface of the optical member and the surface of the holding member.89. A device manufacturing method comprising: exposing a substrate usingthe exposure method according to claim 88; and developing the exposedsubstrate.